SBB-5000
0.05GHz to
6GHz, Cascadable Active
Bias InGaP
HBT MMIC
Amplifier
SBB-5000
Preliminary
0.05GHz to 6GHz, CASCADABLE ACTIVE BIAS
InGaP HBT MMIC AMPLIFIER
Package: Bare Die
Product Description
Features
RFMD’s SBB-5000 is a high performance InGaP HBT MMIC amplifier utilizing a Darlington configuration with an active bias network. The active bias network provides
stable current over temperature and process Beta variations. Its efficient operation
from a single 5V supply and its compact size (0.59mmx0.70mm) make it ideal for
high-density multi-chip module applications. It is well-suited for high linearity 5V
gain block applications and it is internally matched to 50Ω.
RFMD can provide 100% DC screening, visual inspection, and Hi-Rel water qualification. Die can be delivered at the wafer level or picked to gel
or waffle paks.
Optimum Technology
Matching® Applied
GaAs HBT
30.0
Gain and Return Loss (dB)
GaAs MESFET
9
Gain and Return Loss versus Frequency
VS=5V, IS=75mA
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Single Fixed 5V Supply
Compact Die Size
(0.59mmx0.70mm)
Patented Thermal Design &
Bias Circuit
Low Thermal Resistance
Applications
20.0
10.0
OIP3=35dBm @ 2000MHz
P1dB =20.5dBm @ 2000MHz
GSG Probe Data with Bias Tees
ZS=ZL=50 Ohms, T=25°C
0.0
-10.0
-20.0
PA Driver Amplifier
RF Pre-driver and RF Receive
Path
Military Communications
Test and Instrumentation
IRL
Gain
ORL
-30.0
Si BJT
-40.0
GaN HEMT
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Frequency (GHz)
RF MEMS
Parameter
Frequency of Operation
Small Signal Gain
Min.
Specification
Typ.
Max.
Unit
Condition
50
6000
MHz
20.5
dB
Frequency=500MHz
20.5
dB
Frequency=2000Mhz
20.0
dB
Frequency=4000MHz
Output Power at 1dB Compression
21.0
dBm
Frequency=500MHz
20.5
dBm
Frequency=2000MHz
17.0
dBm
Frequency=4000MHz
Output IP3
37.0
dBm
Frequency=500MHz
35.0
dBm
Frequency=2000MHz
30.0
dBm
Frequency=4000MHz
Input Return Loss
15.0
dB
Frequency=2000MHz
Output Return Loss
12.0
dB
Frequency=2000MHz
Current
75.0
mA
Noise Figure
3.9
dB
Frequency=2000MHz
Thermal Resistance
69.9
°C/W
Junction to lead (89 pkg)
Test Conditions: Z0 =50Ω, VD =5V, ID =75mA, T=25°C, OIP3 Tone Spacing=1MHz, POUT/tone=0dBm. GSG Probe Data with Bias Tees.
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
EDS-106102 Rev A
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-sup-
1 of 6
SBB-5000
Preliminary
Absolute Maximum Ratings
Parameter
Rating
Unit
mA
Total Current (ID)
100
Device Voltage (VD)
5.5
V
Power Dissipation
0.55
W
Operating Lead Temperature (TL)
-40 to +85
°C
RF Input Power
+12 (TBR)*
dBm
Storage Temperature Range
-55 to +150
°C
Operating Junction Temperature (TJ)
+150
°C
ESD Rating - Human Body Model
(HBM)
Class 1C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
* TBR=To Be Reviewed
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not
exceed the maximum operating values specified in the table on page one.
Bias Conditions should also satisfy the following expression:
IDVD <(TJ -TL)/RTH, j-l
Typical Performance (GSG Probe Data with Bias Tees) VD =5V, ID =75mA, T=25°C, Z=50Ω
Parameter
Units
500MHz
Small Signal Gain
Output 3rd Order Intercept Point
(see note 1)
Output Power at 1dB Compression
Input Return Loss
Output Return Loss
Reverse Isolation
Noise Figure
Note 1: 0dBm/tone, 1MHz spacing
dB
dBm
20.5
37.0
20.5
36.0
20.5
35.0
20.5
35.0
20.5
33.0
20.0
30.0
dBm
dB
dB
dB
dB
21.0
27.0
22.0
22.1
3.8
20.5
21.0
18.0
22.5
4.0
20.5
17.0
14.6
22.4
3.9
20.5
15.0
12.0
22.9
3.9
19.5
11.0
9.0
23.0
4.0
17.0
9.5
7.2
23.0
3.8
2 of 6
1000MHz 1500MHz 2000MHz 3000MHz 4000MHz
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-sup-
EDS-106102 Rev A
SBB-5000
Preliminary
Typical Performance (GSG Probe Data with Bias Tees) VD =5.0V, ID =75mA
P1dB versus Frequency
24.0
OIP3 versus Frequency
(0dBm/Tone, 1MHz Spacing)
45.0
-20°C
25°C
85°C
22.0
-20°C
25°C
85°C
40.0
OIP3 (dBm)
P1dB (dBm)
20.0
18.0
16.0
35.0
30.0
14.0
25.0
12.0
10.0
20.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
Frequency (GHz)
3.0
4.0
5.0
6.0
Frequency (GHz)
Current versus Voltage
Noise Figure versus Frequency
90.0
6.0
85.0
5.0
Noise Figure (dB)
80.0
ID (mA)
75.0
70.0
65.0
4.0
3.0
2.0
60.0
-20°C
25°C
85°C
55.0
1.0
50.0
25°C
85°C
0.0
4.8
4.9
5.0
5.1
VD (V)
EDS-106102 Rev A
5.2
5.3
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Frequency (GHz)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-sup-
3 of 6
SBB-5000
Preliminary
Typical Performance (GSG Probe Data with Bias Tees) VD =5.0V, ID =75mA
S11 versus Frequency
S21 versus Frequency
0.0
24.0
-5.0
-20°C
25°C
85°C
22.0
S21 (dB)
S11 (dB)
-10.0
-15.0
20.0
18.0
-20.0
-25.0
16.0
-20°C
25°C
85°C
-30.0
14.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
Frequency (GHz)
4.0
5.0
6.0
S22 versus Frequency
0.0
0.0
-5.0
-5.0
-10.0
-10.0
S22 (dB)
S12 (dB)
3.0
Frequency (GHz)
S12 versus Frequency
-15.0
-20.0
-15.0
-20.0
-25.0
-25.0
-20°C
25°C
85°C
-30.0
-20°C
25°C
85°C
-30.0
0.0
1.0
2.0
3.0
4.0
Frequency (GHz)
4 of 6
2.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Frequency (GHz)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-sup-
EDS-106102 Rev A
Preliminary
Pin
Function
RF IN
RF OUT
DIE
BACKSIDE
Description
This pad is DC coupled and matched to 50Ω. An external DC block is required.
This pad is DC coupled and matched to 50Ω. DC bias is applied through this pad.
Die backside must be connected to RF/DC ground using silver filled conductive epoxy.
Notes:
1. All dimensions in inches [millimeters].
2. Die thickness is 0.004 [0.100].
3. Typical bond pad is 0.003x0.006
4. Backside metallization: Gold.
5. Bond pad metallization: Gold.
6. Backside is ground.
EDS-106102 Rev A
SBB-5000
Die Dimensions
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5 of 6
SBB-5000
Preliminary
Device Assembly
Ordering Information
Part Number
Description
SBB-5000
Bare Die
6 of 6
Devices/Container
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-sup-
EDS-106102 Rev A