TI TPS730XX

 TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
LOW-NOISE, HIGH PSRR, RF 200-mA
LOW-DROPOUT LINEAR REGULATORS
FEATURES
DESCRIPTION
1
• 200-mA RF Low-Dropout Regulator
With Enable
• Available in Fixed Voltages from 1.8V to 3.3V
and Adjustable (1.22V to 5.5V)
• High PSRR (68dB at 100Hz)
• Ultralow-Noise (33μVRMS, TPS73018)
• Fast Start-Up Time (50μs)
• Stable With a 2.2μF Ceramic Capacitor
• Excellent Load/Line Transient Response
• Very Low Dropout Voltage (120mV at 200mA)
• 5- and 6-Pin SOT23 (DBV), and Wafer Chip
Scale (YZQ) Packages
The TPS730xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses a small SOT23 package. NanoStar™
packaging gives an ultrasmall footprint as well as an
ultralow profile and package weight, making it ideal
for portable applications such as handsets and PDAs.
Each device in the family is stable, with a small 2.2μF
ceramic capacitor on the output. The TPS730xx
family uses an advanced, proprietary BiCMOS
fabrication process to yield low dropout voltages (e.g.,
120mV at 200mA, TPS73030). Each device achieves
fast start-up times (approximately 50μs with a
0.001μF bypass capacitor) while consuming low
quiescent current (170μA typical). Moreover, when
the device is placed in standby mode, the supply
current is reduced to less than 1μA. The TPS73018
exhibits approximately 33μVRMS of output voltage
noise at 1.8V output with a 0.01μF bypass capacitor.
Applications with analog components that are
noise-sensitive, such as portable RF electronics,
benefit from the high PSRR and low-noise features
as well as the fast response time.
234
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Cellular and Cordless Telephones
Bluetooth®, Wireless LAN
Handheld Organizers, PDAs
DBV PACKAGE
(TOP VIEW)
GND
2
EN
3
5
OUT
4
NR
Fixed Option
DBV PACKAGE
(TOP VIEW)
IN
1
6
OUT
GND
2
5
FB
EN
3
4
NR
Adjustable Option
YZQ PACKAGE
(TOP VIEW)
IN
C3
A3
EN
C1
B2
A1
OUT
TPS73028
TPS73028
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
RIPPLE REJECTION
vs
FREQUENCY
0.30
100
VIN = 3.8 V
COUT = 2.2 µF
CNR = 0.1 µF
0.25
90
IOUT = 200 mA
80
Ripple Rejection (dB)
1
Output Spectral Noise Density (µV/√Hz)
IN
0.20
0.15
IOUT = 1 mA
0.10
IOUT = 200 mA
70
60
50
40
IOUT = 10 mA
30
20
0.05
VIN = 3.8 V
COUT = 10 µF
CNR = 0.01 µF
10
0
0
100
1k
10 k
Frequency (Hz)
NR
100 k
10
100
1k
10 k
100 k
1M
10 M
Frequency (Hz)
GND
Figure 1.
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth Sig, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2007, Texas Instruments Incorporated
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
TPS730xxyyyz
(1)
VOUT
XX is nominal output voltage (for example, 28 = 2.8V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted) (1)
UNIT
VIN range
–0.3V to +6V
VEN range
–0.3V to +6V
VOUT range
–0.3V to VIN + 0.3V
Peak output current
Internally limited
ESD rating, HBM
2kV
ESD rating, CDM
500V
Continuous total power dissipation
See Dissipation Ratings Table
Junction temperature range
–40°C to +150°C
Storage temperature range, Tstg
–65°C to +150°C
(1)
2
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
DISSIPATION RATINGS TABLE
TA ≤ +25°C
POWER
RATING
TA = +70°C
POWER
RATING
TA = +85°C
POWER
RATING
BOARD
PACKAGE
RθJC
RθJA
DERATING FACTOR
ABOVE TA = +25°C
Low-K (1)
DBV
65°C/W
255°C/W
3.9mW/°C
390mW
215mW
155mW
(2)
DBV
65°C/W
180°C/W
5.6mW/°C
560mW
310mW
225mW
Low-K (1)
YZQ
27°C/W
255°C/W
3.9mW/°C
390mW
215mW
155mW
High-K (2)
YZQ
27°C/W
190°C/W
5.3mW/°C
530mW
296mW
216mW
High-K
(1)
(2)
The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3-inch, two layer board with 2 ounce copper traces on top
of the board.
