DA6501.001 27 October 2008 MAS6501 This is preliminary information on a new product under development. Micro Analog Systems Oy reserves the right to make any changes without notice. 16-Bit Analog-to-Digital Converter • Standby Current Consumption 0.1 µA • Low Supply Current • Low Power Consumption • Resolution 16 Bits • Ratiometric ∆Σ ADC • ENOB 14 Bits • Serial Data Output (I2C bus) DESCRIPTION The MAS6501 is a 16 bit Analog-to-Digital Converter (ADC), which employs a delta-sigma (∆Σ) conversion technique. With the linear input signal range of 282 mVPP its resolution is 14 bits. The MAS6501 is designed especially to meet the requirement for low power consumption, thus making it an ideal choice for battery powered systems. The MAS6501 is equipped with a standby function, i.e. the ADC is in power down between each conversion. By utilizing this and overall low power consumption, current consumption values of 1.6 µA (one pressure conversion in a second with full 14-bit accuracy) or less can be achieved. The MAS6501 has an on-chip second order decimator filter to process the output of the second order ∆Σ -modulator. The ADC also has two selectable conversion ranges with two optional offset levels. 2 A bi-directional 2-wire I C bus is used for configuring conversion parameters, starting conversion and reading out the A/D conversion result. MAS6501 has one input channel suitable for piezo resistive pressure sensor. In addition to pressure measurement configuration the device can be configured to temperature measurement. FEATURES APPLICATIONS • • • • • • • • • • • Low Standby Current Consumption 0.1 µA Typ Low Supply Current: 0.2 µA..1.6 µA Supply Voltage: 2.0 V…3.6 V Ratiometric ∆Σ Conversion Two Input Signal Ranges (VDD=2.35V): 325 mVPP , 98 mVPP Two Optional Offsets (VDD=2.35V): 123 mV, 33 mV Over Sampling Ratio: 512, 256, 128, 64 Conversion Times 32.2 ms…2.5 ms In Fast Mode: Over Sampling Ratio 64, Conversion Time 2.5 ms, Resolution 10 Bits Good Noise Performance due to ∆Σ Architecture 2 2-Wire I C Interface • • • • • Battery Powered Systems Low Frequency Measurement Applications Pressure and Temperature Measurement Current/Power Consumption Critical Systems Industrial and Process Control Applications in Noisy Environments I2C is a registered trademark of Philips Inc. 1 (16) DA6501.001 27 October 2008 BLOCK DIAGRAM VDD PI S&H NI DIG INT DIG FIL ADC EOC SDA COMMON SCL XCLR GND MCLK Figure 1. MAS6501 block diagram ABSOLUTE MAXIMUM RATINGS All Voltages with Respect to Ground Parameter Supply Voltage Voltage Range for All Pins Latchup Current Limit Junction Temperature Storage Temperature Symbol Conditions Min Max Unit VCC During conversion No conversion - 0.3 - 0.3 - 0.3 - 100 3.8 6.0 VIN + 0.3 + 100 V V mA - 55 + 175 +125 °C °C ILUT For all pins, test according to Micro Analog Systems specification ESQ0141. See note below. TJmax TS Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not operate under these conditions, but it will not be destroyed. Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static voltages (ESD). Note: In latchup testing the supply voltages are connected normally to the tested device. Then pulsed test current is fed to each input separately and device current consumption is observed. If the device current consumption increases suddenly due to test current pulses and the abnormally high current consumption continues after test current pulses are cut off then the device has gone to latch up. Current pulse is turned on for 10 ms and off for 20 ms. RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Operating Temperature Symbol VCC TA Conditions Min Typ Max Unit 2.0 -20 2.35 +25 3.6 +60 V °C The device performance may deteriorate in the long run if the Recommended Operation Conditions limits are continuously exceeded. 