MAS MAS6501BA1ST206

DA6501.001
27 October 2008
MAS6501
This is preliminary information on a new
product under development. Micro Analog
Systems Oy reserves the right to make any
changes without notice.
16-Bit Analog-to-Digital Converter
• Standby Current Consumption
0.1 µA
• Low Supply Current
• Low Power Consumption
• Resolution 16 Bits
• Ratiometric ∆Σ ADC
• ENOB 14 Bits
• Serial Data Output (I2C bus)
DESCRIPTION
The MAS6501 is a 16 bit Analog-to-Digital
Converter (ADC), which employs a delta-sigma (∆Σ)
conversion technique. With the linear input signal
range of 282 mVPP its resolution is 14 bits.
The MAS6501 is designed especially to
meet the requirement for low power consumption,
thus making it an ideal choice for battery powered
systems. The MAS6501 is equipped with a standby
function, i.e. the ADC is in power down between
each conversion. By utilizing this and overall low
power consumption, current consumption values of
1.6 µA (one pressure conversion in a second with
full 14-bit accuracy) or less can be achieved.
The MAS6501 has an on-chip second order
decimator filter to process the output of the second
order ∆Σ -modulator. The ADC also has two
selectable conversion ranges with two optional
offset levels.
2
A bi-directional 2-wire I C bus is used for
configuring
conversion
parameters,
starting
conversion and reading out the A/D conversion
result.
MAS6501 has one input channel suitable for
piezo resistive pressure sensor. In addition to
pressure measurement configuration the device can
be configured to temperature measurement.
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
Low Standby Current Consumption 0.1 µA Typ
Low Supply Current: 0.2 µA..1.6 µA
Supply Voltage: 2.0 V…3.6 V
Ratiometric ∆Σ Conversion
Two Input Signal Ranges (VDD=2.35V):
325 mVPP , 98 mVPP
Two Optional Offsets (VDD=2.35V):
123 mV, 33 mV
Over Sampling Ratio: 512, 256, 128, 64
Conversion Times 32.2 ms…2.5 ms
In Fast Mode: Over Sampling Ratio 64,
Conversion Time 2.5 ms, Resolution 10 Bits
Good Noise Performance due to ∆Σ
Architecture
2
2-Wire I C Interface
•
•
•
•
•
Battery Powered Systems
Low Frequency Measurement Applications
Pressure and Temperature Measurement
Current/Power Consumption Critical Systems
Industrial and Process Control Applications in
Noisy Environments
I2C is a registered trademark of Philips Inc.
1 (16)
DA6501.001
27 October 2008
BLOCK DIAGRAM
VDD
PI
S&H
NI
DIG
INT
DIG
FIL
ADC
EOC
SDA
COMMON
SCL
XCLR
GND
MCLK
Figure 1. MAS6501 block diagram
ABSOLUTE MAXIMUM RATINGS
All Voltages with Respect to Ground
Parameter
Supply Voltage
Voltage Range for All Pins
Latchup Current Limit
Junction Temperature
Storage Temperature
Symbol
Conditions
Min
Max
Unit
VCC
During conversion
No conversion
- 0.3
- 0.3
- 0.3
- 100
3.8
6.0
VIN + 0.3
+ 100
V
V
mA
- 55
+ 175
+125
°C
°C
ILUT
For all pins,
test according to
Micro Analog Systems
specification ESQ0141.
See note below.
TJmax
TS
Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not
operate under these conditions, but it will not be destroyed.
Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages
(ESD).
Note: In latchup testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed
to each input separately and device current consumption is observed. If the device current consumption increases
suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are
cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms.
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Operating Temperature
Symbol
VCC
TA
Conditions
Min
Typ
Max
Unit
2.0
-20
2.35
+25
3.6
+60
V
°C
The device performance may deteriorate in the long run if the Recommended Operation Conditions limits are continuously exceeded.
