1-1-2 Switching Mode Regulator ICs SI-8000W Series Surface-Mount, Separate Excitation Step-down Switching Mode Regulator ICs ■Features ■Absolute Maximum Ratings • Surface-mount package (SOP8) Parameter • Output current: 0.6A • High efficiency: 75 to 80% Symbol Ratings DC Input Voltage VIN 35 Unit V Power Dissipation PD 1 W °C Junction Temperature Tj –30 to +125 • Requires only 4 discrete components Storage Temperature Tstg –40 to +125 °C • Internally-adjusted phase correction and output voltage adjustment performed internally Thermal Resistance (Junction to 7-Pin Lead) θ j-L 22 °C/W Thermal Resistance (Junction to Ambient Air)*1 θ j-a 100 °C/W *1: Glass-epoxy board of 40 × 40mm (copper laminate area 4.3%) • Built-in reference oscillator (60kHz) • Built-in overcurrent and thermal protection circuits ■Applications • Power supplies for telecommunication equipment • Onboard local power supplies ■Recommended Operating Conditions Ratings Symbol Parameter SI-8033W SI-8050W 5.3 to 28 7 to 33 Unit DC Input Voltage Range VIN Output Current Range IO 0 to 0.6 A Tjop –30 to +125 °C Operating Junction Temperature Range V ■Electrical Characteristics (Ta=25°C) Ratings Parameter Symbol SI-8033W min. Output Voltage 3.17 η Efficiency Conditions Oscillation Frequency Line Regulation Load Regulation Temperature Coefficient of Output Voltage Ripple Rejection Overcurrent Protection Starting Current 44 VO Conditions ICs f Conditions ∆VOLINE 3.30 3.43 4.80 ∆VO/∆Ta RREJ Conditions max. 5.00 5.20 VIN=20V, IO=0.3A 75 80 VIN=15V, IO=0.3A VIN=20V, IO=0.3A 60 60 VIN=15V, IO=0.3A VIN=20V, IO=0.3A 80 80 30 30 VIN=20V, IO=0.1 to 0.4A ±0.5 ±0.5 45 45 f=100 to 120HZ f=100 to 120HZ 0.61 VIN=15V VIN=20V V % kHZ 100 VIN=10 to 30V, IO=0.3A VIN=15V, IO=0.1 to 0.4A 0.61 Unit typ. VIN=15V, IO=0.3A 20 Conditions Conditions min. VIN=8 to 28V, IO=0.3A ∆VOLOAD IS1 max. 60 Conditions SI-8050W typ. 40 mV mV mV/ °C dB A SI-8000W Series ■External Dimensions (SOP8) (Unit : mm) 5.1±0.4 1.27 6 5 1 2 3 4 6.2±0.3 7 4.4±0.2 8 0.15+0.1 –0.05 0.5±0.1 0.4±0.1 0~ 10 ° 1.27 1.5±0.1 0.12 M Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.1g 0.05±0.05 0.10 0.4±0.1 1.55±0.15 0.995max. ■Typical Connection Diagram ■Block Diagram VIN Pin Assignment q VIN w N.C e SWOUT r VOS t GND y GND u GND i GND 1 3 SWOUT L1 OCP Reg. 200µH VIN OSC 1 TSD Reset SI-8000W Drive Comp. C1 100µF 4 VOS Amp. SWOUT VIN + GND 5~8 VOS 3 VO 4 D1 + C2 330µF SJPB-D4 (Sanken) GND VREF GND 5~8 GND ■Reference Data Copper Laminate Area vs. Power Dissipation 1.2 Tj=100°C Area of PC board : 40 × 40mm Copper Laminate Area vs. Thermal Resistance θ j-a 140 Area of PC board : 40 × 40mm Ta=25°C Ta=50°C 120 Ta=80°C Thermal Resistance θ j-a (°C/W) Power Dissipation PD (W) 1 0.8 100 0.6 0.4 0.2 0 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 80 60 40 10 100 1000 Copper Laminate Area (mm2) (GND Terminal) ICs 45