2 (16) DA6501.001 27 October 2008 ELECTRICAL CHARACTERISTICS TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5kΩ unless otherwise noted Parameter Symbol Conditions Average ADC Current during Conversion Time (see Conversion Time at bottom) Average ADC Current in Pressure and Temperature Measurement during Conversion Period (no sensor current included) ICONV Max value at VDD = 3.6 V IADC Average Supply Current in Pressure Measurement during Conversion Period (including sensor bridge current) ISAVG_P Average Supply Current in Temperature Measurement (including sensor bridge current) ISAVG_T ISC 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 kΩ, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 kΩ, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 1 conversion/s (conversion period 1 s), XENMCLKDIV=1, Rsensor = 4.5 kΩ, Max value at VDD = 3.6 V OSR=512 OSR=256 OSR=128 OSR=64 VDD = 2.35 V, Rsensor = 4.5 kΩ ISC VDD = 2.35 V, Rsensor = 4.5 kΩ 0.19 ISS VDD = 2.35 V MCLK = 32768 Hz, XENMCLKDIV=1 OSR=512 OSR=256 OSR=128 OSR=64 0.1 Peak Supply Current During Pressure Measurement Peak Supply Current During Temperature Measurement Standby Current Conversion Time tCONV Min Typ Max Unit 30 50 µA 0.5 0.25 0.13 0.07 0.9 0.5 0.3 0.2 µA 1.6 0.8 0.5 0.3 2.5 1.3 0.7 0.4 µA 0.9 0.5 0.3 0.2 0.52 1.5 0.8 0.4 0.3 µA 16.1 8.3 4.4 2.5 mA mA 0.5 µA ms Note: XENMCLKDIV refer to the I2C serial interface control bits, see table 1 on page 5. 3 (16) DA6501.001 27 October 2008 ELECTRICAL CHARACTERISTICS TA = -20oC to +60oC, Typ TA = 25oC, VDD = 2.35 V, Rsensor = 4.5kΩ unless otherwise noted Parameter Symbol Conditions Min Resolution Integral Nonlinearity Differential Nonlinearity ENOB (Effective Number of Bits) External Clock Signal Delay Between End of Conversion and ADC Result Read-Out Duty Cycle of MCLK Serial Data Clock Input Signal Conversion Range Linear Input Signal Conversion Range Output Code Values Temperature Measurement Resistors Temperature Measurement Resistors Temp Coefficient INL DNL ISRLIN = 282 mV OSR=512 OSR=256 OSR=128 OSR=64 MCLK tDEL DUTYC SCL ISR ISRLIN MCLK = 32768 Hz Master Clock Division Enabled XENMCLKDIV=0 30000 0.1 60/40 ISCR = 1 ISCR = 0 ISCR = 1 ISCR = 0 R1 R2 R3 R4 TCR Max 16 4.9 1.5 17 5.1 4 3 ISR = 325 mV ISR = 98 mV ISRLIN = 282 mV, OSR = 512 ISRLIN = 85 mV, OSR = 512 Accuracy Typ Bit µV µV LSB LSB 14 13 12 10 32768 Bit 35000 Hz ms 50/50 40/60 % 400 kHz mV 325 98 282 85 0 -15% TBD Unit 7710 17000 3073 17000 -280 mV 65152 +15% TBD Ω ppm / °C Note: ISCR refer to the I2C serial interface control bits, see table 1 on page 5. TBD = To Be Defined 4 (16) DA6501.001 27 October 2008 MAS6501 CONTROL REGISTER Table 1. MAS6501 control register bit description Bit Name Description Bit Number 7-6 OSRS(1:0) Over Sampling Ratio (OSR) selection 5 SCO Start Conversion 4 PTS 3 ISCR 2 XENMCLKDIV 1 XOSENABLE Pressure/Temperature Selection Input Signal Conversion Range Enable Master Clock Division Enable offset 0 OSSELECT Offset value selection MAS6501 has one control register for configuring the measurement setup. See table 1 for control register bit definitions. Control register values are set via I2C bus. First two OSRS bits of the control register define four selectable over sampling ratios. The higher OSR the better ADC accuracy but the longer conversion time. The SCO bit controls the A/D conversion. When SCO = 0, no A/D conversion takes place. When SCO = 1, the A/D converter turns on and the analog data is being converted. Then MCLK must be clocked at least until EOC pin goes high indicating that conversion has been accomplished. PTS bit selects between pressure and temperature measurement. In temperature measurement the sensor is connected in bridge configuration together with four integrated resistors (see figure 3 on page 8 and resistors R1, R2, R3 and R4). ISCR selects between two A/D conversion ranges. The XENMCLKDIV bit controls the internal clock frequency of MAS6501, fCLK(INT). When the bit is Value Function 11 01 10 00 0 1 1 0 1 0 0 1 0 1 1 0 OSR = 512 OSR = 256 OSR = 128 OSR = 64 No Conversion Start Conversion Pressure configuration Temperature configuration 325 mV (282 mV linear range) 98 mV (85 mV linear range) MCLK division enabled MCLK division disabled Offset enabled Offset disabled +123 mV +33 mV low, the MCLK division is enabled and the internal clock