2 (16)
DA6501.001
27 October 2008
ELECTRICAL CHARACTERISTICS
TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5kΩ unless otherwise noted
Parameter
Symbol
Conditions
Average ADC Current
during Conversion Time
(see Conversion Time at
bottom)
Average ADC Current in
Pressure and Temperature
Measurement during
Conversion Period
(no sensor current
included)
ICONV
Max value at VDD = 3.6 V
IADC
Average Supply Current in
Pressure Measurement
during Conversion Period
(including sensor bridge
current)
ISAVG_P
Average Supply Current in
Temperature Measurement
(including sensor bridge
current)
ISAVG_T
ISC
1 conversion/s (conversion
period 1 s), XENMCLKDIV=1,
Rsensor = 4.5 kΩ,
Max value at VDD = 3.6 V
OSR=512
OSR=256
OSR=128
OSR=64
1 conversion/s (conversion
period 1 s), XENMCLKDIV=1,
Rsensor = 4.5 kΩ,
Max value at VDD = 3.6 V
OSR=512
OSR=256
OSR=128
OSR=64
1 conversion/s (conversion
period 1 s), XENMCLKDIV=1,
Rsensor = 4.5 kΩ,
Max value at VDD = 3.6 V
OSR=512
OSR=256
OSR=128
OSR=64
VDD = 2.35 V, Rsensor = 4.5 kΩ
ISC
VDD = 2.35 V, Rsensor = 4.5 kΩ
0.19
ISS
VDD = 2.35 V
MCLK = 32768 Hz,
XENMCLKDIV=1
OSR=512
OSR=256
OSR=128
OSR=64
0.1
Peak Supply Current
During Pressure
Measurement
Peak Supply Current
During Temperature
Measurement
Standby Current
Conversion Time
tCONV
Min
Typ
Max
Unit
30
50
µA
0.5
0.25
0.13
0.07
0.9
0.5
0.3
0.2
µA
1.6
0.8
0.5
0.3
2.5
1.3
0.7
0.4
µA
0.9
0.5
0.3
0.2
0.52
1.5
0.8
0.4
0.3
µA
16.1
8.3
4.4
2.5
mA
mA
0.5
µA
ms
Note: XENMCLKDIV refer to the I2C serial interface control bits, see table 1 on page 5.
3 (16)
DA6501.001
27 October 2008
ELECTRICAL CHARACTERISTICS
TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5kΩ unless otherwise noted
Parameter
Symbol
Conditions
Min
Resolution
Integral Nonlinearity
Differential Nonlinearity
ENOB
(Effective Number of Bits)
External Clock Signal
Delay Between End of
Conversion and ADC
Result Read-Out
Duty Cycle of MCLK
Serial Data Clock
Input Signal Conversion
Range
Linear Input Signal
Conversion Range
Output Code Values
Temperature Measurement
Resistors
Temperature Measurement
Resistors Temp Coefficient
INL
DNL
ISRLIN = 282 mV
OSR=512
OSR=256
OSR=128
OSR=64
MCLK
tDEL
DUTYC
SCL
ISR
ISRLIN
MCLK = 32768 Hz
Master Clock Division Enabled
XENMCLKDIV=0
30000
0.1
60/40
ISCR = 1
ISCR = 0
ISCR = 1
ISCR = 0
R1
R2
R3
R4
TCR
Max
16
4.9
1.5
17
5.1
4
3
ISR = 325 mV
ISR = 98 mV
ISRLIN = 282 mV, OSR = 512
ISRLIN = 85 mV, OSR = 512
Accuracy
Typ
Bit
µV
µV
LSB
LSB
14
13
12
10
32768
Bit
35000
Hz
ms
50/50
40/60
%
400
kHz
mV
325
98
282
85
0
-15%
TBD
Unit
7710
17000
3073
17000
-280
mV
65152
+15%
TBD
Ω
ppm /
°C
Note: ISCR refer to the I2C serial interface control bits, see table 1 on page 5.
