DATA SHEET Solid State Relay OCMOS FET PS7801-1A 4-PIN ULTRA SMALL FLAT-LEAD, LOW OUTPUT CAPACITANCE 1-ch Optical Coupled MOS FET −NEPOC Series− DESCRIPTION The PS7801-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the PS72xx series. It is suitable for high-frequency signal control, due to its low C × R, low output capacitance, and low off-state leakage current. FEATURES • Ultra small flat-lead package (4.2 (L) × 2.5 (W) × 1.85 (H) mm) • Low C × R (C × R = 12.6 pF • Ω) • Low output capacitance (Cout = 1.2 pF TYP.) • 1 channel type (1 a output) • Designed for AC/DC switching line changer • Low offset voltage • Ordering number of taping product: PS7801-1A-F3, F4: 3 500 pcs/reel <R> • Pb-Free product <R> • Safety standards • UL approved: File No. E72422 APPLICATIONS • Measurement equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10264EJ03V0DS (3rd edition) Date Published September 2006 NS CP(K) Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2003, 2006 PS7801-1A PACKAGE DIMENSIONS (UNIT: mm) 2.5±0.3 0.2 MAX. TOP VIEW 3 4 3.6 +0.3 –0.4 1 1 2 3.0 MAX. 0.36 0.15 +0.1 –0.05 1.85±0.05 4.6±0.2 0.4±0.1 0.2±0.1 1.27 <R> MARKING EXAMPLE 01 N 601 No.1 pin mark (Nicked corner) Last number of type No. : 01 *1 *2 An initial of "NEC" Assembly lot 6 01 (Marking details) Week assembled Year assembled *1 The marking corresponds to the last two digits of the part number below. PS7801-1A *2 Bar : Pb-Free 2 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 0.2±0.1 N 4.2±0.2 4 Data Sheet PN10264EJ03V0DS 2 PS7801-1A <R> ORDERING INFORMATION Part Number Solder Plating Specification Order Number PS7801-1A PS7801-1A-A PS7801-1A-F3 PS7801-1A-F3-A PS7801-1A-F4 PS7801-1A-F4-A Safety Standard Approval Packing Style Pb-Free 50 pcs (Tape 50 pcs cut) Standard products Embossed Tape 3 500 pcs/reel (UL approved) Application *1 Part Number PS7801-1A *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A Break Down Voltage VL 40 V Continuous Load Current IL 100 mA ILP 200 mA PD 250 mW BV 500 Vr.m.s. Total Power Dissipation PT 300 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C Diode Power Dissipation Peak Forward Current MOS FET Pulse Load Current *1 *2 (AC/DC Connection) Power Dissipation Isolation Voltage *3 *1 PW = 100 µs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 2 5 20 mA LED Off Voltage VF 0 0.5 V Data Sheet PN10264EJ03V0DS 3 PS7801-1A ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Coupled Symbol Conditions MIN. TYP. MAX. Unit 1.1 1.4 V 5.0 µA 1 nA Forward Voltage VF IF = 5 mA Reverse Current IR VR = 5 V Off-state Leakage Current ILoff VD = 40 V 0.1 Output Capacitance Cout VD = 0 V, f = 1 MHz 1.2 LED On-state Current IFon IL = 100 mA On-state Resistance Ron1 IF = 5 mA, IL = 10 mA pF 2.0 mA 10.5 14 Ω Ron2 IF = 5 mA, IL = 100 mA, t ≤ 10 ms 11.5 15 Turn-on Time *1, 2 ton IF = 5 mA, VO = 5 V, RL = 500 Ω, 0.02 0.5 Turn-off Time *1, 2 toff PW ≥ 10 ms 0.15 1.0 Isolation Resistance RI-O VI-O = 0.5 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz 10 ms Ω 9 0.3 pF *1 Test Circuit for Switching Time IF Pulse Input VL 50% Input 0 VO = 5 V Input monitor 90% VO monitor Output Rin RL 10% ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. 