frequency fCLK(INT) = fMCLK/2, where fMCLK is the master clock frequency. When the XENMCLKDIV bit is high, the MCLK division is disabled and fCLK(INT) = fMCLK. In the XENMCLKDIV = 1 mode the duty cycle should be as close to 50 % as possible. In this mode, the conversion time is made half (see page 3 conversion time values with XENMCLKDIV = 1) compared to clock speed division mode XENMCLKDIV = 0 whereas the resolution remains unchanged. In XENMCLKDIV = 0 mode the conversion time and also current consumption are doubled but then the external master clock signal MCLK does not need to have close to 50% duty cycle. XOSENABLE can be used to enable input signal range offset option. At 1 value no offset is applied but at 0 value an offset value which is determined with OSSELECT bit is used. OSSELECT selects between two offset values. No offset is applied if offset is disabled (XOSENABLE=1). 5 (16) DA6501.001 27 October 2008 2 I C SERIAL INTERFACE CONTROL Serial Interface MAS6501 has two wire serial I2C bus type interface comprising of serial clock (SCL) and serial data (SDA) pins. I2C bus is used to write configuration data to sensor interface IC and read the measurement result when A/D conversion has been finished. Digital interface includes also master clock (MCLK), end of conversion (EOC) and master reset (XCLR) pins. MLCK signal is needed to be clocked during conversion period. It can be stopped after EOC goes high which indicates that A/D conversion has been accomplished. MCLK signal can also be running all the time. XCLR is used to reset the A/D converter. Reset initializes internal registers and counters. After connecting supply voltage to MAS6501 and before starting operating the device via I2C bus it is required to reset the device with XCLR reset pin if supply voltage rise time has been longer than 400 ns. If the supply voltage rise time is shorter than this the external reset with XCLR pin is unnecessary since the device is automatically reset by power on reset (POR) circuitry. Device and Register Addresses I2C bus standard makes it possible to connect several I2C bus devices into same bus. The devices are distinguished from each other by unique device address codes. MAS6501 device address is shown Table 2. MAS6501 device address A7 A6 A5 A4 A3 A2 A1 1 1 1 0 1 1 1 W/R 0/1 MAS6501 contains three 8-bit registers which are presented in table 3. Control register is used to configure the device to proper measurement setup. Table 3. MAS6501 internal register addresses A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 in table 2. The LSB bit of the device address defines whether the bus is configured to Read (1) or Write (0) operation. 1 0 1 Control register bits are described in table 1 (page 5). Two other 8-bit registers are used to store the 16-bit A/D conversion result. Register Description MSB A/D Conversion Result Register LSB A/D Conversion Result Register Control register 6 (16) DA6501.001 27 October 2008 2 I C SERIAL INTERFACE CONTROL... I2C Bus Protocol Definitions Two wire I2C bus protocol has special bus signal conditions. Figure 2 shows start (S), stop (P) and binary data conditions. At start condition the SCL is high and SDA has falling edge. At stop condition the S SDA SCL 1 0 SCL is also high but SDA has rising edge. Data must be held stable in SDA pin when SCL is high. Data can change value at SDA pin only when SCL is low. P Figure 2. I2C protocol definitions I2C contains also acknowledge (A) and not acknowledge (N) commands. At acknowledge the master device sends 0 bit to SDA bus (pulls down SDA) for one SCL clock cycle. At not acknowledge (N) the slave device sends 0 bit to SDA (pulls down SDA) for one SCL clock cycle. Abbreviations: A= Acknowledge by Slave N = Not Acknowledge by Master S = Start P = Stop Conversion Starting – Write Sequence Conversion is started by first writing measurement configuration bits into the control register. Write sequence is illustrated in Table 4. To start conversion the control register SCO bit has to be set high (SCO=1, see control register bit