LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PHOTO DIODE SILICON PIN LED LAMPS Pb Lead-Free Parts LPD3330-PF DATA SHEET DOC. NO : QW0905-LPD3330-PF REV. : A DATE : 07 - Aug. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LPD3330-PF Page1/3 Package Dimension 5.0 5.9 7.6 8.6 Description The LPD3330-PF series are silicon planar P/N photodiodes incorporated in plastic package that simultaneously serve as filter and are also Transparent for infrared emission their terminals are soldering tabs arranged in 2.54mm center to center spacing due to their design the diodes can vertically be assembled on pc boards arrays can be realized by multiple arrangement versatile photodetectors are suitable for diodes as well as voltaic cell operation the signal noise ratio is particularly favorable even at low illuminance the P/N photodiode are outstanding for low junction capacitance high cut-off frequency and fast switching times. They are particularly suitable for IR sound transmission and remote control the cathode of LPD3330-PF photodiode is marked by a stamping on the package edge 1.5MAX □0.5 TYP 25.0MIN 2.54TYP 1.0MIN NOTE:1.All dimension are In millimeters tolerance Is ±0.25 unless otherwise noted 2.Specifications are subject to change without notice •MAXIMUM RATINGS (TA=25℃) Symbol Rating Reverse Break Down Voltage VBR 30 V Power Dissipation PD 150 mW Operating Temperature Topr -30 ﹣ +60 ℃ Storage Temperature Tstg -40 ﹣ +60 ℃ Characteristic nit • ELECTRICAL CHARACTERISTICS AT (TA=℃) Characteristic Symbol Dark Current ID Short Circuit Current Isc Open Circuit Voltage Voc Total Capacitance CT Peak Wavelength of Max Sensitivity Rise Time,Fall Time Test Condition VR=10V Ee=0mW/c㎡ VR=5V λP=940nm Ee=0.5mW/c㎡ λP=940nm Typ Max Unit － 1.0 30 nA 1.5 2.0 － uA _ 350 － mV － 20 － pF － 940 － nm － 50 － ns Ee=0.5mW/c㎡ VR=3V f=1MHZ Ee=0mW/c㎡ λsmax tr,tf Min VR=10V RL=1KΩ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LPD3330-PF Page 2/3 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/3 PART NO. LPD3330-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11