SC91710A/B T/P SWITCHABLE DIALER WITH REDIAL HANDFREE FUNCTION DESCRIPTION The SC91710A/B are Tone/Pulse switchable dialer which are fabricated in COMS technology with wide operating voltage for both tone and pulse mode, and consumes very low memory retention current in ON-HOOK state. FEATURES * Tone/Pulse switchable dialer * One 32-digit last number redial memory * Pulse-to-tone (P→T) is provided for PBX operation * Flash key is available * Minimum tone duration is 98ms or 83ms * Minimum intertone pause is 98ms or 83ms * Redial Pause time (0ms) * Uses 3.579549MHz crystal or ceramic resonator * Many options can be selected ORDERING INFORMATION Device SC91710A Package DIP-16-300-2.54 Mode (10PPS; 20PPS; Tone) SC91710AS SOP-16-225-1.27 M/B ratio (40:60;33:66) SC91710B DIP-18-300-2.54 Pause time (3.6s) * Flash function (RESET) (P→T) pause time (3.6s) Flash time (600ms; 300ms; 100ms; or 80ms) * Power on reset circuit is provided * Handfree function is provided for speaker phone application * Packaged in 16-DIP or 18-DIP HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 1 of 18 SC91710A/B LNB memory Kernel Control CKT. BLOCK DIAGRAM KEYBOARD ASSIGNMENT C1 C2 C3 C4 R1 1 2 3 P→T R2 4 5 6 F R3 7 8 9 P R4 * 0 # RD 1) P→T: In pulse mode, execute P→T function. 2) P: Pause key. 3) F: Flash key 4) RD: Redial key DIALING SIGNAL OPTION A: Flash time B: Row1 Row2 MODE PULSE RATE M/B 600 R NR TONE -- -- R 300 R R TONE -- -- R NR 100 NR NR PULSE 20PPS 40:60 R R 80 NR R PULSE 20PPS 33:66 UR NR PULSE 10PPS 40:60 UR R PULSE 10PPS 33:66 Row3 Row4 NR NR NR Flash time(ms) C: Tone function Col1 Tone Duration Inter-Tone Pause NR 98ms 98ms R 83ms 83ms Note: NR: no resistance R: A resistance connect to VSS (820kΩ typically) UR: A resistance connect to VDD HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 2 of 18 SC91710A/B ABSOLUTE MAXIMUM RATING(Tamb=25°C, All voltage referenced to VSS, unless otherwise specified) Characteristics Symbol Ratings Unit Power Supply Voltage VDD 6.0 V Input Voltage VIN -0.3~VDD+0.3 V Power Dissipation PD 500 mW Operating Temperature Topr -25~+70 °C Storage Temperature Tstg -55~+150 °C ELECTRICAL CHARACTERISTICS(Tamb=25°C, VDD=2.5V, fosc=3.579545MHz, unless otherwise specified) Characteristics Symbol Conditions Min. Typ. Max. Tone 2.5 -- 5.5 Pulse 2.0 -- 5.5 Memory retention 1.0 Unit DC Characteristics Operating Voltage Operating Current VDD IOP V 5.5 Tone OFF-HOOK, -- 0.6 2 Pulse Keypad entry -- 0.2 0.5 -- 0.1 1 µA -- 0.1 0.2 µA ON-HOOK No keypad mA Standby Current IS Memory Retention Current Imr ON-HOOK VDD=1.0V Control Pin Input Low Voltage Vil -- VSS 0.3VDD Control Pin Input High Voltage Vih -- 0.7VDD VDD XMUTE Pin Leakage Current Imth V XMUTE =6.0V -- -- 1 µA XMUTE Pin Sink Current Imtl V XMUTE =0.5V 0.2 0.5 -- mA HKS Pin Input Current Ihks Vhks=2.5V -- -- 0.1 µA Keyboard Drive Current Ikbd Vn=0V note1 4 10 30 Scanning Pin Sink Current Ikbs Vn=2.5 note1 200 400 800 Key-in Debounce Time tDB -- -- 20 -- ms HFI pin input resistor Rhfi VDD=2.5 -- 200 -- kΩ HFO pin drive current Ihdoh Vhfo=2.0V 0.5 -- -- mA HFO pin sink current Ihdol Vhfo=2.5V 0.5 -- -- mA Pulse Output Pin Leakage Current Ipoh Vpo=2.5V 0.1 -- -- µA Pulse Output Pin Sink Current Ipol Vpo=0.5V 0.5 -- -- mA Pulse Rate fpr -- 10 -- -- 20 -- -- 40:60 -- -- 33:66 -- M/B ratio=40:60 -- 40 -- M/B ratio=33:66 -- 33 -- entry V µA Pulse Mode Make/Break Ratio Pre-digit Pause tM tB tPDP pps % ms (To be continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 3 of 18 SC91710A/B (Continued) Characteristics Inter-digit Pause Symbol tIDP Conditions Min. Typ. Max. Unit Pulse rate=10pps -- 800 -- Pulse rate=20pps -- 500 -- 0.5VDD -- 0.7VDD V Vdtmf=0.5V 0.2 -- -- mA Row group RL=10KΩ 130 155 170 mVrms Dist.