description in table 1). Table 4. MAS6501 I2C bus write sequence bits S AW A AC A DC A P Abbreviations: AW = Device Write Address (%1110 1110) AR = Device Read Address (%1110 1111) AC = Control Register Address (%1111 1111) Ax = MSB (x=M, %1111 1101) or LSB (x=L, %1111 1110) ADC Result Register Address Each I2C bus operation like write starts with start command (see figure 2). After start the MAS6501 device address with write bit (AW, see table 2) is sent and ended to acknowledge (A). After this control register address (AC, see table 3) is sent DC = Control Register Data Dx = MSB (x=M) or LSB (x=L) A/D Result Register Data and ended to acknowledge (A). Next control register data (DC, see table 1) is written and ended to acknowledge (A). Finally the I2C bus operation is ended with stop command (see figure 2). A/D Conversion A/D conversion is progressed by running MCLK signal until EOC goes high indicating that conversion is done and data is ready for reading. 7 (16) DA6501.001 27 October 2008 2 I C SERIAL INTERFACE CONTROL... Conversion Result – Read Sequence Table 5 presents general control sequence for single register data read. Table 5. MAS6501 I2C bus single register (address Ax) read sequence bits S AW A Ax A S AR A Dx N P Table 6 presents control sequence for reading the 16-bit A/D conversion result from both MSB and LSB data registers. LSB register data (DL) can be read right after MSB register data (DM) read since in case the read sequence is continued (not ended to stop condition P) the register address is automatically incremented to point to next register address (in this case to point to the LSB data register). Table 6. MAS6501 I2C bus MSB (first) and LSB (second) A/D conversion result read sequence S AW A AM A S AR A DM N DL N P Accuracy Improvement – Averaging Averaging technique can be used to remove conversion error caused by noise and thus improve measurement accuracy. By accomplishing several A/D conversions and taking average of the samples it is possible to average out noise. Theoretically noise is reduced by factor N where N is number of averaged samples. A/D converter nonlinearities cannot be removed by averaging. 8 (16) DA6501.001 27 October 2008 APPLICATION INFORMATION + CVDD VDD R1 SENSOR Input MUX P PI Control P ADC T NI Dig. filter T R3 COMMON GND R4 P 2 I C Serial Interface EOC SDA SCL XCLR R2 T MCLK MAS9185 MAS6501 T GND GND Figure 3. Resistive sensor connection circuit Together with a resistive pressure sensor, MAS6501 can be used in pressure measurement applications. Control can be performed with a micro2 controller through the I C serial interface. The sensor is connected between the power supply voltage (VDD) and MAS6501 signal ground (COMMON) which can be internally (switch inside of MAS6501) connected to ground (GND). Sensor output is read as a differential signal through PI (positive input) and NI (negative input) to the ∆Σ converter in MAS6501. In the pressure measurement mode, the switches marked “P” are closed and the sensor output is fed through to the ADC. In the temperature measurement mode, the switches marked “T” are closed and the voltage at the ADC input is determined by the internal resistor array and the temperature-dependent resistance of the sensor. In this configuration the sensor bridge is connected as part of single four resistor bridge circuit where other four resistors (R1, R2, R3, R4) are inside the IC. To guarantee conversion accuracy a supply voltage decoupling capacitor of 4.7 µF or more should be placed between VDD and GND of MAS6501 (see CVDD in figure 3). 