TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 50 mA, 24 V, 3.2 µA Supply Current Low-Dropout Linear Regulator in SC70 Package FEATURES APPLICATIONS • • • • • • • • • • • • • 24-V Maximum Input Voltage Low 3.2-µA Quiescent Current at 50 mA Stable With Any Capacitor (≥ 0.47 µF) 50-mA Low-Dropout Regulator Available in 1.8 V, 1.9 V, 2.3 V, 2.5 V, 3.0 V, 3.3 V, 3.45 V, 5.0 V, and Adjustable (1.2 V to 15 V) Designed to Support MSP430 Families: – 1.9 V version ensured to be higher than minimum VIN of 1.8 V – 2.3 V version ensured to meet 2.2 V minimum VIN for FLASH on MSP430F2xx – 3.45 V version ensured to be lower than maximum VIN of 3.6 V – Wide variety of fixed output voltage options to match VIN to the minimum required for desired MSP430 speed Minimum/Maximum Specified Current Limit 5-Pin SC70/SOT-323 (DCK) Package -40°C to +125°C Specified Junction Temperature Range For 80mA Rated Current and Higher Power Package, see TPS715Axx DESCRIPTION The TPS715xx low-dropout (LDO) voltage regulators offer the benefits of high input voltage, low-dropout voltage, low-power operation, and miniaturized packaging. The devices, which operate over an input range of 2.5 V to 24 V, are stable with any capacitor (≥ 0.47 µF). The low dropout voltage and low quiescent current allow operations at extremely low power levels. Therefore, the devices are ideal for powering battery management ICs. Specifically, since the devices are enabled as soon as the applied voltage reaches the minimum input voltage, the output is quickly available to power continuously operating battery charging ICs. The usual PNP pass transistor has been replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the low dropout voltage, typically 415 mV at 50 mA of load current, is directly proportional to the load current. The low quiescent current (3.2 µA typically) is stable over the entire range of output load current (0 mA to 50 mA). DCK PACKAGE (TOP VIEW) FB/NC 1 GND 2 NC 3 Ultra Low Power Microcontrollers Cellular/Cordless Handsets Portable/Battery-Powered Equipment IN 5 OUT 4 IN Solar Cell TPS715xx OUT GND MSP430 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2005, Texas Instruments Incorporated TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) VOUT (2) PRODUCT TPS715xxyyyz (1) (2) XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable). YYY is package designator. Z is package quantity. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Output voltages from 1.25V to 5.4V in 50mV increments are available through the use of innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability. ABSOLUTE MAXIMUM RATINGS over operating temperature range (unless otherwise noted) (1) (2) UNIT VIN range -0.3 V to 24 V Peak output current Internally limited ESD rating, HBM 2 kV ESD rating, CDM 500 V Continuous total power dissipation See Dissipation Rating Table Junction temperature range, TJ -40°C to +150°C Storage temperature range, Tstg -65°C to +150°C (1) (2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. DISSIPATION RATING TABLE BOARD PACKAGE RθJC°C/W RθJA°C/W DERATING FACTOR ABOVE TA = 25°C TA ≤ 25°C POWER RATING TA = 70°C POWER RATING TA = 85°C POWER RATING Low-K (1) DCK 165 395 2.52 mW/°C 250 mW 140 mW 100 mW High-K (2) DCK 165 315 3.18 mW/°C 320 mW 175 mW 130 mW (1) (2) 2 The JEDEC Low-K (1s) board design used to derive this data was a 3 inch x 3 inch, two-layer board with 2 ounce copper traces on top of the board. The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1 ounce internal power and ground planes and 2 ounce copper traces on top and bottom of the board. TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 ELECTRICAL CHARACTERISTICS over operating junction temperature range (TJ = -40°C to 125°C), VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 1 µF unless otherwise noted. Typical values are at TJ = 25°C. PARAMETER TEST CONDITIONS Input voltage (1) VIN Over VIN, IOUT, and T Ground pin current IGND TYP UNIT 24 IO = 50 mA 3 24 1.2 15 V -4.0 +4.0 % VIN + 1.0 V ≤ VIN ≤ 24 V 100 µA ≤ IOUT ≤ 50 mA 0 ≤ IOUT ≤ 50 mA, TJ = -40°C to +85°C 3.2 4.2 0 mA ≤ IOUT ≤ 50 mA 3.2 4.8 0 mA ≤ IOUT ≤ 50 mA, VIN = 24 V ∆VOUT/∆IOUT IOUT = 100 µA to 50 mA 22 Output voltage line regulation (1) ∆VOUT/∆VIN VOUT + 1 V < VIN ≤ 24 V 20 Output noise voltage Vn BW = 200 Hz to 100 kHz, COUT = 10 µF, IOUT = 50 mA Output current limit ICL VO = 0 V Power-supply ripple rejection PSRR f = 100 kHz, COUT = 10 µF Dropout voltage VIN = VOUT(NOM) - 1 V VDO IOUT = 50 mA V µA 5.8 Load regulation (1) MAX 2.5 VOUT voltage range (TPS71501) VOUT accuracy (1) MIN IO = 10 mA mV 60 575 125 µVrms 750 60 415 mV mA dB 750 mV Minimum VIN = VOUT + VDO or the value shown for Input voltage in this table, whichever is greater. 