TBD = To Be Defined
4 (16)
DA6501.001
27 October 2008
MAS6501 CONTROL REGISTER
Table 1. MAS6501 control register bit description
Bit Name
Description
Bit Number
7-6
OSRS(1:0)
Over Sampling Ratio
(OSR) selection
5
SCO
Start Conversion
4
PTS
3
ISCR
2
XENMCLKDIV
1
XOSENABLE
Pressure/Temperature
Selection
Input Signal
Conversion Range
Enable Master Clock
Division
Enable offset
0
OSSELECT
Offset value selection
MAS6501 has one control register for configuring
the measurement setup. See table 1 for control
register bit definitions. Control register values are
set via I2C bus.
First two OSRS bits of the control register define
four selectable over sampling ratios. The higher
OSR the better ADC accuracy but the longer
conversion time.
The SCO bit controls the A/D conversion. When
SCO = 0, no A/D conversion takes place. When
SCO = 1, the A/D converter turns on and the analog
data is being converted. Then MCLK must be
clocked at least until EOC pin goes high indicating
that conversion has been accomplished.
PTS bit selects between pressure and temperature
measurement. In temperature measurement the
sensor is connected in bridge configuration together
with four integrated resistors (see figure 3 on page 8
and resistors R1, R2, R3 and R4).
ISCR selects between two A/D conversion ranges.
The XENMCLKDIV bit controls the internal clock
frequency of MAS6501, fCLK(INT). When the bit is
Value
Function
11
01
10
00
0
1
1
0
1
0
0
1
0
1
1
0
OSR = 512
OSR = 256
OSR = 128
OSR = 64
No Conversion
Start Conversion
Pressure configuration
Temperature configuration
325 mV (282 mV linear range)
98 mV (85 mV linear range)
MCLK division enabled
MCLK division disabled
Offset enabled
Offset disabled
+123 mV
+33 mV
low, the MCLK division is enabled and the internal
clock frequency fCLK(INT) = fMCLK/2, where
fMCLK is the master clock frequency. When the
XENMCLKDIV bit is high, the MCLK division is
disabled and fCLK(INT) = fMCLK.
In the XENMCLKDIV = 1 mode the duty cycle
should be as close to 50 % as possible. In this
mode, the conversion time is made half (see page 3
conversion time values with XENMCLKDIV = 1)
compared to clock speed division mode
XENMCLKDIV = 0 whereas the resolution remains
unchanged. In XENMCLKDIV = 0 mode the
conversion time and also current consumption are
doubled but then the external master clock signal
MCLK does not need to have close to 50% duty
cycle.
XOSENABLE can be used to enable input signal
range offset option. At 1 value no offset is applied
but at 0 value an offset value which is determined
with OSSELECT bit is used.
OSSELECT selects between two offset values. No
offset
is
applied
if
offset
is
disabled
(XOSENABLE=1).
5 (16)
DA6501.001
27 October 2008
2
I C SERIAL INTERFACE CONTROL
Serial Interface
MAS6501 has two wire serial I2C bus type interface
comprising of serial clock (SCL) and serial data
(SDA) pins. I2C bus is used to write configuration
data to sensor interface IC and read the
measurement result when A/D conversion has been
finished.
Digital interface includes also master clock (MCLK),
end of conversion (EOC) and master reset (XCLR)
pins.
MLCK signal is needed to be clocked during
conversion period. It can be stopped after EOC
goes high which indicates that A/D conversion has
been accomplished. MCLK signal can also be
running all the time.
XCLR is used to reset the A/D converter. Reset
initializes internal registers and counters. After
connecting supply voltage to MAS6501 and before
starting operating the device via I2C bus it is
required to reset the device with XCLR reset pin if
supply voltage rise time has been longer than 400
ns. If the supply voltage rise time is shorter than this
the external reset with XCLR pin is unnecessary
since the device is automatically reset by power on
reset (POR) circuitry.
Device and Register Addresses
I2C bus standard makes it possible to connect
several I2C bus devices into same bus. The devices
are distinguished from each other by unique device
address codes. MAS6501 device address is shown
Table 2. MAS6501 device address
A7 A6 A5 A4 A3 A2 A1
1
1
1
0
1
1
1
W/R
0/1
MAS6501 contains three 8-bit registers which are
presented in table 3. Control register is used to
configure the device to proper measurement setup.
