LIGITEK LPT2021-R-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
NPN SILICON PHOTOTRANSISTOR LED LAMPS
Pb
Lead-Free Parts
LPT2021-R-PF
DATA SHEET
DOC. NO :
QW0905- LPT2021-R-PF
REV.
:
A
DATE
:
17 - Aug. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT2021-R-PF
Page 1/3
Package Dimension
Features
3.0
4.2
. High illumination sensitivity
. Stable characteristics
. Spectrally and mechanically
matched with IR emitter
4.0
5.2
1.5
MAX
Description
The LPT2021-R-PF series are silicon
nitride passivated NPN planar
phototransistors with exceptionally
stable characteristics and high
illumination sensitivity the cases of
LPT2021-R-PF are encapsulated in
transparent plastic T1 3/4 package
individuallt
12.5MIN
□0.5
TYP
1.EMITTER
2.COLLECTOR
2.3TYP 1.0MIN
2
1
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
•MAXIMUM RATINGS(Ta=25℃)
PARAMETER
MAXIMUM RATINGS
UNIT
100
mw
Collector-Emitter Voltage
30
V
Emitter-Collector Voltage
5
V
Power Dissipation
Operating Temperature
-50℃ TO +100℃
Storage Temperature
-50℃ TO +100℃
260℃ for 5 seconds
Lead Soldering Temperature(1.6mm From Body)
•ELECTRICAL CHARACTERISTICS(Ta=25℃)
Typ.
UNIT
TEST CONDITION
30
V
Ic=1mA
Ee=0mw/c㎡
5
V
IE=100μA
Ee=0mw/c㎡
V
Ic=0.5mA
Ee=20mw/c㎡
PARAMETER
SYMBOL
Min.
Collector-Emitter
Breakdown Voltage
V(BR)CEO
Emitter-Collector
Breakdown Voltage
V(BR)ECO
Collector-Emitter
Saturation Voltage
VCE(sat)
Max.
0.4
Rise Time
Tr
5
μs
Fall Time
Tf
5
μs
Collector Dark
Current
On State Collector
Current
ICEO
Ip(on)
100
nA
1
2
mA
2
4
mA
4
8
mA
8
mA
VCE =30V
IC=800μA,RL=1K Ω
VCE =10V
Ee=0mw/c㎡
VCE =5v
Ee=1mw/c㎡
λP=940nm
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT2021-R-PF
Page 2/3
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/3
PART NO.LPT2021-R-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=85 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11