LYONTEK LY621024SLE

®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
REVISION HISTORY
Revision
Rev. 1.0
Rev. 1.1
Rev. 1.2
Rev. 1.3
Rev. 1.4
Rev. 1.5
Description
Issue Date
Initial Issue
Jul.25.2004
Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007
in page 8
Added SL(C-grade) Spec.
Jun.14.2007
Revised ISB/IDR(MAX.)
Aug.20.2008
Added SL(E/I-grade) Spec.
Deleted L Spec.
Revised ISB1/IDR(MAX.)
Mar.30.2009
Added ISB1/IDR values when TA = 25℃ and TA = 40℃
Revised FEATURES & ORDERING INFORMATION
Lead free and green package available to Green package
available
Added packing type in ORDERING INFORMATION
Deleted TSOLDER in ABSOLUTE MAXIMUN RATINGS
Sep.11.2009
Revised VDR
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
0
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
FEATURES
GENERAL DESCRIPTION
„ Fast access time : 35/55/70ns
„ Low power consumption:
Operating current : 24/17/15mA (TYP.)
Standby current : 2μA@5V(TYP.) LL/SL version
0.8μA@3V(TYP.) SL version
„ Single 5V power supply
„ All inputs and outputs TTL compatible
„ Fully static operation
„ Tri-state output
„ Data retention voltage : 1.5V (MIN.)
„ Green package available
„ Package : 32-pin 450 mil SOP
32-pin 600 mil P-DIP
32-pin 8mm x 20mm TSOP-I
32-pin 8mm x 13.4mm STSOP
36-ball 6mm x 8mm TFBGA
The LY621024 is a 1,048,576-bit low power CMOS
static random access memory organized as 131,072
words by 8 bits. It is fabricated using very high
performance, high reliability CMOS technology. Its
standby current is stable within the range of
operating temperature.
The LY621024 is well designed for very low power
system applications, and particularly well suited for
battery back-up nonvolatile memory application.
The LY621024 operates from a single power
supply of 5V and all inputs and outputs are fully TTL
compatible
PRODUCT FAMILY
Product
Operating
Family
Temperature
0 ~ 70℃
LY621024(LL)
LY621024(LLE) -20 ~ 80℃
-40 ~ 85℃
LY621024(LLI)
0 ~ 70℃
LY621024(SL)
LY621024(SLE) -20 ~ 80℃
-40 ~ 85℃
LY621024(SLI)
Vcc Range
Speed
4.5 ~ 5.5V
4.5 ~ 5.5V
4.5 ~ 5.5V
4.5 ~ 5.5V
4.5 ~ 5.5V
4.5 ~ 5.5V
35/55/70ns
35/55/70ns
35/55/70ns
35/55/70ns
35/55/70ns
35/55/70ns
FUNCTIONAL BLOCK DIAGRAM
PIN DESCRIPTION
Vcc
Vss
A0-A16
DECODER
DQ0-DQ7
I/O DATA
CIRCUIT
CE#
CE2
WE#
OE#
CONTROL
CIRCUIT
Power Dissipation
Standby(ISB1,TYP.)
Operating(Icc,TYP.)
2µA@5V
24/17/15mA
2µA@5V
24/17/15mA
2µA@5V
24/17/15mA
0.8µA@3V
2µA@5V
24/17/15mA
0.8µA@3V
2µA@5V
24/17/15mA
0.8µA@3V
2µA@5V
24/17/15mA
128Kx8
MEMORY ARRAY
SYMBOL
DESCRIPTION
A0 - A16
Address Inputs
DQ0 – DQ7
Data Inputs/Outputs
CE#, CE2
Chip Enable Inputs
WE#
Write Enable Input
OE#
Output Enable Input
VCC
Power Supply
VSS
Ground
NC
No Connection
COLUMN I/O
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
1
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
PIN CONFIGURATION
1
32
Vcc
2
31
A15
A14
3
30
CE2
A12
4
29
WE#
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
A3
9
A2
10
A1
11
22
CE#
A0
12
21
DQ7
DQ0
13
20
DQ6
DQ1
14
19
DQ5
DQ2
15
18
DQ4
Vss
16
17
DQ3
LY621024
NC
A16
25
A11
24
OE#
23
A10
A11
A9
A8
A13
WE#
CE2
A15
Vcc
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
LY621024
TSOP-I/STSOP
SOP/P-DIP
A
A0
A1
CE2
A3
A6
A8
B
DQ4
A2
WE#
A4
A7
DQ0
C
DQ5
NC
A5
D
Vss
Vcc
E
Vcc
Vss
F
DQ6
NC
DQ2
G
DQ7 OE# CE# A16
A15 DQ3
H
NC
A9
A10
1
2
A11
A12
3
4
TFBGA
DQ1
A13
A14
5
6
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
2
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE#
A10
CE#
DQ7
DQ6
DQ5
DQ4
DQ3
Vss
DQ2
DQ1
DQ0
A0
A1
A2
A3
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
ABSOLUTE MAXIMUN RATINGS*
PARAMETER
Voltage on VCC relative to VSS
Voltage on any other pin relative to VSS
SYMBOL
VT1
VT2
Operating Temperature
TA
Storage Temperature
Power Dissipation
DC Output Current
TSTG
PD
IOUT
RATING
-0.5 to 6.5
-0.5 to VCC+0.5
0 to 70(C grade)
-20 to 80(E grade)
-40 to 85(I grade)
-65 to 150
1
50
UNIT
V
V
℃
℃
W
mA
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability.
