MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ ͙ Featuresʚ ʚ z Package in 8mm tape on 7“ diameter reel. z Compatible with automatic placement equipment. z Compatible with infrared and vapor phase reflow solder process. z Mono-color type. Page: 1.0 1/8 ͙ Package Dimensionsʚ ʚ ͙ Descriptionʚ ʚ z The 23-21 SMD Taping is much smaller than leaded components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. z Besides, lightweight makes them ideal for miniature application, etc. ˮ Notesʚ ʚ ͙ Applicationsʚ ʚ z Automotive: backlighting in dashboard and switch. z Telecommunication: indicator and backlighting in telephone and fax. z Flat backlight for LCD, switch and symbol. z General use. PART NO 23-21UBGC/TR8 Tolerances Unless Dimension ̄0.1mm Anglē0.5͈ Unit = mm CHIP Material Emitted Color GaN/SiC Super Blue Green Substrate Lens Color Water Clear MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ ˮ Package Dimensionsʚ ʚ ˮ Loaded quantity per reel 2000 pcs/reelʚ ʚ Page: 1.0 2/8 MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ Page: ˮ Absolute Maximum Ratings at Ta = 25̺ ̺ : Parameter Symbol Rating Unit Reverse Voltage Vr 5 V Forward Current If 30 mA Operating Temperature Topr -20 ~ +80 ̺ Storage Temperature Tstg -30 ~ +90 ̺ Soldering Temperature Tsol 260 (for 5 second) ̺ Electrostatic Discharge ESD 1000 V Power Dissipation Pd 120 mW If(Peak) 100 mA Peak Forward Current(Duty 1/10 @ 1KHZ) ˮ Electronic Optical Characteristics : Parameter Symbol Min. Typ. Max. Unit Condition Luminous intensity Iv ----- 3 ----- mcd If=2mA 34 58 ----- mcd If=20mA Viewing Angle 2ϰ1/2 ----- 130 ----- deg If=20mA Peak Wavelength ϳp ----- 502 ----- nm If=20mA ϳd ----- 505 ----- nm If=20mA ˦ϳ ----- 30 ----- nm If=20mA Forward Voltage Vf ----- 3.5 4.0 V If=20mA Reverse Current Ir ----- ----- 50 ϴA Vr=5V Dominant Wavelength Spectrum Radiation Bandwidth 1.0 3/8 MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ Page: ˮ Reliability Test Item And Condition : NO Item Test Conditions 1 Solder Heat TEMP : 260̺ ̄ 5 ̺ Test Sample Hours/Cycle Size 5 SEC 76 Pcs 0/1 50 CYCLE 76 Pcs 0/1 50 CYCLE 76 Pcs 0/1 Ac/Re H : +85̺ 30min 2 Temperature Cycle ̝ 5 min L : -55̺ 30min H : +100̺ 5min 3 Thermal Shock ̝ 10 sec L : -10̺ 5min 4 High Temperature Storage TEMP : 100̺ 1000 HRS 76 Pcs 0/1 5 Low Temperature Storage TEMP : -55̺ 1000 HRS 76 Pcs 0/1 6 DC Operating Life If = 20 mA 1000 HRS 76 Pcs 0/1 85̺/85% RH 1000 HRS 76 Pcs 0/1 7 High Temperature / High Humidity 1.0 4/8 MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ ˮ Typical Electro-Optical Characteristic Curves : Page: 1.0 5/8 MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ Page: 1.0 6/8 ˮ Test Circuit : R LED ˮ Precautions For Use : 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage time 2.1 The operation of temperature and R.H. are : 5̺~35̺, R.H.60%. 2.2 Once the package is opened, the products should be used within a week. Otherwise, they should be keeping in a dampproof box with desiccants. Considering the tape life , we suggest our customers to use our products within a year(from production date). 2.3 If opened more than one week in an atmosphere 5̺~35̺, R.H.60%, they should be treated at 60̺̄5̺for 15hrs. 2.4 When you discover that the desiccant in the package has a pink color (normal = blue) , you should treat them in the same conditions as 2.3. MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ Page: 1.0 7/8 ˮ Soldering heat reliability ( DIP ) : Please refer to the following figure : ˮ Soldering Iron : Basic spec is ̉5 sec when 260̺.If temperature is higher, time should be shorter (+10̺ ̨ -1sec). Power dissipation of iron should be smaller than 15 W , and temperature should be controllable. Surface temperature of the device should be under 230 ̺. ˮ Rework : 1. Customer must finish rework within 5 sec under 260̺. 2. The head of iron can not touch copper foil. 3. Twin-head type is preferred. ˤ ̂ MODEL NO: 23-21UBGC/TR8 Reverse Package Chip LED Device Numberʚ DSE-231-009 REV. ECNʚ ʓʓʓʓ ˮ Reflow Temp / Timeʚ ʚ to rise preheat cooling Page: 1.0 8/8