≤ -23dB 10 -- -- KΩ 1 2 3 dB ms Tone Mode DC Level Tone Vdc Sink Current Output Pin AC level DTMF Signal VDD=2.0V~5.5V Itl Vdtmf Load Resistor RI Pre-emphasis twist Distortion(note 2) VDD=2.0~5.5 V, Column-Row group Dist. RL=10KΩ -- -30 -23 dB Minimum tone duration Time tTD Auto redial -- 98/83 -- ms Minimum Intertone Pause Time tITP Auto redial -- 98/83 -- ms Note: 1. Vn: Input voltage of any keyboard scanning pin (Row group, Column group) 2 Distortion (dB) = 20log{[V12+V22+V32+… Vn2)1/2]/[(VL2+VH2)1/2]} VL,VH: Row group and Column group signal , V1 V2… Vn: Harmonic signal (BW = 300Hz~3500Hz) ACTUAL FREQUENCY OUTPUT (fosc=3.579545MHz) Keyboard Scanning Pin Standard(Hz) Output Deviation(%) R1 f1 697 699 +0.28 R2 f2 770 766 -0.52 R3 f3 852 848 -0.47 R4 f4 941 948 +0.74 C1 f5 1209 1216 +0.57 C2 f6 1336 1332 -0.30 C3 f7 1477 1472 -0.34 PIN CONFIGURATION HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 4 of 18 SC91710A/B PIN DESCRIPTION Pin No. SC91710A/AS SC91710B 4 4 Pin Name Description * Provides keyboard scanning. C1 * HKS pin is LOW, the column group stays in “HIGH”state and row group stays in “LOW”state. * The keypad is compatible with the standard dual contact matrix 1 1 2 2 C2 C3 keyboard (as figure1b), the inexpensive single contact keyboard (as figure 1a), and electronic input (as figure 1c). * When HKS is “LOW”, a valid key entry is defined by related Row & Column connection or by electronic input (as shown in figure 1c). 3 3 C4 * Activation of two or more keys will result in no response, except for single key. * To avoid keyboard-bouncing error, this chip provides built-in 14 16 R1 debounce circuit. (The debounce time = 20ms) Row 15 17 R2 Column Figure1a: Single contact form keyboard configuration 16 18 Row Column R3 Figure1b: Dual contact form keyboard configuration Row VDD VSS Column 13 15 R4 VDD VSS Figure1c: Electronic signal input keyboard configuration * Oscillator input & output pins. 5 5 OSCI * The 3.579545MHz oscillator is formed by a built-in inverter inside of this chip and by connecting a 3.579545MHz crystal or a ceramic resonator across the OSCI and OSCO pins. (built-in 6 6 OSCO feedback resistor and capacitor) * When HKS is “LOW”, a valid key-in may turn on this oscillator and generates a 3.579545 MHz clock. * Mute output pins. * NMOS open drain output structure. 7 7 XMUTE * The output is in “LOW”state during dialing sequence (both Pulse and Tone mode) otherwise this pin is “high-impedance”. * Long (continue) Mute. 8 8 VSS * Negative power supply pin. 9 11 VDD * Positive power supply pin. (To be continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 5 of 18 SC91710A/B (Continued) Pin No. SC91710A SC91710B Pin Name Description * Hook switch input pin. * When the handset is in ON-HOOK state, this pin must be pulled 10 12 HKS “high”in order to disable the dialing operation and decrease the power consumption. * When in OFF-HOOK state, the HKS pin must be pulled “low”state for all function operation. * Pulse output signal pin. 11 13 PO * NMOS open drain output structure. * The output is “LOW”during pulse dialing and Flash operation, otherwise this output is “floating”. * Dual Tone Multi-frequency output pin. * In TONE mode, when an entry of digit key (include *, # key), this pin will send out a corresponding DTMF signal. 