3 TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION V(OUT) V(IN) Current Sense ILIM _ R1 + GND FB R2 Vref = 1.205 V Bandgap Reference FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION V(OUT) V(IN) Current Sense ILIM _ R1 + GND R2 Vref = 1.205 V Bandgap Reference R2 = 840 kΩ Table 1. Terminal Functions TERMINAL NAME NO. FIXED FB 4 DESCRIPTION ADJ. 1 Adjustable version. This terminal is used to set the output voltage. NC 1 GND 2 2 No connection Ground NC 3 3 No connection IN 4 4 Input supply. OUT 5 5 Output of the regulator, any output capacitor ≥ 0.47 µF can be used for stability. TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 3.320 3.32 VOUT − Output Voltage − V 3.305 3.300 3.295 3.290 10 20 30 40 3.28 3.27 3.26 VIN = 4.3 V COUT = 1 µF −40 −25 −10 5 20 35 50 65 80 95 110 125 TJ − Junction Temperature − °C Figure 3. OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY OUTPUT IMPEDANCE vs FREQUENCY DROPOUT VOLTAGE vs OUTPUT CURRENT 600 VIN = 4.3 V VOUT = 3.3 V COUT = 1 µF TJ = 25°C 16 6 IOUT = 50 mA 4 3 2 14 12 V DO − Dropout Voltage − mV VIN = 4.3 V VOUT = 3.3 V COUT = 1 µF IOUT = 1 mA 10 8 6 IOUT = 1 mA 4 2 1 0 100 1k 10 k f − Frequency − Hz 100 k VIN = 3.2 V COUT = 1 µF 500 TJ = 125°C 400 TJ = 25°C 300 200 TJ = −40°C 100 IOUT = 50 mA 0 10 100 1k 10k 100k 1M 0 10 M 0 f − Frequency − Hz 10 20 30 40 IOUT − Output Current − mA Figure 4. Figure 5. Figure 6. TPS71501 DROPOUT VOLTAGE vs INPUT VOLTAGE DROPOUT VOLTAGE vs JUNCTION TEMPERATURE POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY 1 600 IOUT = 50 mA VIN = 3.2 V 0.8 V DO − Dropout Voltage − mV 0.9 TJ = 125°C 0.7 TJ = 25°C 0.6 0.5 0.4 TJ = −40°C 0.3 0.2 500 IOUT = 50 mA 400 300 200 IOUT = 10 mA 100 0.1 0 0 2.5 2 18 5 3 Figure 2. 8 7 3.5 Figure 1. Zo − Output Impedance − Ω Hz µ V/ IOUT = 50 mA 3.29 VIN = 4.3 V VOUT = 3.3 V IOUT = 1 µF 4 3.30 3.25 −40 −25 −10 5 20 35 50 65 80 95 110 125 TJ − Junction Temperature − °C 50 IO − Output Current − mA Output Spectral Noise Density − IOUT = 1 mA 3 6 9 VIN − Input Voltage − V Figure 7. 12 15 0 −40 −25 −10 5 20 35 50 65 80 95 110 125 TJ − Junction Temperature − °C Figure 8. PSRR − Power Supply Ripple Rejection − dB VOUT − Output Voltage − V 3.31 3.310 0 4.5 IGND − Ground Current − µ A VIN = 4.3 V COUT = 1 µF TJ = 25°C 3.315 V DO − Dropout Voltage − V QUIESCENT CURRENT vs JUNCTION TEMPERATURE 50 100 VIN = 4.3 V VOUT = 3.3 V COUT = 10 µF TJ = 25°C 90 80 70 60 IOUT = 1 mA 50 40 30 IOUT = 50 mA 20 10 0 10 100 1k 10k 100k 1M 10 M f − Frequency − Hz Figure 9. 5 TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 TYPICAL CHARACTERISTICS (continued) LINE TRANSIENT RESPONSE VOUT − Change in Output Voltage − mV VIN − Input Voltage − V VOUT − Output Voltage − V 6 5 4 3 VIN 2 VOUT 1 0 0 2 4 6 8 10 12 14 t − Time − ms Figure 10. 6 16 18 20 VIN − Input Voltage − V VOUT = 3.3 V RL = 66 Ω COUT = 10 µF 7 VOUT = 3.3 V IOUT = 50 mA COUT = 10 µF 100 50 0 −50 5.3 4.3 0 50 100 150 200 250 300 350 400 450 500 t − Time − µs Figure 11. LOAD TRANSIENT RESPONSE VOUT − Change In Output Voltage − mV IOUT − Output Current − mV POWER UP / POWER DOWN 8 400 200 VIN = 4.3 V VOUT = 3.3 V COUT = 10 µF 0 -200 60 40 20 0 0 100 200 300 400 500 600 700 800 900 1000 t − Time − µs Figure 12. TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 APPLICATION INFORMATION The TPS715xx family of LDO regulators has been optimized for ultra-low power applications such as the MSP430 microcontroller. Its ultra-low supply current maximizes efficiency at light loads, and its high input voltage range makes it suitable for supplies such as unconditioned solar panels. VIN IN C1 0.1 µF TPS71533 OUT GND VOUT 0.47 µF Figure 13. Typical Application Circuit (Fixed Voltage Version) External Capacitor Requirements Although not required, a 0.047-µF or larger input bypass capacitor, connected between IN and GND and located close to the device, is recommended to improve transient response and noise rejection of the power supply as a whole. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the device is located several inches from the power source. The TPS715xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. Any capacitor (including ceramic and tantalum) ≥ 0.47 µF properly stabilizes this loop. X7R type capacitors are recommended but X5R and others may be used. Power Dissipation and Junction Temperature To ensure reliable operation, worst-case junction temperature should not exceed 125°C. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation: T max T A P J D(max) R JA (1) where: • TJmax is the maximum allowable junction temperature. • RθJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings table). • TA is the ambient temperature. The regulator dissipation is calculated using: P D VINV OUT I OUT (2) For a higher power package version of the TPS715xx, see the TPS715Axx. Regulator Protection The TPS715xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS715xx features internal current limiting. During normal operation, the TPS715xx limits output current to approximately 500 mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. Take care not to exceed the power dissipation ratings of the package. 7 TPS715xx www.ti.com SLVS338K – MAY 2001 – REVISED SEPTEMBER 2005 APPLICATION INFORMATION (continued) Programming the TPS71501 Adjustable LDO Regulator The output voltage of the TPS71501 adjustable regulator is programmed using an external resistor divider as shown in Figure 14. The output voltage operating range is 1.2 V to 15 V, and is calculated using: V OUT VREF 1 R1 R2 (3) where: • VREF = 1.205 V typ (the internal reference voltage) Resistors R1 and R2 should be chosen for approximately 1.5-µA divider current. Lower value resistors can be used for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended design procedure is to choose R2 = 1 MΩ to set the divider current at 1.5 µA, and then calculate R1 using: V OUT R1 1 R2 V REF (4) OUTPUT VOLTAGE PROGRAMMING GUIDE VIN IN VOUT OUT TPS71501 R1 0.1µF GND FB R2 CFB 0.47µF OUTPUT VOLTAGE R1 R2 1.8 V 0.499 MΩ 1 MΩ 2.8 V 1.33 MΩ 1 MΩ 5.0 V 3.16 MΩ 1 MΩ R1 VOUT VREF 1 R2 Figure 14. TPS71501 Adjustable LDO Regulator Programming Power the MSP430 Microcontroller Several versions of the TPS715xx are ideal for powering the MSP430 microcontroller. Table 2 shows potential applications of some voltage versions. Table 2. Typical MSP430 Applications DEVICE VOUT (TYP) TPS71519 1.9V APPLICATION VOUT, MIN > 1.800V required by many MSP430s. Allows lowest power consumption operation. TPS71523 2.3V VOUT, MIN > 2.200V required by some MSP430s FLASH operation. TPS71530 3.0V VOUT, MIN > 2.700V required by some MSP430s FLASH operation. TPS715345 2.45V VOUT, MIN < 3.600V required by some MSP430s. Allows highest speed operation. The TPS715xx family offers many output voltage versions to allow designers to minimize the supply voltage for the processing speed required of the MSP430. This minimizes the supply current consumed by the MSP430. 8 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ71525DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ71533DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ71533DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71501DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71501DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71518DCKR PREVIEW SC70 DCK 5 3000 TBD Call TI Call TI TPS71519DCKR PREVIEW SC70 DCK 5 3000 TBD Call TI Call TI TPS71523DCKR PREVIEW SC70 DCK 5 3000 TBD Call TI Call TI TPS71525DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71525DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71530DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71530DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71530QDCKRQ1 ACTIVE SC70 DCK 5 3000 CU NIPDAU Level-1-260C-UNLIM TPS71533DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71533DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS715345DCKR PREVIEW SC70 DCK 5 3000 TPS71550DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS71550DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2005 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002 DCK (R-PDSO-G5) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 5 0,10 M 4 1,40 1,10 1 0,13 NOM 2,40 1,80 3 Gage Plane 2,15 1,85 0,15 0°–8° 0,46 0,26 Seating Plane 1,10 0,80 0,10 0,00 0,10 4093553-2/D 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-203 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated