PC123J00000F Series PC123J00000F Series DIP 4pin Reinforced Insulation Type Photocoupler ■ Description ■ Agency approvals/Compliance PC123J00000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to 400% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC123) 2. Approved by BSI, BS-EN60065, file No. 7087, BSEN60950 file No. 7409, (as model No. PC123) 3. Approved by SEMKO, EN60065, EN60950, (as model No. PC123) 4. Approved by DEMKO, EN60065, EN60950 (as model No. PC123) 5. Approved by NEMKO, EN60065, EN60950, (as model No. PC123) 6. Approved by FIMKO, EN60065, EN60950, (as model No. PC123) 7. Recognized by CSA file No. CA95323 (as model No. PC123) 8. Approved by VDE (DIN EN60747-5-2(∗)) (as an option), file No. 40008087 (as model No. PC123) 9. Package resin : UL flammability grade (94V - 0) ■ Features 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 8. Lead-free and RoHS directive compliant (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Applications 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different potentials and impedances 4. Over voltage detection Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A02904EN Date Sep. 1. 2006 © SHARP Corporation PC123J00000F Series ■ Internal Connection Diagram 1 1 4 2 3 2 3 4 Anode Cathode Emitter Collector ■ Outline Dimensions (Unit : mm) 1.2±0.3 4.58±0.30 4 PC123 3 Date code 1 4 PC123 4 2 7.62±0.30 3.5±0.5 Epoxy resin 3.0±0.5 3.5±0.5 3.0±0.5 2.7 2.7 ±0.5 Epoxy resin 0.26±0.10 4.58±0.30 0.5TYP. 4.58±0.30 7.62±0.30 VDE idenfication mark 0.26±0.10 0.5±0.1 0.5±0.1 θ θ θ θ θ : 0 to 13˚ θ : 0 to 13˚ Product mass : approx. 0.23g Product mass : approx. 0.23g 3. Wide Through-Hole Lead-Form [ex. PC123FJ0000F] 2 4 PC123 ±0.25 ±0.30 3 1 2.54 0.6 ±0.2 Date code 3 4.58 PC123 ±0.3 ±0.25 4 1.2 1 Factory identification mark Rank mark Anode mark 2.54 ±0.2 0.6 ±0.3 1.2 Date code 2 4. Wide Through-Hole Lead-Form (VDE option) [ex. PC123FYJ000F] Factory identification mark Rank mark Anode mark ±0.1 4.58 6.5±0.3 1.0 ±0.30 ±0.30 VDE idenfication mark ±0.30 ±0.30 ±0.30 7.62 4.58 4.58 2.7MIN. 3.5 3.5 ±0.5 7.62 SHARP mark "S" 6.5±0.3 ±0.5 1.0 ±0.1 4 2.7MIN. 0.5TYP. 6.5±0.3 ±0.5 6.5±0.3 3 SHARP mark "S" 2.54±0.25 2 Factory identification mark 2.54±0.25 0.6±0.2 Date code 1 Rank mark Anode mark Factory identification mark 0.6±0.2 Anode mark 1.2±0.3 2. Through-Hole (VDE option) [ex. PC123YJ0000F] Rank mark 4.58±0.30 1. Through-Hole [ex. PC123J00000F] Epoxy resin Epoxy resin ±0.10 ±0.10 0.26 0.26 ±0.50 10.16 ±0.50 ±0.1 10.16 0.5 Product mass : approx. 0.23g ±0.1 0.5 Product mass : approx. 0.23g Sheet No.: D2-A02904EN 2 PC123J00000F Series (Unit : mm) 3 Factory identification mark Date code 4 1 PC123 4 2 4.58±0.30 0.6±0.2 1.2±0.3 4.58±0.30 PC123 2.54±0.25 4 1 2 Rank mark Anode mark Factory identification mark Date code 0.6±0.2 1.2±0.3 Rank mark Anode mark 6. SMT Gullwing Lead-Form (VDE option) [ex. PC123PYJ000F] 2.54±0.25 5. SMT Gullwing Lead-Form [ex. PC123PJ0000F] 3 SHARP mark "S" 6.5±0.3 ±0.3 VDE idenfication mark 6.5 4.58±0.30 7.62±0.30 0.26 3.5±0.5 0.35±0.25 4.58±0.30 2.54±0.25 1.0+0.4 −0.0 Epoxy resin 1.0+0.4 −0.0 ±0.10 3.5±0.5 0.26±0.10 0.35±0.25 7.62±0.30 2.54±0.25 1.0+0.4 −0.0 Epoxy resin 1.0+0.4 −0.0 10.0+0.0 −0.5 10.0+0.0 −0.5 Product mass : approx. 0.22g Product mass : approx. 0.22g 7. Wide SMT Gullwing Lead-Form [ex. PC123FPJ000F] 8. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC123ZYJ000F] Rank mark Factory identification mark SHARP mark "S" VDE idenfication mark 6.5 2.54±0.25 4.58±0.30 7.62±0.30 0.5±0.1 ±0.25 0.75 12.0MAX 3.5±0.5 10.16 3 ±0.3 0.25±0.25 0.75 0.6 3.5±0.5 0.26±0.10 0.25 ±0.25 Epoxy resin ±0.50 PC123 4 4.58±0.30 7.62±0.30 ±0.25 2 4 0.26±0.10 3 1.0 6.5±0.3 ±0.2 1.2±0.3 4.58±0.30 PC123 Date code 1 ±0.1 1.0±0.1 2 4 2.54±0.25 0.6±0.2 1.2±0.3 Date code 1 Factory identification mark Anode mark 4.58±0.30 Rank mark Anode mark Epoxy resin ±0.25 0.75 ±0.50 10.16 0.5±0.1 ±0.25 0.75 12.0MAX Product mass : approx. 0.22g Product mass : approx. 0.22g Sheet No.: D2-A02904EN 3 PC123J00000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark and Plating material Factory identification Mark Country of origin Plating material Japan SnCu (Cu : TYP. 2%) Indonesia SnBi (Bi : TYP. 2%) no mark SnCu (Cu : TYP. 2%)* or China SnCu (Cu : TYP. 2%) * Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%). ** This factory making is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Rank mark Refer to the Model Line-up table Sheet No.: D2-A02904EN 4 PC123J00000F Series ■ Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation *2 Isolation voltage Viso (rms) Topr Operating temperature Tstg Storage temperature *3 Soldering temperature Tsol Rating 50 1 6 70 70 6 50 150 200 5.0 −30 to +100 −55 to +125 260 (Ta=25˚C) Unit mA A V mW V V mA mW mW kV ˚C ˚C ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s ■ Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF IR Reverse current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance fc Cut-off frequency tr Rise time Response time tf Fall time Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100Ω, −3dB VCE=2V, IC=2mA, RL=100Ω MIN. − − − − 70 6 2.5 − 5×1010 − − − − TYP. 1.2 − 30 − − − − 0.1 1×1011 0.6 80 4 3 MAX. 1.4 10 250 100 − − 20 0.2 − 1.0 − 18 18 (Ta=25˚C) Unit V µA pF nA V nA mA V Ω pF kHz µs µs Sheet No.: D2-A02904EN 5 PC123J00000F Series ■ Model Line-up Lead Form Package DIN EN60747-5-2 Model No. Lead Form −−−−−− PC123J00000F PC123AJ0000F PC123BJ0000F PC123CJ0000F PC123SJ0000F SMT Gullwing Package DIN EN60747-5-2 Model No. Wide Through-Hole Sleeve IC [mA] Rank mark (IF=5mA, VCE=5V, Ta=25˚C) 100pcs/sleeve Approved −−−−−− Approved PC123FJ0000F PC123FYJ000F with or without 2.5 to 20.0 PC123YJ0000F A PC123F1J000F PC123FY1J00F PC123Y1J000F 2.5 to 7.5 B PC123F2J000F PC123FY2J00F PC123Y2J000F 5.0 to 12.5 No mark PC123F5J000F PC123FY5J00F PC123Y5J000F 10.0 to 20.0 S PC123YSJ000F PC123FSJ000F PC123FY8J00F 5.0 to 10.0 Through-Hole −−−−−− PC123PJ0000F PC123P1J000F PC123P2J000F PC123P5J000F PC123PSJ000F Wide SMT Gullwing Taping IC [mA] Rank mark (IF=5mA, VCE=5V, Ta=25˚C) 2 000pcs/reel Approved −−−−−− Approved PC123PYJ000F PC123FPJ000F PC123ZYJ000F with or without 2.5 to 20.0 A PC123PY1J00F PC123FP1J00F PC123ZY1J00F 2.5 to 7.5 B 5.0 to 12.5 PC123PY2J00F PC123FP2J00F PC123ZY2J00F No mark 10.0 to 20.0 PC123PY5J00F PC123FP5J00F PC123ZY5J00F S 5.0 to 10.0 PC123PY8J00F PC123FP8J00F PC123ZY8J00F Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A02904EN 6 PC123J00000F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 −30 0 25 50 55 75 100 80 70 60 40 20 0 −30 125 0 Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 −30 100 125 0 25 50 75 100 200 150 100 50 0 −30 125 0 25 50 Fig.5 Peak Forward Current vs. Duty Ratio Forward current IF (mA) 50˚C 1 000 100 10−1 125 Ta=75˚C Pulse width≤100µs Ta=25˚C 10−2 100 Fig.6 Forward Current vs. Forward Voltage 10 000 10−3 75 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) 10 75 250 Total Power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 55 Fig.4 Total Power Dissipation vs. Ambient Temperature 250 Peak forward current IFM (mA) 25 