LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only NPN SILICON PHOTOTRANSISTOR LED LAMPS Pb Lead-Free Parts LPT2021-R-PF DATA SHEET DOC. NO : QW0905- LPT2021-R-PF REV. : A DATE : 17 - Aug. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT2021-R-PF Page 1/3 Package Dimension Features 3.0 4.2 . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter 4.0 5.2 1.5 MAX Description The LPT2021-R-PF series are silicon nitride passivated NPN planar phototransistors with exceptionally stable characteristics and high illumination sensitivity the cases of LPT2021-R-PF are encapsulated in transparent plastic T1 3/4 package individuallt 12.5MIN □0.5 TYP 1.EMITTER 2.COLLECTOR 2.3TYP 1.0MIN 2 1 Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice •MAXIMUM RATINGS(Ta=25℃) PARAMETER MAXIMUM RATINGS UNIT 100 mw Collector-Emitter Voltage 30 V Emitter-Collector Voltage 5 V Power Dissipation Operating Temperature -50℃ TO +100℃ Storage Temperature -50℃ TO +100℃ 260℃ for 5 seconds Lead Soldering Temperature(1.6mm From Body) •ELECTRICAL CHARACTERISTICS(Ta=25℃) Typ. UNIT TEST CONDITION 30 V Ic=1mA Ee=0mw/c㎡ 5 V IE=100μA Ee=0mw/c㎡ V Ic=0.5mA Ee=20mw/c㎡ PARAMETER SYMBOL Min. Collector-Emitter Breakdown Voltage V(BR)CEO Emitter-Collector Breakdown Voltage V(BR)ECO Collector-Emitter Saturation Voltage VCE(sat) Max. 0.4 Rise Time Tr 5 μs Fall Time Tf 5 μs Collector Dark Current On State Collector Current ICEO Ip(on) 100 nA 1 2 mA 2 4 mA 4 8 mA 8 mA VCE =30V IC=800μA,RL=1K Ω VCE =10V Ee=0mw/c㎡ VCE =5v Ee=1mw/c㎡ λP=940nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT2021-R-PF Page 2/3 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/3 PART NO.LPT2021-R-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11