LIGITEK LTD435-66-XX-KP38

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE DIGIT LED DISPLAY (0.39 Inch)
LTD435/66-XX/KP38
DATA SHEET
DOC. NO
:
QW0905- LTD435/66-XX/KP38
REV.
:
B
DATE
: 28 - Oct. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD435/66-XX/KP38
Page 1/7
Package Dimensions
30.02
(1.182")
7.0
(0.276")
L3
L1
10.0
(0.39")
DIG.1
DIG.2
L2
DIG.3
12.8
(0.504")
10.16
(0.4")
0.3TYP
LTD435/66-XX/KP38
LIGITEK
A
F
G
E
B
C
D
DP
3.8±0.5
0.5
TYP
2.54X7=17.78
(0.7")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/7
PART NO. LTD435/66-XX/KP38
Internal Circuit Diagram
LTD4356-XX/KP38
12
11
3
4
2
15
8
6
A
B
C
D
E
F
G
LTD4366-XX/KP38
DIG.1
1
DP
12
11
3
4
2
15
8
6
A
B
C
D
E
F
G
L1
L2
L2
A
B
C
D
E
F
G
14
DIG.2
5
L3
A
B
C
D
E
F
G
DP
DP
A
B
C
D
E
F
G
A
B
C
D
E
F
G
DP
DIG.3
7
1
DP
L1
L3
DIG.1
DP
14
DIG.2
5
DIG.3
7
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO. LTD435/66-XX/KP38
Electrical Connection
PIN NO.1
LTD4356-XX/KP38
LTD4366-XX/KP38
PIN NO.1
1
Common Cathode Dig.1
1
Common Anode Dig.1
2
Anode E
2
Cathode E
3
Anode C,L3
3
Cathode C,L3
4
Anode D
4
Cathode D
5
Common Cathode Dig.2
5
Common Anode Dig.2
6
Anode DP
6
Cathode DP
7
Common Cathode Dig.3
7
Common Anode Dig.3
8
Anode G
8
Cathode G
9
NO Pin
9
NO Pin
10
NO Pin
10
NO Pin
11
Anode B,L2
11
Cathode B,L2
12
Anode A,L1
12
Cathode A,L1
13
NO Pin
13
NO Pin
14
Common Cathode L1,L2,L3
14
Common Anode L1,L2,L3
15
Anode F
15
Cathode F
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD435/66-XX/KP38
Page 4/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HR
Forward Current Per Chip
IF
30
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
mA
Power Dissipation Per Chip
PD
100
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
common
cathode
Material Emitted or anode
CHIP
PART NO
Electrical
λP
(nm)
△λ
Vf(v)
(nm)
Iv(mcd)
Min.
Typ. Max. Min.
Typ.
IV-M
LTD4356-XX/KP38 GaAlAs
Red
Common
Cathode
660
20
1.5
1.8
2.4
6.1
10.5
2:1
LTD4366-XX/KP38 GaAlAs
Red
Common
Anode
660
20
1.5
1.8
2.4
6.1
10.5
2:1
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD435/66-XX/KP38
Page 5/7
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Peak Wavelength
λp
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page6/7
PART NO. LTD435/66-XX/KP38
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
3.0
Relative Intensity@20mA
1000
Forward Current(mA)
Fig.2 Relative Intensity vs. Forward Current
100
10
1.0
0.1
1.0
2.0
3.0
4.0
2.5
2.0
1.5
1.0
0.5
0
5.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Forward Voltage@20mA
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
-0
20
40
60
80
100
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
650
700
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
600
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
750
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LTD435/66-XX/KP38
Page 7/7
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11