SHOULDER HDF1220A1

SHOULDER ELECTRONICS LIMITED
SAW Components Data Sheet
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF1220A1 SMD-7
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
DATE
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日 期:
2007-01-25
Page: 1
SHOULDER ELECTRONICS LIMITED
1. SCOPE
This specification shall cover the characteristics of SAW filter With F1220A1S7 used
digital television
2. ELECTRICAL SPECIFICATION
Dc voltage VDC>
Operation temperature
Storage temperature
RF Power dissipation
Electronic Characteristics
0V
-40°C~+85°C
-40°C~+85°C
0 dBm(source impedance 200Ω)
2-1.Typical frequency response
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2-2.Electrical characteristics
Operating temperature range: T = –40 °C ... +85 °C
Terminating source impedance: ZS = 200 Ω
Terminating load impedance: ZL = 200 Ω
Part number
Nominal frequency
Maximum insertion attenuation
1216~1224MHz
Amplitude ripple in passband
1216~1224MHz
Attenuation
500~f0-91.0MHz
f0-91.0~ f0-85.0MHz
f0-76.0~ f0-68.0MHz
f0-88.0MHz
f0-72.0MHz
f0-44.0MHz
f0-36.0MHz
f0+70.0MHz~2000MHz
min
-
typ
1220.0
max
-
unit
MHz
-
3.6
4.2
dB
0.6
1.2
dB
58
58
56
58
56
46
42
56
62
62
60
62
60
54
44
62
-
-
15
-
-
dB
Group delay riple
1216~1224MHz
ns
3. TEST CIRCUIT
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4. DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -45℃for 30 minutes. Following by a
high temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30
Minutes. Then release the device into the room conditions for 1 to 2 hours prior to the
measurement. It shall meet the specifications in table 1.
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1
sec. Then release the device into the room conditions for 4 hours. It shall meet the
specifications in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More
than 95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times.
the filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in
table 1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
component.
Please avoid ultrasonic cleaning
6.3 Soldering
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Only leads of component may be soldered. Please avoid soldering another part of
component.
7. Packing
7.1 Dimensions
(1) Carrier Tape: Figure 1
(2) Reel: Figure 2
(3) The product shall be packed properly not to be damaged during transportation and
storage.
7.2 Reeling Quantity
1000 pcs/reel 7’’
3000 pcs/reel 13’’
7.3 Taping Structure
(1) The tape shall be wound around the reel in the direction shown below.
(2) Label
Device Name
User Product Name
Quantity
Lot No.
(3) Leader part and vacant position specifications.
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8. TAPE SPECIFICATIONS
8.1 Tensile Strength of Carrier Tape: 4.4N/mm width
8.2 Top Cover Tape Adhesion (See the below figure)
(1) pull off angle: 0~15º
(2) speed: 300mm/min.
(3) force: 20~70g
[Figure 1] Carrier Tape Dimensions
[Unit:mm]
W
F
12.00
5.50
±0.30
±0.10
E
1.75
±0.10
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P0
P1
P2
4.00
4.00
2.00
±0.10
±0.10
±0.10
D0
Ø1.50
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D1
t1
t2
A
B
Ø1.5
0.31
1.30
3.4
3.4
±0.25
±0.05
±0.10
MAX.
MAX
SHOULDER ELECTRONICS LIMITED
[Figure 2]
[Unit:mm]
A
B
C
D
E
W
t
r
Ø330
Ø100
Ø13
Ø21
2
13
3
1.0
±1.0
±0.5
±0.5
±0.8
±0.5
±0.3
max.
max.
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