LIGITEK LUY3133H-HV12-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
HIGH VOLTAGE LED LAMPS
Pb
Lead-Free Parts
LUY3133H/HV12-PF
DATA SHEET
DOC. NO :
QW0905-LUY3133H/HV12-PF
REV.
:
A
DATE
:
22 - May. - 2006
PART NO. LUY3133H/HV12-PF
Page 1/3
Package Dimension
Directivity Radiation
+Vcc
4.75
Vcc=12Volts
IF
0°
-30°
RL=1200ohms ±20%
RL
7.65
1.5MAX
30 °
-60 °
VF
25.0MIN
60°
IF= Vcc-VF
RL
□0.5
TYP
100% 75% 50%
2.54TYP
+
25%
0
25% 50% 75% 100%
1.0MIN
-
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
•Part Selection And Application Information (Ratings At 25℃ Ambient)
PART NO
MATERIAL
COLOR
Emitted
LUY3133H/HV12-PF AlGaInP/GaP
Dominant Spectral
wave
halfwidth
length
△λnm
λDnm
Yellow
Lens
590
Water Clear
20
Forward
current
(mA)
@12V
Luminous
lntensity
(mcd)
@12V
Reverse
current
(μA)
VR=15V
Min. Max. Min. Typ.
Max.
6.0
100
12
900 1500
Viewing
angle
2θ1/2
(deg)
30
•Absolute Maximum Rating (Ta=25℃)
RED
PARAMETER
GREEN
YELLOW
ORANGE
UNIT
UYH
Forward voltage
12
V
Reverse voltage
15
V
Operating Temperature
Storage Temperature
-40℃ TO +85℃
-40℃ TO +100 ℃
REMARK
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUY3133H/HV12-PF
Page 2/3
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/3
PART NO. LUY3133H/HV12-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11