P2779A February 2007 rev 0.2 Low-Cost Notebook EMI Reduction IC Features the clock source, which provides system-wide reduction of • Provides up to 15dB of EMI suppression EMI of all clock dependent signals. The P2779A allows • FCC approved method of EMI attenuation significant system cost savings by reducing the number of • Generates a 1X low EMI spread spectrum clock of circuit board layers and shielding that are traditionally the input frequency required to pass EMI regulations. Operates between 20MHz and 38MHz input The P2779A uses the most efficient and optimized frequency range modulation profile approved by the FCC. External loop filter for spread percentage The P2779A modulates the output of a single PLL in order adjustment to spread the bandwidth of a synthesized clock and, more • Spreading ranges from ±0.25% to ±2.5% importantly, • Ultra low cycle-to-cycle jitter harmonics. This results in significantly lower system EMI • Zero-Cycle slip at small deviations compared to the typical narrow-band signal produced by • 3.3 V Operating Voltage oscillators and most frequency generators. Lowering EMI • Low power CMOS design by increasing a signal’s bandwidth is called spread • Available in 8-pin SOIC and TSSOP Packages spectrum clock generation. • Available in Industrial temperature operating • • decreases the peak amplitudes of its Applications range (-40º C to 85º C) The P2779A is targeted toward mobile 3D graphics chip set applications. Product Description The P2779A is a versatile spread spectrum frequency modulator designed specifically for mobile and digital camera and other digital video and imaging applications. The P2779A reduces electromagnetic interference (EMI) at Block Diagram PD VDD LF PLL Modulation XIN Crystal Oscillator XOUT Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT REF VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. P2779A February 2007 rev 0.2 Pin Configuration XIN / CLKIN 1 8 XOUT 2 P2779A VDD 7 REF PD 3 6 ModOUT LF 4 5 VSS Pin Description Pin# Pin Name Type 1 XIN / CLKIN I Connect to crystal or clock input. 2 XOUT O Crystal output. 3 PD I Description Power-down control pin. Pull low to enable power-down mode. This pin has an internal pull-up resistor.1 External loop filter for the PLL. By changing the value of the CRC circuit, the percentage spread can be adjusted accordingly. (See Loop Filter Selection Table for detail values.) 4 LF I 5 VSS P Ground connection. Connect to system ground. 6 ModOUT O Spread spectrum clock output. 7 REF O Provides a reference clock output of the input frequency. 8 VDD P Connect to +3.3 V. Note: 1. Connect to VDD if not used. Loop Filter Selection Table VDD 3.3 V Pin 4 LF R1 C1 C2 Input (MHz) FS1 FS0 20 21-22 23-24 25-26 27-28 29-30 31-32 33-34 35-36 37-38 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 C1 (pF) 270 270 270 270 270 270 270 270 270 270 BW = ± 0.50% C2 R1 (pF) (Ω) 100,000 330 100,000 390 100,000 510 100,000 560 100,000 620 100,000 750 100,000 820 100,000 910 100,000 1,000 100,000 1,200 C1 (pF) 270 270 270 270 270 270 270 270 270 270 BW = ± 0.75% C2 R1 (pF) (Ω) 100,000 560 100,000 620 100,000 750 100,000 820 100,000 1,000 100,000 1,100 100,000 1,200 100,000 1,300 100,000 1,500 100,000 1,600 C1 (pF) 270 270 270 270 270 270 270 270 270 270 BW = ± 1.00% C2 R1 (pF) (Ω) 100,000 750 100,000 866(1%) 10,000 1,000 12,000 1,200 6,800 1,200 3,900 1,200 12,000 2,200 10,000 2,200 5,600 2,200 3,300 2,200 C1 (pF) 560 560 680 470 330 330 680 390 270 270 BW = ± 1.25% C2 R1 (pF) (Ω) 100,000 910 100,000 1,100 6,800 1,200 4,700 1,200 3,300 1,200 3,300 1,500 6,800 2,200 3,900 2,200 2,700 2,200 2,700 2,700 Please contact factory for loop filter values if desired spread settings are not listed. Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 8 P2779A February 2007 rev 0.2 Spread Spectrum Selection The P2779A performs zero cycle slip when set at low percentage spreading. This prevents any occurrence of system timing error. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is described as a percentage deviation of the center frequency. (Note that the center frequency is the frequency of the external reference input on XIN/CLKIN, pin 1.) The P2779A is designed for PC peripheral, networking, notebook PC, and LCD monitor applications. It is optimized for operation from 20MHz to 38MHz. The P2779A’s spread percentage selection is determined by the external LF value specified in the Loop Filter Selection Table. The external LF allows the user to fine tune the spread percentage to optimize the EMI reduction benefits of the spread spectrum. Application Schematic 27 MHz 1 XIN/CLKIN VDD 8 VDD 2 XOUT 3 PD C2 R1 C1 REF 7 0.1µF +3.3V ModOUT 6 4 LF Modulated 27MHz VSS 5 P2779A PD selection: Power dissipation can be reduced by completely turning off the IC. Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 8 P2779A February 2007 rev 0.2 Absolute Maximum Ratings Symbol Parameter VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TSTG TDV Rating Static Discharge Voltage (As per JEDEC STD22- A114-B) Unit Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input low voltage VSS - 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - 60 - µA IIH Input high current - 0 - µA IXOL XOUT output low current (at 0.4 V, VDD = 3.3V) - 10 - mA IXOH XOUT output high current (at 2.5 V, VDD = 3.3V) - 10 - mA VOL Output low voltage (VDD = 3.3V, IOL = 20 mA) - - 0.4 V VOH Output high voltage (VDD = 3.3V, IOH = 20 mA) 2.5 - - V IDD Static supply current - 3 - mA ICC Dynamic supply current (3.3 V, 25 pF loading, 32 MHz) - 12 - mA VDD Operating voltage 3.0 3.3 3.6 V tON Power-up time (first locked cycle after power up) - 7 - mS Clock output impedance - 28 - Ω ZOUT AC Electrical Characteristics Symbol Min Typ Max Unit Input frequency 20 - 38 MHz fOUT Output frequency 20 - 38 MHz 1 tLH Output rise time (measured at 0.8 V to 2.0 V) - 1 - nS fIN tHL 1 Parameter Output fall time (measured at 2.0 V to 0.8 V) - 1 - nS tJC Jitter (Cycle to cycle) - ±175 - pS tD Output duty cycle 45 50 55 % Note: 1. tLH and tHL are measured into a capacitive load of 15 pF Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 8 P2779A February 2007 rev 0.2 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 8 P2779A February 2007 rev 0.2 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 8 P2779A February 2007 rev 0.2 Ordering Information Part number P2779AF-08-ST Marking P2779AF Package Type Temperature 8-Pin SOIC, Tube, Pb Free Commercial P2779AF-08-SR P2779AF 8-Pin SOIC, Tape and Reel, Pb Free Commercial P2779AG-08-ST P2779AG 8-Pin SOIC, Tube, Green Commercial P2779AG-08-SR P2779AG 8-Pin SOIC, Tape and Reel, Green Commercial I2779AF-08-ST I2779AF 8-Pin SOIC, Tube, Pb Free Industrial I2779AF-08-SR I2779AF 8-Pin SOIC, Tape and Reel, Pb Free Industrial I2779AG-08-ST I2779AG 8-Pin SOIC, Tube, Green Industrial I2779AG-08-SR I2779AG 8-Pin SOIC, Tape and Reel, Green Industrial P2779AF-08-TT P2779AF 8-Pin TSSOP, Tube, Pb Free Commercial P2779AF-08-TR P2779AF 8-Pin TSSOP, Tape and Reel, Pb Free Commercial P2779AG-08-TT P2779AG 8-Pin TSSOP, Tube, Green Commercial P2779AG-08-TR P2779AG 8-Pin TSSOP, Tape and Reel, Green Commercial I2779AF-08-TT I2779AF 8-Pin TSSOP, Tube, Pb Free Industrial I2779AF-08-TR I2779AF 8-Pin TSSOP, Tape and Reel, Pb Free Industrial I2779AG-08-TT I2779AG 8-Pin TSSOP, Tube, Green Industrial I2779AG-08-TR I2779AG 8-Pin TSSOP, Tape and Reel, Green Industrial Device Ordering Information P 2 7 7 9 A F - 0 8 - S T SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R ST – SOIC, TUBE Pin Count F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS Deviation (%) and Spread option Identifier DEVICE NUMBER Flow: P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 8 P2779A February 2007 rev 0.2 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Preliminary Information Part Number: P277A Document Version: v0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low-Cost Notebook EMI Reduction IC Notice: The information in this document is subject to change without notice. 8 of 8