PCA EPF8019GM

100 Base-X Interface Module
ELECTRONICS INC.
EPF8019GM
• Optimized to work with ML6692/94 PHY chip •
• Guaranteed to operate with 8 mA DC bias at 70°C on cable side •
• Complies with or exceeds IEEE 802.3, 100 BX Standards •
• Robust construction allows for severe soldering processes •
Electrical Parameters @ 25° C
Insertion Loss
(dB Max.)
OCL
(µH Min.)
1-80
MHz
100 KHz, 0.1 Vrms
8 mA DC Bias @ 70°C
80-100
MHz
Xmit Rcv Xmit
Cable Side
-1
350
Return Loss
(dB Min.)
-1
Rcv
-2
-2
1-30
MHz
30-60
MHz
Xmit Rcv
Xmit Rcv
-18
-12
-18
-12
Common Mode Rejection
(dB Min.)
60-100
MHz
Xmit
-8
1-30
MHz
30-100
MHz
Crosstalk (dB Min.)
[Between Channels]
Rcv Xmit
Rcv
Xmit
Rcv
Xmit
Rcv
-10
-40
-30
-30
-25
-25
-40
1-100
MHz
100-200
MHz
-40
Isolation : 1500 Vrms • Cable Impedance : 100 Ω •
•
Schematic
Transmit Channel
Receive Channel
1:1:1
2CT:1
Chip Side
16
7
1
Cable Side
2
3
10
15
13
Chip Side
8
Cable Side
9
12
Dimensions
Package
A
N
(J)
Pin 1
I.D.
PCA
EPF8019GM
Date Code
B
Pad
Layout
Q
D
M
E
C
K
L
H
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
P
F
Dim.
Min.
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
Q
.970
.380
.225
--.010
--.500
.018
.008
--0°
.025
(Inches)
Max. Nom.
.990
.400
.245
--.015
--.520
.022
.012
--8°
.045
.980
.390
.235
.700
.013
.100
.510
.020
.010
.140
--.035
.030
.100
.090
.560
(Millimeters)
Min.
Max. Nom.
24.64
9.65
5.72
--.254
--12.70
.457
.203
--0°
.635
25.15
10.16
6.22
--.381
--13.20
.559
.305
--8°
1.14
24.89
9.91
5.97
17.78
.330
2.54
12.95
.508
.254
3.56
--.889
.762
2.54
2.29
14.22
I
G
CSF8019GMa Rev. B
10/20/98
Product performance is limited to specified parameters. Data is subject to change without prior notice.
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
100 Base-X Interface Module
ELECTRONICS INC.
EPF8019GM
The circuit below is a guideline for interconnecting PCA’s EPF8019GM with ML6692 or ML6694 chip applications. Further
details can be obtained from the chip manufacturer application notes.
Typical insertion loss of the isolation transformer is 0.5dB. This parameter covers the entire spectrum of the encoded
signals in 100 BX protocol. Under terminated conditions, to transmit a 2V pk-pk signal across the cable, you must adjust
the chips supporting resistor to get at least 2.12V pk-pk across the transmit pins.
Note that in the 100 BX application, you need to use only one half of the RCV side primary winding and terminate it with 50 Ω
balanced load as shown.
The phantom resistors shown around the connector have been known to suppress unwanted radiation that unused wires
pick up from the immediate environment. Their placement and use are to be considered carefully before a design is
finalized.
It is recommended that there be a neat separation of ground planes in the layout. It is generally accepted practice to limit
the plane off at least 0.05 inches away from the chip side pins of EPF8019GM. There need not be any ground plane beyond
this plane.
For best results, PCB designer should design the outgoing traces preferably to be 50 Ω, balanced and well coupled to
achieve minimum radiation from these traces.
Typical Application Circuit for UTP
ML6692
or
ML6694
1
Xmit
2
7
8
200Ω
200Ω
2
3
Rcv
6
10
TX+
1
TX-
3
RX+
13
RX-
12
9
RJ45*
50Ω
4
5
50Ω
7
50Ω
50Ω
8
Capacitor
EPF8019GM
High Voltage
Capacitor
Chassis
Ground
Notes : * NIC Side is shown. Hub side connection will swap pins 3-6 with 1-2.
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
CSF8019GMb Rev. B 10/20/98
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com