LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND REEL TYPE LED LAMPS LSE2041/TRF-X DATA SHEET DOC. NO : QW0905- LSE2041/TRF-X REV. : A DATE : 14 - Jun. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSE2041/TRF-X Page 1/6 Package Dimensions ΔH P2 H2 H1 H W2 L W0 W1 W3 P1 F D - + P T LSE2041 3.0 4.0 4.2 5.2 1.5MAX 25.0MIN □0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LSE2041/TRF-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SE Forward Current IF 20 mA Peak Forward Current Duty 1/10@10KHz IFP 80 mA Power Dissipation PD 80 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted Forward Peak Spectral voltage wave halfwidth length △λ nm @ 20mA(V) λPnm Min. Max. Min. Typ. Lens LSE2041/TRF-X GaAsP/GaP Orange Orange Transparent Luminous Viewing intensity angle @10mA(mcd) 2θ 1/2 (deg) 610 45 1.7 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 12 30 30 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSE2041/TRF-X Page 3/6 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Maximum Minimum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 4.8 0.19 5.8 0.23 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 TRF-1 17.5 0.69 19.5 0.77 TRF-2 19.0 0.75 21.0 0.83 TRF-3 22.5 0.89 24.5 0.96 TRF-4 25.5 1.0 26.5 1.04 TRF-5 21.5 0.85 22.5 0.89 20.2 0.8 21.2 0.83 TRF-7 17.125 0.67 21.125 0.83 TRF-8 20.0 0.79 22.5 0.89 TRF-9 26.0 1.02 28.0 1.1 TRF-11 24.0 0.94 26.0 1.02 TRF-12 21.0 0.83 23.0 0.91 ------- 36 1.42 11.0 0.43 Feed Hole To Bottom Of Component TRF-6 Feed Hole To Overall Component Height H1 ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 ------- W0 REMARK:TRF=Tape And Reel Forming Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T --- --- 57.2 2.25 Iside Reel Flange Thickness T1 30.0 1.18 50.0 1.97 LSE2041/TRF-X 2000PCS MARKING D3 D2 D1 D T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSE2041/TRF-X Page 4/6 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 4.8 0.19 5.8 0.23 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 TRF-13 19.0 0.75 20.0 0.79 TRF-14 21.7 0.85 23.7 0.93 TRF-15 22.5 0.89 23.5 0.93 TRF-16 17.5 0.69 18.0 TRF-17 18.5 0.73 19.5 0.77 20.5 0.81 21.5 0.85 TRF-19 25.5 1.0 27.5 1.08 TRF-20 20.5 0.81 22.5 0.89 TRF-21 25.0 0.98 27.0 1.06 TRF-22 22.0 0.87 23.0 0.91 ------- 36 1.42 11.0 0.43 Feed Hole To Bottom Of Component TRF-18 Feed Hole To Overall Component Height H1 0.71 ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 ------- W0 REMARK:TRF=Tape And Reel Forming Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T --- --- 57.2 2.25 Iside Reel Flange Thickness T1 30.0 1.18 50.0 1.97 LSE2041/TRF-X 2000PCS MARKING D3 D2 D1 D T1 T2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSE2041/TRF-X Page5/6 Typical Electro-Optical Characteristics Curve SE CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Relative Intensity@20mA 1.0 0° -30° 0.5 30° -60° 60° 0.0 550 600 650 Wavelength (nm) 700 750 100% 75% 50% 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. LSE2041/TRF-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11