12 14 TONE * The TONE pin provides minimum tone duration and minimum intertone pause time to support rapid key-in. If key-in time is less than 100ms, DTMF signal will last for 100ms; otherwise the tone duration will last as long as the key is pressed. * Handfree input control pin. * Toggle input structure, falling edge trigger. 9 HFI * It is used to enable and disable Handfree function. * With waveshaped by a built-in Schmit trigger, the bounce of input can be eliminated by external R, C debounce circuit. * A built-in pull down resistor is 200k typical. * Handfree output control pin. * Inverter output structure (normally ‘ low’ , active ‘ high’ ). * When a HFI pin is active, Handfree function will be enabled (HFO=1) 10 HFO or disable (HFO=0). * When the Handfree function is enable (HFO=1), after OFF-HOOK action, it can reset Handfree function and HFO pin return to ‘ low’ state. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 6 of 18 SC91710A/B KEYBOARD OPERATION Symbol definitions: a) ↑ : OFF-HOOK or enable Hand Free function. b) ↓ : ON-HOOK or disable Hand Free function. c) : Input level from low to high. d) : Input level from high to low. e) D1~Dn : Digit key 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (C1~Cn is same as D1~Dn). f) Dp1~Dpn : Pulse digit 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, (Cp1~Cpn is same as Dp1~Dpn). g) Dt1~Dtn : Tone digit 1, 2, 3, 4, 5, 6, 7, 8, 9, 0, *, #, (Ct1~Ctn is same as Dt1~Dtn). h) tF : Flash time. i) tP : Pause time. j) tPT : Pulse to Tone wait time. k) tFP : Pause time for flash. l) tRP : Pause time for redial. m) LNB : Last number redial buffer. A Normal Dialing 1. Digit Dialing Procedure : ↑ D1, D2… , Dn↓ Dial out : Dt1, Dt2… , Dtn (in Tone mode) Dial out : Dp1, Dp2,… , Dpn (in Pulse mode) LNB : D1, D2… , Dn 2. Dialing with flash key : ↑ F, D1, D2… , Dn ↓ Dial out : tF, tFP, Dt1, Dt2… , Dtn (in Tone mode) Dial out : tF, tFP, Dp1, Dp2, … , Dpn (in Pulse mode) Procedure LNB D1, D2… , Dn 3. Dialing with P→T key Procedure : ↑ D1, D2 … , P→T , … , Dn ↓ Dial out : Dp1, Dp2, … , tPT, … , Dpn (in Pulse mode) LNB : D1, D2 … , P→T , … , Dn Note: If key in digit over maximum digit stored in LNB, then RD is inhibit even after on/off hook. B Redial LNB : D1, D2… , Dn Procedure : ↑ RD ↓ Dial out : tRP, Dt1, Dt2… , Dtn (in Tone mode) Dial out : tRP, Dp1, Dp2,… , Dpn (in Pulse mode) Note: If key in digit over maximum digit stored in LNB, then RD is inhibit. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 7 of 18 SC91710A/B C Pause Function Procedure : ↑ D1, D2… , Dn, P, C1 … , Cn ↓ Dial out : Dt1, Dt2 ,… , Dtn, tP, Ct1, Ctn (in Tone mode) Dial out : Dp1, Dp2, … Dpn , tP, Cp1 … , Cpn (in Pulse mode) LNB : D1, D2… , Dn, P , C1, C2 … , Cn Procedure : ↑ D1, D2… , Dn, F, C1 … , Cn ↓ Dial out : Dt1, Dt2,… , Dtn , t F, tFP, Ct1 … , Ctn (in Tone mode) Dial out : Dp1, Dp2,… , Dpn , tF, tFP, Cp1 … , Cpn (in Pulse mode) LNB : C1, C2 … , Cn D Flash Function 