TRUTH TABLE
MODE
Standby
Output Disable
Read
Write
Note:
CE#
H
X
L
L
L
CE2
X
L
H
H
H
OE#
X
X
H
L
X
WE#
X
X
H
H
L
I/O OPERATION
High-Z
High-Z
High-Z
DOUT
DIN
H = VIH, L = VIL, X = Don't care.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
3
SUPPLY CURRENT
ISB1
ISB1
ICC,ICC1
ICC,ICC1
ICC,ICC1
®
LY621024
Rev. 1.5
128K X 8 BIT LOW POWER CMOS SRAM
DC ELECTRICAL CHARACTERISTICS
SYMBOL
TEST CONDITION
PARAMETER
Supply Voltage
VCC
*1
Input High Voltage
VIH
*2
Input Low Voltage
VIL
Input Leakage Current
ILI
VCC ≧ VIN ≧ VSS
Output Leakage
VCC ≧ VOUT ≧ VSS,
ILO
Current
Output Disabled
Output High Voltage
VOH IOH = -1mA
Output Low Voltage
VOL
IOL = 2mA
Cycle time = Min.
- 35
CE# = VIL and CE2 = VIH ,
ICC
- 55
II/O = 0mA
- 70
Other pins at VIL or VIH
Average Operating
Power supply Current
Cycle time = 1µs
CE# = 0.2V and CE2≧VCC-0.2V,
ICC1
II/O = 0mA
Other pins at 0.2V or VCC - 0.2V
LL
LLE/LLI
CE# ≧VCC-0.2V
*5
SL
25℃
Standby Power
or CE2≦0.2V
*5
ISB1
SLE
Supply Current
Others at 0.2V or
*5
40℃
SLI
VCC - 0.2V
SL
SLE/SLI
MIN.
4.5
2.4
- 0.2
-1
*4
MAX.
5.5
VCC+0.3
0.6
1
UNIT
V
V
V
µA
-1
-
1
µA
2.4
-
24
0.4
80
V
V
mA
-
17
60
mA
-
15
50
mA
-
2
10
mA
-
2
2
15
30
µA
µA
-
0.8
2
µA
-
1
2
µA
-
2
2
7
10
µA
µA
Notes:
1. VIH(max) = VCC + 3.0V for pulse width less than 10ns.
2. VIL(min) = VSS - 3.0V for pulse width less than 10ns.
3. Over/Undershoot specifications are characterized, not 100% tested.
4. Typical values are included for reference only and are not guaranteed or tested.
Typical values are measured at VCC = VCC(TYP.) and TA = 25℃
5. This parameter is measured at VCC = 3.0V
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
4
TYP.
5.0
-
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
CAPACITANCE (TA = 25℃, f = 1.0MHz)
PARAMETER
Input Capacitance
Input/Output Capacitance
SYMBOL
CIN
CI/O
MIN.
-
MAX
6
8
UNIT
pF
pF
Note : These parameters are guaranteed by device characterization, but not production tested.
AC TEST CONDITIONS
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Reference Levels
Output Load
0.2V to VCC - 0.2V
3ns
1.5V
CL = 50pF + 1TTL, IOH/IOL = -1mA/2mA
AC ELECTRICAL CHARACTERISTICS
(1) READ CYCLE
PARAMETER
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Access Time
Chip Enable to Output in Low-Z
Output Enable to Output in Low-Z
Chip Disable to Output in High-Z
Output Disable to Output in High-Z
Output Hold from Address Change
(2) WRITE CYCLE
PARAMETER
Write Cycle Time
Address Valid to End of Write
Chip Enable to End of Write
Address Set-up Time
Write Pulse Width
Write Recovery Time
Data to Write Time Overlap
Data Hold from End of Write Time
Output Active from End of Write
Write to Output in High-Z
SYM.
tRC
tAA
tACE
tOE
tCLZ*
tOLZ*
tCHZ*
tOHZ*
tOH
SYM.
tWC
tAW
tCW
tAS
tWP
tWR
tDW
tDH
tOW*
tWHZ*
LY621024-35
MIN.
