Z-Power LED X10490 Technical Data Sheet Specification CWT722-T SSC Drawn Approval CUSTOMER Approval Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of CWT722-T 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CWT722-T Features Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. CWT722-T 사진 • White colored SMT package. • Material : InGaN/SiC • Encapsulating Resin : Silicon Resin • Suitable for all SMT assembly methods ; Suitable for all soldering methods • RoHS Compliant Applications • Interior automotive • Office Automation, Electrical Appliances, Industrial Equipment Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 324 mW Forward Current IF 90 mA 100 mA IFM Peak Forward Current *2 Reverse Voltage (per die) VR 5 V Operating Temperature Topr -40 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric & Optical characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage (per die) VF IF =20 mA 2.9 3.2 3.6 V Reverse Current (per die) IR VR=5V - - 10 µA IV IF =60 mA - 5000 - mcd Luminance Flux ΦV IF =60 mA - 13.5 - lm Color Temperature CCT IF =60 mA 4700 - 10000 K 0.279 - 0.3531 0.297 - 0.3605 Luminance Intensity *1 Color Coordinate X Y IF =60 mA - *2 2θ½ IF =60 mA - 120 - deg Optical Efficiency ηop IF =60 mA - 70 - lm/W Color Rendering Index Ra IF =60 mA - 92 - - Viewing Angle *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current vs. Forward Voltage (per die) Forward Current [mA] (Ta=25 OC ) 10 1 2.0 2.5 3.0 3.5 4.0 Forward Voltage[V] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 2.0 1.8 1.6 Relative Luminosity(a.u.) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 15 30 45 60 75 90 105 120 Forward Current IF[mA] Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Ambient Temperature vs. Allowable Forward Current (per die) 35 30 Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 25 20 15 10 5 0 -25 0 25 50 75 100 O Ambient temperature Ta( C) Radiation Diagram 0 -30 -60 -90 30 (Ta=25 OC ) 60 90 Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Spectrum (TA=25℃, IF=60mA) Relative Emission Intensity[a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning 0.9 0.8 0.7 0.6 y 0.5 0.4 520525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 0.3 0.2 0.1 0.0 0.0 610 620 630 830 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning 0.40 0.38 5000K 5500K 0.36 6000K 0.34 f2 e2 d2 7500K 0.32 0.30 b2 e1 d1 c2 9000K g1 f1 Y 6700K g2 c1 b1 0.28 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 X ● COLOR RANK <IF=20mA, Ta=25℃> 9000K b1 0.2860 0.2920 0.3000 0.2950 7500K b2 0.2820 0.2790 0.2700 0.2860 0.2810 0.2950 0.2950 0.2890 6700K d1 c1 0.2970 0.2820 0.2950 0.3120 0.2950 0.3000 0.3104 0.3065 d2 c2 0.2950 0.2890 0.2810 0.2950 0.2940 0.3065 0.3104 0.3030 6000K e1 0.3120 0.2950 0.3104 0.3290 e2 0.3065 0.3104 0.3030 0.3290 0.3171 0.3240 0.3150 0.3420 0.3104 0.3190 0.3171 0.2940 0.3065 0.3052 0.3171 0.3240 0.3150 5500K 0.3104 0.3240 0.3420 0.3190 0.3286 0.3280 0.3052 0.3171 0.3168 0.3280 0.3372 0.3277 5000K 0.3240 0.3372 0.3553 f1 0.3280 0.3286 0.3395 0.3400 f2 0.3372 0.3168 0.3292 0.3500 0.3277 0.3280 0.3400 0.3400 g1 0.3553 0.3372 0.3500 0.3680 0.3400 0.3395 0.3500 0.3531 * Measurement Uncertainty of the Color Coordinates : ± 0.01 g2 0.3500 0.3292 0.3400 0.3605 0.3400 0.3400 0.3531 0.3562 0.3680 0.3500 0.3605 0.3826 Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Color & Binning 0.40 0.38 5000K 5500K 0.36 6000K 0.34 6700K Y 5700K 7000K 9000K 0.30 0.28 0.26 0.27 5200K 6300K 7500K 0.32 4700K 8200K 10000K 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 X Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Rank of CWT722-T ▣ Rank Name Table X1 X2 X3 IV CIE VF ▣ Forward Voltage [V] ▣ Intensity value[mcd] Rank Name MIN L2 3200 4200 M2 4200 5100 N1 5100 6200 P2 6200 7600 Rank Name MIN MAX Y3 2.9 3.0 ▣ CIE (Color Rank) Z1 3.0 3.1 Rank Name Z2 3.1 3.2 b1 Z3 3.2 3.3 A1 3.3 3.4 A2 3.4 3.5 A3 3.5 3.6 MAX 9000K 7500K c1 b2 c2 6700K d1 d2 6000K e1 e2 5500K f1 f2 5000K g1 g2 Available Rank [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7.Outline Dimension Package Outlines Package Marking (Cathode) 6 5 4 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Solder Pad Circuit Diagram White Anode 5 6 W1 W2 1 4 W3 2 3 White Cathode * MATERIALS PARTS MATERIALS Package Heat-Resistant Polymer Encapsulating Resin Silicon Resin Electrodes Ag Plating Copper Alloy Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9.Soldering (1) Lead Solder Lead Solder 2.5~5 o C / sec. Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 oC / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 oC / sec. Pre-heating 150~200 oC 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Reliability Test Item and Condition Item Reference Test Condition Duration / Cycle Number of Damage Thermal Shock EIAJ ED4701 Ta =-40oC (30MIN) ~ 100oC (30MIN) 100 Cycle 0/22 Temperature Cycle EIAJ ED4701 Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) 100 Cycle 0/22 High Temperature Storage EIAJ ED4701 Ta =100oC 1000 Hours 0/22 High Temperature High Humidity Storage EIAJ ED4701 Ta =85oC, RH=85% 1000 Hours 0/22 Low Temperature Storage EIAJ ED4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =20mA 1000 Hours 0/22 High Temperature High Humidity Life Test Internal Reference Ta =85oC, RH=85%, IF =15mA 300 Hours 0/22 High Temperature Life Test Internal Reference Ta =85oC, IF =20mA 500 Hours 0/22 Low Temperature Life Test Internal Reference Ta =-40oC, IF =20mA 1000 Hours 0/22 ESD(HBM) MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 Criteria for Judging the Damage Item Symbol Condition Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN MAX IF =20mA - USL*1 × 1.2 IR VR=5V - USL*1 × 2.0 IV IF =20mA LSL*2 × 0.5 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Rev. 00 October 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)