1. Reset Handfree Function operation: A) To execute Handfree function: When HFO = ’ low’ , HFI pin is active, the Handfree function will be enabled (HFO = ’ high’ ) B) Reset Handfree function: a. OFF-HOOK action. b. When HFO = ’ high’ , a HFI pin is active again, the Handfree function will be reset (HFO=’ low’ ). Operating flow chart of Handfree STATE NO. PO XMUTE HFO (0) INITIAL STATE F F 0 (1) ON HKS HF LINE F F 1 (2) OFF HKS LINE F F 0 (3) OFF HKS HF LINE F F 1 HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn * F: Floating (Hi-impedance) REV:2.2 2007.03.07 Page 8 of 18 SC91710A/B TEST CIRCUIT Note: 1. Dist. (dB)=20log{[V12+V22+V32+… Vn2)1/2]/[(VL2+VH2)1/2]} a. V1… Vn are extraneous frequencies (ie, inter modulation and harmonic), components in the 500Hz to 3400Hz band. b. VL,VH are the individual frequency components of DTMF signal. c. Whether keyboard is pushed refer to the TONE mode time diagram. 2. Sink current Isink=I/(1-Duty Cycle), I is the net DC current measured from ampere meter. 3. R*, C* mean other column and row. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 9 of 18 SC91710A/B TIMING DIAGRAMS HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 10 of 18 SC91710A/B TIMING DIAGRAMS(continued) HKS KEY IN F tDB XMUTE PO tF TONE OSCO ......High impedance Flash key operating timming HKS 3 2 RD KEY IN tDB XMUTE PO tITP tITP tITP tITP TONE tD OSCO ......High impedance Tone Mode Redial Timming Diagram HKS 3 2 RD KEY IN tDB XMUTE tRP tIDP tIDP PO tIDP tIDP TONE OSCO ......High impedance Pulse Mode Redial Timming Diagram HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 11 of 18 SC91710A/B TIMING DIAGRAMS(continued) HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 12 of 18 SC91710A/B TYPACAL APPLICATION CIRCUIT HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 13 of 18 SC91710A/B TYPACAL APPLICATION CIRCUIT HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 14 of 18 SC91710A/B CHIP TOPOGRAPHY Size: 1.45 x 1.54 mm2 PAD COORDINATES (Unit: µm) No. Symbol X Y No. Symbol X Y 1 P1 -542.6 -238.0 10 P10 562.4 88.5 2 P2 -542.6 -468.1 11 P11 562.4 252.4 3 P3 -542.6 -602.5 12 P12 562.4 445.8 4 P4 -315.0 -602.5 13 P13 562.4 603.8 5 P5 -134.8 -602.5 14 P14 148.6 603.8 6 P6 85.5 -602.5 15 P15 -22.4 603.8 7 P7 562.4 -439.1 16 P16 -251.0 603.8 8 P8 562.4 -277.6 17 P17 -542.6 124.7 9 P9 562.4 -93.6 18 P18 -542.6 -102.9 Note: The original point of the coordinate is the die center. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 15 of 18 SC91710A/B PACKAGE OUTLINE DIP-16-300-2.54 UNIT: mm SOP-16-225-1.27 UNIT: mm HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 16 of 18 SC91710A/B PACKAGE OUTLINE(Continued) DIP-18-300-2.54 UNIT: mm 2.54 1.52 15 Degree 23.12±0.3 0.5MIN 0.46 1.27MAX HANDLING MOS DEVICES: Electrostatic charges can exist in many things. All of our MOS devices are internally protected against electrostatic discharge but they can be damaged if the following precautions are not taken: • Persons at a work bench should be earthed via a wrist strap. • Equipment cases should be earthed. • All tools used during assembly, including soldering tools and solder baths, must be earthed. • MOS devices should be packed for dispatch in antistatic/conductive containers. HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:2.2 2007.03.07 Page 17 of 18