Table 3. MAS6501 internal register addresses
A7 A6 A5 A4 A3 A2 A1
A0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
in table 2. The LSB bit of the device address defines
whether the bus is configured to Read (1) or Write
(0) operation.
1
0
1
Control register bits are described in table 1 (page
5). Two other 8-bit registers are used to store the
16-bit A/D conversion result.
Register Description
MSB A/D Conversion Result Register
LSB A/D Conversion Result Register
Control register
6 (16)
DA6501.001
27 October 2008
2
I C SERIAL INTERFACE CONTROL...
I2C Bus Protocol Definitions
Two wire I2C bus protocol has special bus signal
conditions. Figure 2 shows start (S), stop (P) and
binary data conditions. At start condition the SCL is
high and SDA has falling edge. At stop condition the
S
SDA
SCL
1
0
SCL is also high but SDA has rising edge. Data
must be held stable in SDA pin when SCL is high.
Data can change value at SDA pin only when SCL is
low.
P
Figure 2. I2C protocol definitions
I2C contains also acknowledge (A) and not
acknowledge (N) commands. At acknowledge the
master device sends 0 bit to SDA bus (pulls down
SDA) for one SCL clock cycle. At not acknowledge
(N) the slave device sends 0 bit to SDA (pulls down
SDA) for one SCL clock cycle.
Abbreviations:
A= Acknowledge by Slave
N = Not Acknowledge by Master
S = Start
P = Stop
Conversion Starting – Write Sequence
Conversion is started by first writing measurement
configuration bits into the control register. Write
sequence is illustrated in Table 4.
To start conversion the control register SCO bit has
to be set high (SCO=1, see control register bit
description in table 1).
Table 4. MAS6501 I2C bus write sequence bits
S
AW
A
AC
A
DC
A
P
Abbreviations:
AW = Device Write Address (%1110 1110)
AR = Device Read Address (%1110 1111)
AC = Control Register Address (%1111 1111)
Ax = MSB (x=M, %1111 1101) or LSB (x=L, %1111
1110) ADC Result Register Address
Each I2C bus operation like write starts with start
command (see figure 2). After start the MAS6501
device address with write bit (AW, see table 2) is
sent and ended to acknowledge (A). After this
control register address (AC, see table 3) is sent
DC = Control Register Data
Dx = MSB (x=M) or LSB (x=L) A/D Result Register
Data
and ended to acknowledge (A). Next control register
data (DC, see table 1) is written and ended to
acknowledge (A). Finally the I2C bus operation is
ended with stop command (see figure 2).
A/D Conversion
A/D conversion is progressed by running MCLK
signal until EOC goes high indicating that
conversion is done and data is ready for reading.
7 (16)
DA6501.001
27 October 2008
2
I C SERIAL INTERFACE CONTROL...
Conversion Result – Read Sequence
Table 5 presents general control sequence for
single register data read.
Table 5. MAS6501 I2C bus single register (address Ax) read sequence bits
S
AW
A
Ax
A
S
AR
A
Dx
N
P
Table 6 presents control sequence for reading the
16-bit A/D conversion result from both MSB and
LSB data registers. LSB register data (DL) can be
read right after MSB register data (DM) read since
in case the read sequence is continued (not ended
to stop condition P) the register address is
automatically incremented to point to next register
address (in this case to point to the LSB data
register).
Table 6. MAS6501 I2C bus MSB (first) and LSB (second) A/D conversion result read sequence
S AW
A AM A S AR A DM N DL N P
Accuracy Improvement – Averaging
Averaging technique can be used to remove
conversion error caused by noise and thus improve
measurement accuracy. By accomplishing several
A/D conversions and taking average of the samples
it is possible to average out noise. Theoretically
noise is reduced by factor N where N is number
of averaged samples. A/D converter nonlinearities
cannot be removed by averaging.
