LIGITEK LVIR3330

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
INFRARED EMITTING DIODES
LVIR3330
DATA SHEET
DOC. NO :
QW0905- LVIR3330
REV.
:
A
DATE
:
14 - Mar. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LVIR3330
Package Dimensions
5.0
5.9
7.6
8.6
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Features:
1. High radiant intensity.
2. Suitable for pulsed applications.
3. Low average degradation.
Descriptions:
The LVIR3330 series are high power solution grown efficiency Gallium Arsenide
infrared emitting diodes encapsulated in black plastic
T-1 3/4 package individually
Device Selection Guide:
PART NO
MATERIAL
LENS COLOR
LVIR3330
GaAIAs/GaAs
Black
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PART NO. LVIR3330
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
VIR
Forward Current
IF
50
mA
Peak Forward Current
(300PPS,1 μs Pulse)
IFP
1
A
Power Dissipation
PD
100
mW
Reverse Voltage
Vr
5
V
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +85
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Electrical Optical Characteristics (Aa=25℃)
SYMBOL
Min.
Typ.
Radiant Intensity
Le
6.0
Aperture Radiant Incidence
Ee
0.86
Peak Emission Wavelength
PARAMETER
Max.
UNIT
TEST CONDITION
12
mW/sr
IF=20mA
1.7
mW/cm
IF=20mA
λpeak
940
nm
IF=20mA
△λ
50
nm
IF=20mA
Forward Voltage
VF
1.2
1.6
V
IF=20mA
Reverse Current
IR
100
μA
VR=5V
Spectral Line Half Width
Viewing Angle
2θ1/2
2
26
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The radiant intensity data did not including ±15% testing tolerance.
deg
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PART NO. LVIR3330
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Typical Electro-Optical Characteristics Curve
VIR CHIP
1000
Forward Current [mA]
Fig.2 Relative Radian Intensity vs.wavelength
Relative Radiant Intensity
Normalize @20mA
Fig.1 Forward Current vs. DC Forward Voltage
100
10
1.0
0.1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
0.5
0.0
4.0
800
850
1050
1100
Fig.4 Relative Radiant Power
vs. Forward Peak Current
10.0
10.0
Relative Radiant Power
Normalized @ 100 mA
Fig 3. Relative Radiant Power
vs. Forward Peak Current
1.0
0.1
1.0
10
1.0
0.1
100
10
100
Fig.6 Relative Radiant Power vs. Temperature
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
Relative Radiant Power
@ 20mA, Normalize @ 25 ℃
Fig.5 Forward DC Voltage vs. Temperature
-40
1000
IFPK [mA]
IFDC [mA]
Forw ard DC Voltage @ 20 mA
Normalize @ 25℃
1000
Wavelength[nm]
Forward Voltage[V]
Relative Radiant Power
Normalized @ 20mA
900 950
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature [ ℃]
100
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PART NO. LVIR3330
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Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, require some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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PART NO. LVIR3330
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Mounting:
1. If the leads are subjected to stress during soldering
a printed circuit board, illumination failure may result
immediately or later during use. For this reason,
make sure that the intervals between the installation
holes in the board are equal to the intervals between
the leads (after forming if done) so that no stress is
applied to the lead.
(O)
(X)
(O)
2. The LED lamps are designed for high-density mounting and have a structure which can alleviate mechanical stress due to clinching . Nevertheless , take care
to avoid the occurrence of residual mechanical stress
due to clinching .
15°
45°
Anode side(cathode side on GaAlAs chips)
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PART NO. LVIR3330
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=85 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11