LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only HIGH VOLTAGE LED LAMPS Pb Lead-Free Parts LUY3133H/HV12-PF DATA SHEET DOC. NO : QW0905-LUY3133H/HV12-PF REV. : A DATE : 22 - May. - 2006 PART NO. LUY3133H/HV12-PF Page 1/3 Package Dimension Directivity Radiation +Vcc 4.75 Vcc=12Volts IF 0° -30° RL=1200ohms ±20% RL 7.65 1.5MAX 30 ° -60 ° VF 25.0MIN 60° IF= Vcc-VF RL □0.5 TYP 100% 75% 50% 2.54TYP + 25% 0 25% 50% 75% 100% 1.0MIN - Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice •Part Selection And Application Information (Ratings At 25℃ Ambient) PART NO MATERIAL COLOR Emitted LUY3133H/HV12-PF AlGaInP/GaP Dominant Spectral wave halfwidth length △λnm λDnm Yellow Lens 590 Water Clear 20 Forward current (mA) @12V Luminous lntensity (mcd) @12V Reverse current (μA) VR=15V Min. Max. Min. Typ. Max. 6.0 100 12 900 1500 Viewing angle 2θ1/2 (deg) 30 •Absolute Maximum Rating (Ta=25℃) RED PARAMETER GREEN YELLOW ORANGE UNIT UYH Forward voltage 12 V Reverse voltage 15 V Operating Temperature Storage Temperature -40℃ TO +85℃ -40℃ TO +100 ℃ REMARK LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUY3133H/HV12-PF Page 2/3 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/3 PART NO. LUY3133H/HV12-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11