MAX.
35
35
35
25
10
5
15
15
10
-
LY621024-55
MIN.
MAX.
55
55
55
30
10
5
20
20
10
-
LY621024-70
MIN.
MAX.
70
70
70
35
10
5
25
25
10
-
LY621024-35
MIN.
MAX.
35
30
30
0
25
0
20
0
5
15
LY621024-55
MIN.
MAX.
55
50
50
0
45
0
25
0
5
20
LY621024-70
MIN.
MAX.
70
60
60
0
55
0
30
0
5
25
*These parameters are guaranteed by device characterization, but not production tested.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
5
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
TIMING WAVEFORMS
READ CYCLE 1 (Address Controlled) (1,2)
tRC
Address
tAA
Dout
tOH
Previous Data Valid
Data Valid
READ CYCLE 2 (CE# and CE2 and OE# Controlled) (1,3,4,5)
tRC
Address
tAA
CE#
tACE
CE2
OE#
tOE
tOH
tOHZ
tCHZ
tOLZ
tCLZ
Dout
High-Z
Data Valid
High-Z
Notes :
1.WE# is high for read cycle.
2.Device is continuously selected OE# = low, CE# = low., CE2 = high.
3.Address must be valid prior to or coincident with CE# = low, CE2 = high; otherwise tAA is the limiting parameter.
4.tCLZ, tOLZ, tCHZ and tOHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state.
5.At any given temperature and voltage condition, tCHZ is less than tCLZ , tOHZ is less than tOLZ.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
6
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
WRITE CYCLE 1 (WE# Controlled) (1,2,3,5,6)
tWC
Address
tAW
CE#
tCW
CE2
tAS
tWP
tWR
WE#
tWHZ
Dout
TOW
High-Z
(4)
tDW
Din
(4)
tDH
Data Valid
WRITE CYCLE 2 (CE# and CE2 Controlled) (1,2,5,6)
tWC
Address
tAW
CE#
tAS
tWR
tCW
CE2
tWP
WE#
tWHZ
Dout
High-Z
(4)
tDW
Din
tDH
Data Valid
Notes :
1.WE#, CE# must be high or CE2 must be low during all address transitions.
2.A write occurs during the overlap of a low CE#, high CE2, low WE#.
3.During a WE#controlled write cycle with OE# low, tWP must be greater than tWHZ + tDW to allow the drivers to turn off and data to be
placed on the bus.
4.During this period, I/O pins are in the output state, and input signals must not be applied.
5.If the CE#low transition and CE2 high transition occurs simultaneously with or after WE# low transition, the outputs remain in a high
impedance state.
6.tOW and tWHZ are specified with CL = 5pF. Transition is measured ±500mV from steady state.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
7
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
DATA RETENTION CHARACTERISTICS
PARAMETER
VCC for Data Retention
Data Retention Current
Chip Disable to Data
Retention Time
Recovery Time
tRC* = Read Cycle Time
SYMBOL
TEST CONDITION
MIN.
VDR CE# ≧ VCC - 0.2V or CE2 ≦ 0.2V
1.5
LL
LLE/LLI
VCC = 1.5V
SL 25℃
CE# ≧ VCC - 0.2V
IDR
SLE
or CE2 ≦ 0.2V
40℃
Other pins at 0.2V or VCC-0.2V SLI
SL
SLE/SLI
See Data Retention
tCDR
0
Waveforms (below)
tR
tRC*
DATA RETENTION WAVEFORM
Low Vcc Data Retention Waveform (1) (CE# controlled)
VDR ≧ 1.5V
Vcc
Vcc(min.)
Vcc(min.)
tCDR
CE#
VIH
tR
VIH
CE# ≧ Vcc-0.2V
Low Vcc Data Retention Waveform (2) (CE2 controlled)
VDR ≧ 1.5V
Vcc
Vcc(min.)
Vcc(min.)
tCDR
CE2
tR
CE2 ≦ 0.2V
VIL
VIL
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
8
TYP.
0.5
0.5
MAX.
5.5
12
30
UNIT
V
µA
µA
0.4
2
µA
0.5
2
0.4
0.4
5
8
µA
µA
µA
-
-
ns
-
-
ns
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
PACKAGE OUTLINE DIMENSION
32 pin 450 mil SOP Package Outline Dimension
UNIT
SYM.