4 Data Sheet PN10264EJ03V0DS PS7801-1A TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 150 Maximum Load Current IL (mA) Maximum Forward Current IF (mA) 100 80 60 40 20 0 –25 0 25 50 75 85 100 50 0 –25 100 0 25 50 75 85 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 100 5.0 1.6 1.4 IF = 50 mA 30 mA 20 mA 10 mA 1.2 5 mA 1 mA 1.0 0.8 –25 0 25 50 Output Capacitance Cout (pF) Forward Voltage VF (V) f = 1 MHz 3.0 2.0 1.0 0 100 75 4.0 10 20 30 60 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE LOAD CURRENT vs. LOAD VOLTAGE 10–7 VD = 40 V IF = 5 mA 200 –8 10 Load Current IL (mA) Off-state Leakage Current ILoff (A) 50 40 10–9 10–10 10 –11 100 –2.0 –1.0 1.0 0 2.0 –100 10–12 –200 10 –13 0 20 40 60 80 100 Ambient Temperature TA (˚C) Load Voltage VL (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10264EJ03V0DS 5 PS7801-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 60 Normalized to 1.0 at TA = 25˚C, IF = 5 mA, IL = 10 mA 2.5 2.0 1.5 1.0 n = 50 pcs, IF = 5 mA, IL = 10 mA 50 Number (pcs) Normalized On-state Resistance Ron 3.0 0.5 40 30 20 10 0.0 –25 0 25 50 0 100 75 9.5 10.0 10.5 11.0 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT TURN-OFF TIME vs. FORWARD CURRENT 0.10 0.5 0.08 Turn-off Time toff (ms) Turn-on Time ton (ms) VO = 5 V, RL = 500 Ω 0.06 0.04 0.02 0 5 10 15 20 0.2 0.1 5 10 15 25 20 Forward Current IF (mA) TURN-ON TIME DISTRIBUTION TURN-OFF TIME DISTRIBUTION 60 n = 50 pcs, IF = 5 mA, VO = 5 V, RL = 500 Ω 40 30 20 10 40 30 20 10 0.01 0.02 0.03 0.04 0 0.05 0.05 0.10 0.15 0.20 Turn-off Time toff (ms) Turn-on Time ton (ms) Remark The graphs indicate nominal characteristics. Data Sheet PN10264EJ03V0DS 30 n = 50 pcs, IF = 5 mA, VO = 5 V, RL = 500 Ω 50 Number (pcs) Number (pcs) 0.3 Forward Current IF (mA) 50 0 VO = 5 V, RL = 500 Ω 0.4 0 30 25 60 6 11.5 0.25 PS7801-1A NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 Normalized to 1.0 at TA = 25˚C, 2.5 IF = 5 mA, VO = 5 V, RL = 500 Ω 2.0 Normalized Turn-off Time toff Normalized Turn-on Time ton 3.0 1.5 1.0 0.5 0.0 –25 0 25 50 75 100 Normalized to 1.0 at TA = 25˚C, IF = 5 mA, VO = 5 V, RL = 500 Ω 2.5 2.0 1.5 1.0 0.5 0.0 –25 Ambient Temperature TA (˚C) 0 25 50 75 100 Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet PN10264EJ03V0DS 7 PS7801-1A TAPING SPECIFICATIONS (UNIT: mm) 1.5+0.1 –0 2.9 MAX. 12.0±0.2 5.5±0.05 4.0±0.1 5.3±0.1 2.0±0.05 1.75±0.1 Outline and Dimensions (Tape) 0.3 1.55±0.05 2.4±0.1 2.9±0.1 4.0±0.1 Tape Direction PS7801-1A-F4 PS7801-1A-F3 N N N N N N N N Outline and Dimensions (Reel) R 1.0 φ 21.0±0.8 φ13.0±0.2 2.0±0.5 φ13.0±0.2 φ 330±2.0 φ 100±1.0 2.0±0.5 13.5±1.0 17.5±1.0 Packing: 3 500 pcs/reel 8 Data Sheet PN10264EJ03V0DS 11.9 to 15.4 Outer edge of flange PS7801-1A RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 5.3 4.4 3.6 0.6 (0.35) 1.27 0.8 ( ) : Reference value 24-R0.1 Remark All dimensions in this figure must be evaluated before use. Data Sheet PN10264EJ03V0DS 9 PS7801-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) <R> (3) Soldering by soldering iron • Peak temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet PN10264EJ03V0DS PS7801-1A <R> USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10264EJ03V0DS 11 PS7801-1A • The information in this document is current as of September, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. 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The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10264EJ03V0DS PS7801-1A Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604