8 (16)
DA6501.001
27 October 2008
APPLICATION INFORMATION
+
CVDD
VDD
R1
SENSOR
Input MUX
P
PI
Control
P
ADC
T
NI
Dig.
filter
T
R3
COMMON
GND
R4
P
2
I C
Serial
Interface
EOC
SDA
SCL
XCLR
R2
T
MCLK
MAS9185
MAS6501
T
GND
GND
Figure 3. Resistive sensor connection circuit
Together with a resistive pressure sensor,
MAS6501 can be used in pressure measurement
applications. Control can be performed with a micro2
controller through the I C serial interface.
The sensor is connected between the power supply
voltage (VDD) and MAS6501 signal ground
(COMMON) which can be internally (switch inside of
MAS6501) connected to ground (GND). Sensor
output is read as a differential signal through PI
(positive input) and NI (negative input) to the ∆Σ
converter in MAS6501.
In the pressure measurement mode, the switches
marked “P” are closed and the sensor output is fed
through to the ADC. In the temperature
measurement mode, the switches marked “T” are
closed and the voltage at the ADC input is
determined by the internal resistor array and the
temperature-dependent resistance of the sensor. In
this configuration the sensor bridge is connected as
part of single four resistor bridge circuit where other
four resistors (R1, R2, R3, R4) are inside the IC.
To guarantee conversion accuracy a supply voltage
decoupling capacitor of 4.7 µF or more should be
placed between VDD and GND of MAS6501 (see
CVDD in figure 3).
9 (16)
DA6501.001
27 October 2008
MAS6501 PAD LAYOUT
2090 µm
TE1
NI
TE2
PI
COMMON
GND
1740 µm
SCL
SDA
XCLR
MCLK
VDD
6501
EOC
6501
Die dimensions 1740 µm x 2090 µm; round PAD ∅ 80 µm
Note: Because the substrate of the die is internally connected to GND, the die has to be placed over a GND
plate on PCB or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all
component assembly are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in the center of the silicon die.
Pad Identification
Name
End of Conversion
EOC
Power Supply
VDD
Master Clock
MCLK
Clear I2C, Stop Conversion
XCLR
Serial Bus Data Input/Output
SDA
Serial Bus Clock
SCL
Supply Ground
GND
Sensor Ground
COMMON
ADC Positive Input
PI
Test Pin 2
TE2
ADC Negative Input
NI
Test Pin 1
TE1
Note: Test pins TE1 and TE2 must be left floating.
X-coordinate
Y-coordinate
-713 µm
-450 µm
-200 µm
-18 µm
318 µm
726 µm
-713 µm
-450 µm
-200 µm
-18 µm
318 µm
726 µm
-839 µm
-839 µm
-839 µm
-839 µm
-839 µm
-839 µm
839 µm
839 µm
839 µm
839 µm
839 µm
839 µm
10 (16)
DA6501.001
27 October 2008
SAMPLES IN SBDIL 20 PACKAGE
PI 1
20 TE2
19 NI
18 TE1
COMMON 2
GND 3
NC 6
NC 7
NC 8
EOC 9
VDD 10
MAS6501xx
YYWW
XXXXX.X
NC 4
NC 5
17 NC
16 NC
15 NC
14 SCL
13 SDA
12 XCLR
11 MCLK
Top Marking Definitions:
YYWW = Year Week
XXXXX.X = Lot Number
xx = Sample Version
PIN DESCRIPTION
Pin Name
Pin
Type
PI
COMMON
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
AI
AI
G
NC
NC
NC
NC
NC
DO
P
DI
DI
DI/O
DI
NC
NC
NC
DI/O
AI
DI
EOC
VDD
MCLK
XCLR
SDA
SCL
TE1
NI
TE2
Function
Notes
ADC Positive Input
Sensor Ground
Supply Ground
End of Conversion
Power Supply
Master Clock
Clear I2C, Stop Conversion
Serial Bus Data Input/Output
Serial Bus Clock
