PR23MF11NSZ Series PR33MF11NSZ Series PR23MF11NSZ Series PR33MF11NSZ Series IT(rms)≤0.3A, Non-Zero Cross type DIP 8pin Triac output SSR ■ Description ■ Agency approvals/Compliance PR23MF11NSZ Series and PR33MF11NSZ Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4.0kV isolation (Viso(rms)) from input to output. 1. Recognized by UL508, file No. E94758 (as model No. R23MF1/R33MF1) 2. Approved by CSA 22.2 No.14, file No. LR63705 (as model No. R23MF1/R33MF1) 3. Optionary available VDE approved (∗)(DIN EN 60747-52), file No. 40008898 (only for PR33MF11NSZ Series as model No. R33MF1) 4. Package resin : UL flammability grade (94V-0) (∗) ■ Features 1. Output current, IT(rms)≤0.3A 2. Non-zero crossing functionary 3. 8 pin DIP package (SMT gullwing also available) 4. High repetitive peak off-state voltage (VDRM : 600V, PR33MF11NSZ Series) (VDRM : 400V, PR23MF11NSZ Series) 5. Superior noise immunity (dV/dt : MIN. 100V/µs) 6. Response time, ton : MAX. 100µs 7. Lead-free terminal components are also available (see Model Line-up section in this datasheet) 8. High isolation voltage between input and output (Viso(rms) : 4.0kV) DIN EN60747-5-2 : successor standard of DIN VDE0884. Up to Date code "RD" (December 2003), approval of DIN VDE0884. From Date code "S1" (January 2004), approval of DIN EN60747-5-2. ■ Applications 1. Isolated interface between high voltage AC devices and lower voltage DC control circuitry. 2. Switching motors, fans, heaters, solenoids, and valves. 3. Phase or power control in applications such as lighting and temperature control equipment. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D4-A00301EN Date Mar. 31. 2004 © SHARP Corporation PR23MF11NSZ Series PR33MF11NSZ Series ■ Internal Connection Diagram 8 5 6 1 2 3 4 1 2 3 Cathode Anode Cathode Cathode 5 6 8 Gate Output (T1) Output (T2) 4 ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PR23MF11NSZF] 6 5 Model No. SHARP mark "S" R23MF1 Rank mark CSA mark 3 0.26±0.1 0.5TYP. 3.5±0.5 3.25±0.5 2.54±0.25 0.26±0.1 0.5±0.1 θ:0 to 13˚ θ 5 R33MF1 2.54±0.25 SHARP mark "S" Rank mark 3 6 5 Model No. R33MF1 Rank mark 4 1 3 4 Date code (2 digit) Factory identification mark 7.62±0.3 0.26±0.1 0.5TYP. 3.5±0.5 9.66±0.5 Epoxy resin 2.54±0.25 0.26±0.1 0.5±0.1 θ Product mass : approx. 0.56g 2 Anode mark 7.62±0.3 9.66±0.5 3.25±0.5 8 CSA mark Date code (2 digit) Factory identification mark 2.54±0.25 1.0+0.4 −0 4. SMT Gullwing Lead-Form [ex. PR33MF11NIPF] Model No. CSA mark Epoxy resin Product mass : approx. 0.54g 6.5±0.5 6 1.0+0.4 −0 10.0+0 −0.5 1.05±0.2 8 7.62±0.3 Epoxy resin 3. Through-Hole [ex. PR33MF11NSZF] 1.2±0.3 4 Date code (2 digit) Factory identification mark 9.66±0.5 θ 2 2 0.35±0.25 1 Anode mark 7.62±0.3 Product mass : approx. 0.56g 1 Rank mark 4 2.54±0.25 Anode mark R23MF1 CSA mark Date code (2 digit) Factory identification mark 9.66±0.5 SHARP mark "S" Model No. θ:0 to 13˚ 1.0+0.4 −0 Epoxy resin 0.35±0.25 3 5 3.5±0.5 2 6 6.5±0.5 1 Anode mark 8 3.5±0.5 8 6.5±0.5 SHARP mark "S" 2.54±0.25 1.05±0.2 6.5±0.5 1.2±0.3 2. SMT Gullwing Lead-Form [ex. PR23MF11NIPF] 1.0+0.4 −0 10.0+0 −0.5 θ Product mass : approx. 0.54g Sheet No.: D4-A00301EN 2 PR23MF11NSZ Series PR33MF11NSZ Series ■ Outline Dimensions (Unit : mm) 5. Through-Hole VDE option [ex. PR33MF11YSZF] Model No. 5 SHARP mark "S" R33MF1 4 2 3 4 Rank mark VDE identification mark 1 3 4 Date code (2 digit) Factory identification mark 7.62±0.3 0.5TYP. 3.5±0.5 9.66±0.5 Epoxy resin 2.54±0.25 0.26±0.1 0.5±0.1 θ Product mass : approx. 