The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch × 3-inch, multilayer board with 1 ounce internal power and
ground planes and 2 ounce copper traces on top and bottom of the board.
ELECTRICAL CHARACTERISTICS
Over recommended operating temperature range TJ = –40 to +125°C, VEN = VIN, VIN = VOUT(nom) + 1 V (1), IOUT = 1mA,
COUT = 10μF, CNR = 0.01μF (unless otherwise noted). Typical values are at +25°C.
PARAMETER
TEST CONDITIONS
MIN
VIN Input voltage (1)
IOUT Continuous output current
VFB Internal reference (TPS73001)
Line regulation (ΔVOUT%/ΔVIN)
(1)
V
200
mA
1.225
–2%
VOUT + 1V ≤ VIN ≤ 5.5V
VOUT(nom)
0μA ≤ IOUT ≤ 200mA, TJ = +25°C
Dropout voltage (2)(VIN = VOUT(nom) – 0.1V)
IOUT = 200mA
Output current limit
VOUT = 0V
GND pin current
0μA ≤ IOUT ≤ 200mA
170
Shutdown current (3)
VEN = 0V, 2.7V ≤ VIN ≤ 5.5V
0.07
FB pin current
VFB = 1.8V
TPS73028
1.250
V
5.5 – VDO
V
+2%
V
0.05
Load regulation (ΔVOUT%/ΔIOUT)
Power-supply ripple rejection
UNIT
0
VFB
0μA ≤ IOUT ≤ 200mA, 2.75V ≤ VIN < 5.5V
Output voltage accuracy
MAX
5.5
1.201
Output voltage range (TPS73001)
TYP
2.7
%/V
5
120
285
mV
210
mV
600
mA
250
μA
1
μA
1
μA
f = 100Hz, TJ = +25°C, IOUT = 200mA
68
dB
Output noise voltage (TPS73018)
BW = 200Hz to 100kHz,
IOUT = 200mA
CNR = 0.01μF
33
μVRMS
Time, start-up (TPS73018)
RL = 14Ω, COUT = 1μF
CNR = 0.001μF
High level enable input voltage
2.7V ≤ VIN ≤ 5.5V
1.7
VIN
Low level enable input voltage
2.7V ≤ VIN ≤ 5.5V
0
0.7
V
EN pin current
VEN = 0
–1
1
μA
UVLO threshold
VCC rising
2.25
UVLO hysteresis
(1)
(2)
(3)
μs
50
2.65
100
V
V
mV
Minimum VIN is 2.7V or VOUT + VDO, whichever is greater.
Dropout is not measured for the TPS73018 and TPS73025 since minimum VIN = 2.7V.
For adjustable versions, this applies only after VIN is applied; then VEN transitions high to low.
Copyright © 2004–2007, Texas Instruments Incorporated
Submit Documentation Feedback
3
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
FUNCTIONAL BLOCK DIAGRAMS
ADJUSTABLE VERSION
IN
OUT
UVLO
2.45V
59 k
Current
Sense
ILIM
GND
R1
SHUTDOWN
_
+
FB
EN
R2
UVLO
Thermal
Shutdown
Bandgap
Reference
1.22V
IN
External to
the Device
QuickStart
250 kΩ
Vref
NR
FIXED VERSION
IN
OUT
UVLO
2.45V
Current
Sense
GND
SHUTDOWN
ILIM
_
R1
+
EN
UVLO
R2
Thermal
Shutdown
R2 = 40 kΩ
QuickStart
Bandgap
Reference
1.22V
IN
250 kΩ
Vref
NR
Table 1. Terminal Functions
TERMINAL
NAME
4
SOT23
ADJ
SOT23
FIXED
WCSP
FIXED
DESCRIPTION
NR
4
4
B2
Connecting an external capacitor to this pin bypasses noise generated by the internal
bandgap. This improves power-supply rejection and reduces output noise.