Test Pin 1
ADC Negative Input
Test Pin 2
Pin must be left floating
Pin must be left floating
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
11 (16)
DA6501.001
27 October 2008
PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE
GND
6501zz
YYWW
EOC
VDD
MCLK
XCLR
SDA
SCL
COMMON
PI
TE2
Top Marking Definitions:
NI
zz = Version
TE1
YYWW = Year Week
PIN DESCRIPTION
Pin Name
EOC
VDD
MCLK
XCLR
SDA
SCL
TE1
NI
TE2
PI
COMMON
GND
Pin
Type
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
DO
P
DI
DI
DI/O
DI
NC
DI/O
AI
DI
AI
AI
NC
G
NC
Function
Note
End of Conversion
Power Supply
Master Clock
Clear I2C, Stop Conversion
Serial Bus Data Input/Output
Serial Bus Clock
Test Pin 1
ADC Negative Input
Test Pin 2
ADC Positive Input
Sensor Ground
Pin must be left floating
Pin must be left floating
Supply Ground
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
12 (16)
DA6501.001
27 October 2008
PACKAGE (TSSOP-16) OUTLINES
C
E
D
Seating Plane
B
F
G
H
A
O
Pin 1
B
Detail A
B
L
I
I1
K
P
Section B-B
J1
M
J
Dimension
N
Min
A
B
C
D
E
F
G
H
I
I1
J
J1
K
L
M
(The length of a terminal for
soldering to a substrate)
N
O
P
Detail A
Max
6.40 BSC
4.30
4.50
5.00 BSC
0.05
0.15
1.10
0.30
0.19
0.65 BSC
0.18
0.09
0.09
0.19
0.19
0°
0.24
0.50
0.28
0.20
0.16
0.30
0.25
8°
0.26
0.75
1.00 REF
12°
12°
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
Dimensions do not include mold flash, protrusions, or gate burrs.
All dimensions are in accordance with JEDEC standard MO-153.
13 (16)
DA6501.001
27 October 2008
SOLDERING INFORMATION
◆ For Pb-Free, RoHS Compliant TSSOP-16
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
Seating Plane Co-planarity
Lead Finish
EMBOSSED TAPE SPECIFICATIONS
Tape Feed Direction
P0
D0
P2
A
E1
F1
W
D1
A
A0
P
Tape Feed Direction
T
Section A - A
B0
S1
K0
Pin 1 Designator
Dimension
Min
Max
Unit
A0
B0
D0
D1
E1
F1
K0
P
P0
P2
S1
T
W
6.50
5.20
6.70
5.40
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
1.50 +0.10 / -0.00
1.50
1.65
7.20
1.20
11.90
1.85
7.30
1.40
12.10
4.0
1.95
0.6
0.25
11.70
2.05
0.35
12.30
14 (16)
DA6501.001
27 October 2008
REEL SPECIFICATIONS
W2
A
D
C
Tape Slot for Tape Start
N
B
W1
2000 Components on Each Reel
Reel Material: Conductive, Plastic Antistatic or Static Dissipative
Carrier Tape Material: Conductive
Cover Tape Material: Static Dissipative
Carrier Tape
Cover Tape
End
Start
Trailer
Dimension
A
B
C
D
N
W1
(measured at hub)
W2
(measured at hub)
Trailer
Leader
Weight
Leader
Components
Min
1.5
12.80
20.2
50
12.4
Max
Unit
330
14.4
mm
mm
mm
mm
mm
mm
18.4
mm
13.50
160
390,
of which minimum 160
mm of empty carrier tape
sealed with cover tape
mm
mm
1500
g
15 (16)
DA6501.001
27 October 2008
ORDERING INFORMATION
Product Code
Product
Description
MAS6501BA1WA300
MAS6501BA1ST206
16-Bit A/D-Converter
16-Bit A/D-Converter
EWS-tested wafer, Thickness 400 µm.
TSSOP-16, Pb-free, RoHS compliant, Tape & Reel
Contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
Tel. +358 9 80 521
Fax +358 9 805 3213
http://www.mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
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