9 (16) DA6501.001 27 October 2008 MAS6501 PAD LAYOUT 2090 µm TE1 NI TE2 PI COMMON GND 1740 µm SCL SDA XCLR MCLK VDD 6501 EOC 6501 Die dimensions 1740 µm x 2090 µm; round PAD ∅ 80 µm Note: Because the substrate of the die is internally connected to GND, the die has to be placed over a GND plate on PCB or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in the center of the silicon die. Pad Identification Name End of Conversion EOC Power Supply VDD Master Clock MCLK Clear I2C, Stop Conversion XCLR Serial Bus Data Input/Output SDA Serial Bus Clock SCL Supply Ground GND Sensor Ground COMMON ADC Positive Input PI Test Pin 2 TE2 ADC Negative Input NI Test Pin 1 TE1 Note: Test pins TE1 and TE2 must be left floating. X-coordinate Y-coordinate -713 µm -450 µm -200 µm -18 µm 318 µm 726 µm -713 µm -450 µm -200 µm -18 µm 318 µm 726 µm -839 µm -839 µm -839 µm -839 µm -839 µm -839 µm 839 µm 839 µm 839 µm 839 µm 839 µm 839 µm 10 (16) DA6501.001 27 October 2008 SAMPLES IN SBDIL 20 PACKAGE PI 1 20 TE2 19 NI 18 TE1 COMMON 2 GND 3 NC 6 NC 7 NC 8 EOC 9 VDD 10 MAS6501xx YYWW XXXXX.X NC 4 NC 5 17 NC 16 NC 15 NC 14 SCL 13 SDA 12 XCLR 11 MCLK Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number xx = Sample Version PIN DESCRIPTION Pin Name Pin Type PI COMMON GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 AI AI G NC NC NC NC NC DO P DI DI DI/O DI NC NC NC DI/O AI DI EOC VDD MCLK XCLR SDA SCL TE1 NI TE2 Function Notes ADC Positive Input Sensor Ground Supply Ground End of Conversion Power Supply Master Clock Clear I2C, Stop Conversion Serial Bus Data Input/Output Serial Bus Clock Test Pin 1 ADC Negative Input Test Pin 2 Pin must be left floating Pin must be left floating A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected 11 (16) DA6501.001 27 October 2008 PIN CONFIGURATION & TOP MARKING FOR PLASTIC TSSOP-16 PACKAGE GND 6501zz YYWW EOC VDD MCLK XCLR SDA SCL COMMON PI TE2 Top Marking Definitions: NI zz = Version TE1 YYWW = Year Week PIN DESCRIPTION Pin Name EOC VDD MCLK XCLR SDA SCL TE1 NI TE2 PI COMMON GND Pin Type 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC DO P DI DI DI/O DI NC DI/O AI DI AI AI NC G NC Function Note End of Conversion Power Supply Master Clock Clear I2C, Stop Conversion Serial Bus Data Input/Output Serial Bus Clock Test Pin 1 ADC Negative Input Test Pin 2 ADC Positive Input Sensor Ground Pin must be left floating Pin must be left floating Supply Ground A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected 12 (16) DA6501.001 27 October 2008 PACKAGE (TSSOP-16) OUTLINES C E D Seating Plane B F G H A O Pin 1 B Detail A B L I I1 K P Section B-B J1 M J Dimension N Min A B C D E F G H I I1 J J1 K L M (The length of a terminal for soldering to a substrate) N O P Detail A Max 6.40 BSC 4.30 4.50 5.00 BSC 0.05 0.15 1.10 0.30 0.19 0.65 BSC 0.18 0.09 0.09 0.19 0.19 0° 0.24 0.50 0.28 0.20 0.16 0.30 0.25 8° 0.26 0.75 1.00 REF 12° 12° Unit mm mm mm mm mm mm mm mm mm mm mm mm mm mm mm Dimensions do not include mold flash, protrusions, or gate burrs. All dimensions are in accordance with JEDEC standard MO-153. 13 (16) DA6501.001 27 October 2008 SOLDERING INFORMATION ◆ For Pb-Free, RoHS Compliant TSSOP-16 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile According to RSH test IEC 68-2-58/20 260°C 3 Thermal profile parameters stated in IPC/JEDEC J-STD-020 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 µm, material Matte Tin Seating Plane Co-planarity Lead Finish EMBOSSED TAPE SPECIFICATIONS Tape Feed Direction P0 D0 P2 A E1 F1 W D1 A A0 P Tape Feed Direction T Section A - A B0 S1 K0 Pin 1 Designator Dimension Min Max Unit A0 B0 D0 D1 E1 F1 K0 P P0 P2 S1 T W 6.50 5.20 6.70 5.40 mm mm mm mm mm mm mm mm mm mm mm mm mm 1.50 +0.10 / -0.00 1.50 1.65 7.20 1.20 11.90 1.85 7.30 1.40 12.10 4.0 1.95 0.6 0.25 11.70 2.05 0.35 12.30 14 (16) DA6501.001 27 October 2008 REEL SPECIFICATIONS W2 A D C Tape Slot for Tape Start N B W1 2000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative Carrier Tape Cover Tape End Start Trailer Dimension A B C D N W1 (measured at hub) W2 (measured at hub) Trailer Leader Weight Leader Components Min 1.5 12.80 20.2 50 12.4 Max Unit 330 14.4 mm mm mm mm mm mm 18.4 mm 13.50 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape mm mm 1500 g 15 (16) DA6501.001 27 October 2008 ORDERING INFORMATION Product Code Product Description MAS6501BA1WA300 MAS6501BA1ST206 16-Bit A/D-Converter 16-Bit A/D-Converter EWS-tested wafer, Thickness 400 µm. TSSOP-16, Pb-free, RoHS compliant, Tape & Reel Contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 16 (16)