0.56g 2 Anode mark 7.62 9.66 Model No. CSA mark ±0.3 ±0.5 3.25±0.5 R33MF1 VDE identification mark Date code (2 digit) Factory identification mark 2.54±0.25 5 0.26±0.1 1 6 4 Rank mark CSA mark Anode mark 8 θ:0 to 13˚ 1.0+0.4 −0 Epoxy resin 0.35±0.25 6 1.05±0.2 6.5±0.5 8 6.5±0.5 SHARP mark "S" 1.2±0.3 1.05±0.2 3.5±0.5 1.2±0.3 6. SMT Gullwing Lead-Form VDE option [ex. PR33MF11YIPF] 1.0+0.4 −0 10.0+0 −0.5 θ Product mass : approx. 0.54g Sheet No.: D4-A00301EN 3 PR23MF11NSZ Series PR33MF11NSZ Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark Please refer to the Model Line-up table. Sheet No.: D4-A00301EN 4 PR23MF11NSZ Series PR33MF11NSZ Series (Ta=25˚C) Parameter Symbol Rating Unit *3 Forward current IF 50 mA Input Reverse voltage VR 6 V RMS ON-state current IT(rms) 0.3 *3 A *4 Peak one cycle surge current Isurge 3 A Output Repetitive PR23MF11NSZ 400 VDRM V peak OFF-state voltage PR33MF11NSZ 600 *1 Isolation voltage 4.0 Viso(rms) kV Operating temperature Topr −25 to +85 ˚C Storage temperature ˚C Tstg −40 to +125 *2 Soldering temperature ˚C Tsol 270 *5 1mm ■ Absolute Maximum Ratings Soldering area *1 40 to 60%RH, AC for 1minute, f=60Hz *2 For 10s *3 Refer to Fig.1, Fig.2 *4 f=50Hz sine wave *5 Lead solder plating models: 260˚C ■ Electro-optical Characteristics Parameter Forward voltage Input Reverse current Repetitive peak OFF-state current ON-state voltage Output Holding current Critical rate of rise of OFF-state voltage Transfer Minimum trigger current charac- Isolation resistance teristics Turn-on time (Ta=25˚C) Symbol VF IR IDRM VT IH dV/dt IFT RISO ton Conditions IF=20mA VR=3V VD=VDRM IT=0.3A VD=6V − VD=1/√2 ·VDRM VD=6V, RL=100Ω DC500V,40 to 60%RH VD=6V, RL=100Ω, IF=20mA MIN. TYP. 1.2 − − − − − − − − − − 100 − − 5×1010 1011 − − MAX. 1.4 10 100 3.0 25 − 10 − 100 Unit V µA µA V mA V/µs mA Ω µs Sheet No.: D4-A00301EN 5 PR23MF11NSZ Series PR33MF11NSZ Series ■ Model Line-up (1) (Lead-free terminal components) Lead Form Shipping Package DIN EN60747-5-2 Model No. Through-Hole Sleeve 50pcs/sleeve - Approved SMT Gullwing Taping 1 000pcs/reel - VDRM [V] Rank mark IFT[mA] (VD=6V, RL=100Ω) 400 600 1 MAX.10 VDRM [V] Rank mark IFT[mA] (VD=6V, RL=100Ω) 400 600 1 MAX.10 Approved PR23MF11NIPF PR23MF11NSZF PR33MF11NSZF PR33MF11YSZF PR33MF11NIPF PR33MF11YIPF ■ Model Line-up (2) (Lead solder plating components) Lead Form Shipping Package DIN EN60747-5-2 Model No. Through-Hole Sleeve 50pcs/sleeve - Approved SMT Gullwing Taping 1 000pcs/reel - Approved PR23MF11NIP PR23MF11NSZ PR33MF11NSZ PR33MF11YSZ PR33MF11NIP PR33MF11YIP Please contact a local SHARP sales representative to see the actual status of the production. Sheet No.: D4-A00301EN 6 PR23MF11NSZ Series PR33MF11NSZ Series Fig.2 RMS ON-state Current vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 70 RMS ON-state current IT (rms) (A) Forward current IF (mA) 60 50 40 30 20 0.3 0.2 0.1 10 0 −25 0 50 0 −25 100 0 50 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs. Ambient Temperature 12 25˚C 0˚C VD=6V RL=100Ω Minimum trigger current IFT (mA) 100 Forward current IF (mA) Ta=75˚C 50 −25˚C 50˚C 10 5 1 0 0.5 1 1.5 2 2.5 10 PR23MF11NSZ 8 6 PR33MF11NSZ 4 2 0 −40 3 Forward voltage VF (V) 20 40 60 80 100 Fig.6 Relative Holding Current vs. Ambient Temperature 1.6 Relative holding current IH (t˚C) / IH (25˚C)×100% 1 000 IT=0.3A ON-state voltage VT (V) 0 Ambient temperature Ta (˚C) Fig.5 ON-state Voltage vs. Ambient Temperature 1.5 1.4 1.3 1.2 −30 −20 0 50 VD=6V 100 10 −30 100 0 50 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Sheet No.: D4-A00301EN 7 PR23MF11NSZ Series PR33MF11NSZ Series Fig.7 ON-state Current vs. ON-state Voltage Fig.8 Turn-on Time vs. Forward Current 0.5 1 000 VD=6V RL=100Ω Ta=25˚C IF=20mA Ta=25˚C Turn-on time tON (µs) ON-state current IT (A) 0.4 0.3 0.2 100 PR33MF11NSZ 10 PR23MF11NSZ 0.1 0 0 0.5 1 1.5 1 10 2 ON-state voltage VT (V) 20 30 40 50 100 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference. Sheet No.: D4-A00301EN 8 PR23MF11NSZ Series PR33MF11NSZ Series ■ Design Considerations ● Recommended Operating Conditions Input Output Parameter Symbol Input signal current at ON state IF(ON) Input signal current at OFF state IF(OFF) PR23MF11NSZ Load supply voltage VOUT(rms) PR33MF11NSZ Load supply current Frequency Operating temperature IOUT(rms) f Topr Conditions − − MIN. 20 0 − − Locate snubber circuit between output terminals − (Cs=0.022µF, Rs=47Ω) 50 − −20 − MAX. 25 0.1 120 240 Unit mA mA IT(rms)×80%(∗) mA 60 80 Hz ˚C V (∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature). ● Design guide In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less. In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width is a minimum of 1ms. When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can merely recommend some circuit values to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit component values accordingly. When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops in current are not accompanied by large instantaneous changes in voltage across the Triac. This fast change in voltage is brought about by the phase difference between current and voltage. Primarily, this is experienced in driving loads which are inductive such as motors and solenods. Following the procedure outlined above should provide sufficient results. Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main output triac as possible. All pins shall be used by soldering on the board. (Socket and others shall not be used.) ● Degradation In general, the emission of the IRED used in SSR will degrade over time. In the case where long term operation and / or constant extreme temperature fluctuations will be applied to the devices, please allow for a worst case scenario of 50% degradation over 5years. Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least twice the minimum required triggering current from initial operation. Sheet No.: D4-A00301EN 9 PR23MF11NSZ Series PR33MF11NSZ Series ● Recommended Foot Print (reference) SMT Gullwing Lead-form 1.7 2.54 2.54 2.54 8.2 2.2 (Unit : mm) ● Standard Circuit R1 +VCC 2 SSR D1 3 V1 Load 8 ZS AC Line 6 Tr1 ZS : Surge absorption circuit (Snubber circuit) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D4-A00301EN 10 PR23MF11NSZ Series PR33MF11NSZ Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D4-A00301EN 11 PR23MF11NSZ Series PR33MF11NSZ Series ● Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D4-A00301EN 12 PR23MF11NSZ Series PR33MF11NSZ Series ■ Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D4-A00301EN 13 PR23MF11NSZ Series PR33MF11NSZ Series ● Tape and Reel package SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F J D E G MA X. H H A B C I 5˚ K Dimensions List A B 16.0±0.3 7.5±0.1 H I 10.4±0.1 0.4±0.05 C 1.75±0.1 J 4.2±0.1 D 12.0±0.1 K 10.2±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.5±1.5 e f 23±1.0 2.0±0.5 f a b (Unit : mm) c d ±1.0 100 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D4-A00301EN 14 PR23MF11NSZ Series PR33MF11NSZ Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D4-A00301EN 15