EN
3
3
A3
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator
into shutdown mode. EN can be connected to IN if not used.
FB
5
N/A
N/A
This terminal is the feedback input voltage for the adjustable device.
GND
2
2
A1
Regulator ground
IN
1
1
C3
Input to the device.
OUT
6
5
C1
Output of the regulator.
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
TYPICAL CHARACTERISTICS (SOT23 PACKAGE)
TPS73028
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TPS73028
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
2.805
250
2.805
VIN = 3.8 V
COUT = 10 µF
TJ = 25°C
2.804
2.803
VIN = 3.8 V
COUT = 10 µF
2.800
VOUT (V)
2.800
2.799
IGND (µA)
2.795
2.801
2.790
IOUT = 200 mA
2.785
2.798
100
50
2.780
VIN = 3.8 V
COUT = 10 µF
2.796
2.795
0
50
100
150
2.775
200
IOUT = 200 mA
150
2.797
−40 −25 −10 5
0
−40 −25 −10 5
20 35 50 65 80 95 110 125
IOUT (mA)
20 35 50 65 80 95 110 125
TJ (°C)
TJ (°C)
Figure 2.
Figure 3.
Figure 4.
TPS73028 OUTPUT SPECTRAL
NOISE DENSITY
vs
FREQUENCY
ROOT MEAN SQUARE OUTPUT
NOISE
vs
CNR
TPS73028
DROPOUT VOLTAGE
vs
JUNCTION TEMPERATURE
1.6
180
60
1.2
CNR = 0.001 µF
CNR = 0.0047 µF
1.0
CNR = 0.01 µF
0.8
0.6
CNR = 0.1 µF
0.4
VOUT = 2.8 V
IOUT = 200 mA
COUT = 10 µF
50
VIN = 2.7 V
COUT = 10 µF
160
140
40
120
VDO (mV)
VIN = 3.8 V
IOUT = 200 mA
COUT = 10 µF
1.4
RMS, Output Noise (VRMS)
Output Spectral Noise Density (µV/√Hz)
IOUT = 1 mA
200
IOUT = 1 mA
2.802
VOUT (V)
TPS73028
GROUND CURRENT
vs
JUNCTION TEMPERATURE
30
20
IOUT = 200 mA
100
80
60
40
10
0.2
IOUT = 10 mA
20
BW = 100 Hz to 100 kHz
0
100
1k
10 k
0
0.001
100 k
0.01
CNR (µF)
Frequency (Hz)
0
−40 −25 −10 5
0.1
20 35 50 65 80 95 110 125
TJ (°C)
Figure 5.
Figure 6.
Figure 7.
TPS73028
RIPPLE REJECTION
vs
FREQUENCY
TPS73028 OUTPUT VOLTAGE,
ENABLE VOLTAGE
vs
TIME (START-UP)
TPS73028
LINE TRANSIENT RESPONSE
90
4
VEN (V)
IOUT = 200 mA
70
2
0
60
50
CNR = 0.001 µF
30
VIN = 3.8 V
COUT = 10 µF
CNR = 0.01 µF
10
0
10
100
1k
4.8
3.8
IOUT = 200 mA
COUT = 2.2 µF
CNR = 0.01 µF
20
3
IOUT = 10 mA
20
VIN = 3.8 V
VOUT = 2.8 V
IOUT = 200 mA
COUT = 2.2 µF
TJ = 25°C
2
CNR = 0.0047 µF
1
CNR = 0.01 µF
VIN (mV)
40
VOUT (V)
Ripple Rejection (dB)
80
VOUT (mV)
100
dv
0.4 V
+
µs
dt
0
-20
0
10 k
100 k
1M
10 M
Frequency (Hz)
Figure 8.
Copyright © 2004–2007, Texas Instruments Incorporated
0
20 40
60 80 100 120 140 160 180 200
0
10
20
30 40
50 60
Time (µs)
Time (µs)
Figure 9.
Figure 10.