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) −25˚C 10 1 1 Duty ratio 25˚C 0˚C 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Forward voltage VF (V) Sheet No.: D2-A02904EN 7 PC123J00000F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 300 VCE=5V Ta=25˚C 250 54 Collector current IC (mA) Current transfer ratio CTR (%) Ta=25˚C 60 200 150 100 PC (MAX.) 48 42 36 30 mA 30 I F= 24 18 mA 20 I F= IF=10mA 12 50 IF=5mA 6 0 0 0.1 1 10 100 0 Forward current IF (mA) Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 50 25 50 75 5 6 7 8 10 0.12 0.10 0.08 0.06 0.04 0.02 0.00 −30 100 0 20 40 60 80 100 Ambient temperature Ta (˚C) Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Response Time vs. Load Resistance 1 000 VCE=50V VCE=2V IC=2mA Ta=25˚C −6 10 100 −7 Response time (µs) Collector dark current ICEO (A) 9 IF=20mA IC=1mA 0.14 Ambient temperature Ta (˚C) 10−5 4 0.16 IF=5mA VCE=5V 0 3 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 100 0 −30 2 Collector-emitter voltage VCE (V) Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 1 10 10−8 10−9 tr tf 10 td 1 ts 10−10 10−11 −30 0 20 40 60 80 0.1 0.01 100 0.1 1 10 100 Load resistance (kΩ) Ambient temperature Ta (˚C) Sheet No.: D2-A02904EN 8 PC123J00000F Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response 5 VCC 0 Output RL RD Output 10% Voltage gain Av (dB) Input VCE=5V IC=2mA Ta=25˚C Input 90% VCE td ts tr tf Please refer to the conditions in Fig.12. −5 −10 RL=10kΩ 1kΩ 100Ω −15 −20 0.1 1 10 100 1 000 Frequency (kHz) Collector-emitter saturation voltage VCE (sat) (V) Fig.15 Collector-emitter Saturation Voltage vs. Forward Current Ta=25˚C 5.0 IC=0.5mA 1mA 3mA 5mA 7mA 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 2 4 6 8 10 12 14 16 18 20 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A02904EN 9 PC123J00000F Series ■ Design Considerations ● Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. ● Recommended Foot Print (reference) SMT Gullwing lead-form Wide SMT Gullwing lead-form 10.2 1.7 1.7 2.54 2.54 8.2 2.2 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A02904EN 10 PC123J00000F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A02904EN 11 PC123J00000F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive. •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A02904EN 12 PC123J00000F Series ■ Package specification ● Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 ±2 5.8 10.8 520 6.7 (Unit : mm) 2. Wide Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 15.0 ±2 5.9 10.8 520 6.35 (Unit : mm) Sheet No.: D2-A02904EN 13 PC123J00000F Series ● Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions D F J G I H X. MA H A B C E Dimensions List A B 16.0±0.3 7.5±0.1 H I ±0.1 10.4 0.40±0.05 5˚ K C 1.75±0.10 J 4.2±0.1 D 8.0±0.1 K 5.1±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0.0 Reel structure and Dimensions e d c g Dimensions List a b φ330 17.5±1.5 e f φ23±1 2.0±0.5 f a b (Unit : mm) c d φ100±1 φ13.0±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A02904EN 14 PC123J00000F Series 2. Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G E I J 5˚ M . AX H H A B C K Dimensions List A B 24.0±0.3 11.5±0.1 H I 12.4±0.1 0.40±0.05 C 1.75±0.10 J 4.1±0.1 D 8.0±0.1 K 5.1±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0.0 Reel structure and Dimensions e d c g Dimensions List a b φ330 25.5±1.5 e f φ23±1 2.0±0.5 f a b (Unit : mm) c d ±1 φ100 φ13.0±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A02904EN 15 PC123J00000F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E180] Sheet No.: D2-A02904EN 16