A
A1
A2
b
c
D
E
E1
e
L
L1
S
y
Θ
INCH.(BASE)
MM(REF)
0.118 (MAX)
0.004(MIN)
0.111(MAX)
0.016 +0.004
-0.002
0.008(TYP)
0.817(MAX)
0.445 ±0.005
0.555 ±0.012
0.050(TYP)
0.0347 ±0.008
0.055 ±0.008
0.026(MAX)
0.004(MAX)
o
o
0 -10
2.997 (MAX)
0.102(MIN)
2.82(MAX)
0.406 +0.102
-0.051
0.203(TYP)
20.75(MAX)
11.303 ±0.127
14.097 ±0.305
1.270(TYP)
0.881 ±0.203
1.397 ±0.203
0.660 (MAX)
0.101(MAX)
o
o
0 -10
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
9
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
32 pin 600 mil P-DIP Package Outline Dimension
UNIT
SYM.
A1
A2
B
D
E
E1
e
eB
L
S
Q1
INCH(BASE)
MM(REF)
0.001 (MIN)
0.150 ± 0.005
0.018 ± 0.005
1.650 ± 0.005
0.600 ± 0.010
0.544 ± 0.004
0.100 (TYP)
0.640 ± 0.020
0.130 ± 0.010
0.075 ± 0.010
0.070 ± 0.005
0.254 (MIN)
3.810 ± 0.127
0.457 ± 0.127
41.910 ± 0.127
15.240 ± 0.254
13.818 ± 0.102
2.540 (TYP)
16.256 ± 0.508.
3.302 ± 0.254
1.905 ± 0.254
1.778 ± 0.127
Note : D/E1/S dimension do not include mold flash.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
10
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
32 pin 8mm x 20mm TSOP-I Package Outline Dimension
UNIT
SYM.
A
A1
A2
b
c
D
E
e
HD
L
L1
y
Θ
INCH(BASE)
MM(REF)
0.047 (MAX)
0.004 ±0.002
0.039 ±0.002
0.008 + 0.002
- 0.001
0.005 (TYP)
0.724 ±0.004
0.315 ±0.004
0.020 (TYP)
0.787 ±0.008
0.0197 ±0.004
0.0315 ±0.004
0.003 (MAX)
o
o
0 ~5
1.20 (MAX)
0.10 ±0.05
1.00 ±0.05
0.20 + 0.05
-0.03
0.127 (TYP)
18.40 ±0.10
8.00 ±0.10
0.50 (TYP)
20.00 ±0.20
0.50 ±0.10
0.08 ±0.10
0.076 (MAX)
o
o
0 ~5
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
11
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
32 pin 8mm x 13.4mm STSOP Package Outline Dimension
HD
cL
12° (2x)
32
16
17
12° (2x)
b
E
e
1
"A"
Seating Plane
D
y
12° (2X)
16
17
0.254
A2
c
A
GAUGE PLANE
A1
0
SEATING PLANE
"A" DATAIL VIEW
1
32
UNIT
SYM.
A
A1
A2
b
c
D
E
e
HD
L
L1
y
Θ
INCH(BASE)
MM(REF)
0.049 (MAX)
0.005 ±0.002
0.039 ±0.002
0.008 ±0.01
0.005 (TYP)
0.465 ±0.004
0.315 ±0.004
0.020 (TYP)
0.528±0.008
0.0197 ±0.004
0.0315 ±0.004
0.003 (MAX)
o
o
0 ~5
1.25 (MAX)
0.130 ±0.05
1.00 ±0.05
0.20±0.025
0.127 (TYP)
11.80 ±0.10
8.00 ±0.10
0.50 (TYP)
13.40 ±0.20.
0.50 ±0.10
0.8 ±0.10
0.076 (MAX)
o
o
0 ~5
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
12
L
12° (2X)
L1
®
LY621024
Rev. 1.5
128K X 8 BIT LOW POWER CMOS SRAM
36 ball 6mm × 8mm TFBGA Package Outline Dimension
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
13
®
LY621024
128K X 8 BIT LOW POWER CMOS SRAM
Rev. 1.5
ORDERING INFORMATION
LY621024 U V - WW XX Y Z
Z : Packing Type
Blank : Tube or Tray
T : Tape Reel
Y : Temperature Range
Blank : (Commercial) 0°C ~ 70°C
E : (Extended) -20°C ~ +80°C
I : (Industrial) -40°C ~ +85°C
XX : Power Type
LL : Ultra Low Power
SL : Special Ultra Low Power
WW : Access Time(Speed)
V : Lead Information
L : Green Package
U : Package Type
S : 32-pin 450 mil SOP
P : 32-pin 600 mil P-DIP
L : 32-pin 8 mm x 20 mm TSOP-I
R : 32-pin 8 mm x 13.4 mm STSOP
G : 36-ball 6 mm x 8 mm TFBGA
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
14
®
LY621024
Rev. 1.5
128K X 8 BIT LOW POWER CMOS SRAM
THIS PAGE IS LEFT BLANK INTENTIONALLY.
Lyontek Inc. reserves the rights to change the specifications and products without notice.
5F, No. 2, Industry E. Rd. IX, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
15