70 80
Submit Documentation Feedback
90 100
5
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)
TPS73028
LOAD TRANSIENT RESPONSE
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
POWER-UP/POWER-DOWN
250
VIN = 3.8 V
COUT = 10 µF
VOUT = 3 V
RL = 15 Ω
TJ = 125°C
−20
di
0.02A
+
µs
dt
300
VDO (mV)
−40
IOUT (mA)
200
0
500 mV/div
∆VOUT (mV)
20
VIN
TJ = 25°C
100
VOUT
200
0
TJ = −55°C
50
1mA
100
0
150
0
50 100 150 200 250 300 350 400 450 500
0
1s/div
20 40 60 80 100 120 140 160 180 200
IOUT (mA)
Time (µs)
Figure 11.
Figure 12.
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
100
COUT = 2.2 µF
VIN = 5.5 V, VOUT ≥ 1.5 V
TJ = −40°C to 125°C
10
Region of Instability
1
0.1
Region of Stability
0.01
COUT = 10 µF
VIN = 5.5 V
TJ = −40°C to 125°C
10
Region of Instability
1
0.1
Region of Stability
0.01
0
0.02
0.04
0.06
IOUT (A)
Figure 14.
6
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
ESR, Equivalent Series Resistance (Ω)
ESR, Equivalent Series Resistance (Ω)
100
Figure 13.
Submit Documentation Feedback
0.08
0.20
0
0.02
0.04
0.06
0.08
0.20
IOUT (A)
Figure 15.
Copyright © 2004–2007, Texas Instruments Incorporated
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
APPLICATION INFORMATION
The TPS730xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive
battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output
noise, low quiescent current (170μA typically), and enable-input to reduce supply currents to less than 1μA when
the regulator is turned off.
A typical application circuit is shown in Figure 16.
VIN
VOUT
VIN
IN
VOUT
OUT
TPS730xx
0.1µF
EN
GND
NR
2.2µF
0.01µF(1)
NOTE: (1) This capacitor is optional.
Figure 16. Typical Application Circuit
External Capacitor Requirements
A 0.1μF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the
TPS730xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A
higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device
is located several inches from the power source.
Like most low dropout regulators, the TPS730xx requires an output capacitor connected between OUT and GND
to stabilize the internal control loop. The minimum recommended capacitance is 2.2μF. Any 2.2μF or larger
ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load
current is not expected to exceed 100mA, a 1.0μF ceramic capacitor can be used.
The internal voltage reference is a key source of noise in an LDO regulator. The TPS730xx has an NR pin which
is connected to the voltage reference through a 250kΩ internal resistor. The 250kΩ internal resistor, in
conjunction with an external bypass capacitor connected to the NR pin, creates a low pass filter to reduce the
voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate
properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR
drop across the internal resistor thus creating an output error. Therefore, the bypass capacitor must have
minimal leakage current. The bypass capacitor should be no more than 0.1μF to ensure that it is fully charged
during the quickstart time provided by the internal switch shown in the Functional Block Diagrams.
As an example, the TPS73018 exhibits only 33μVRMS of output voltage noise using a 0.01μF ceramic bypass
capacitor and a 2.2μF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance
increases due to the RC time constant at the NR pin that is created by the internal 250kΩ resistor and external
capacitor.
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board
be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND
pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND
pin of the device.
Copyright © 2004–2007, Texas Instruments Incorporated
Submit Documentation Feedback
7
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
Power Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of +125°C; the maximum junction temperature
should be restricted to +125°C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or
equal to PD(max).
The maximum power dissipation limit is determined using Equation 1:
T max *T A
P D(max) + J
R QJA
(1)
Where:
•
•
•
TJmax is the maximum allowable junction temperature.
RθJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table).
TA is the ambient temperature.
The regulator dissipation is calculated using Equation 2:
P D + ǒVIN*V OUTǓ I OUT
(2)
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
Programming the TPS73001 Adjustable LDO Regulator
The output voltage of the TPS73001 adjustable regulator is programmed using an external resistor divider as
shown in Figure 17. The output voltage is calculated using Equation 3:
V OUT + VREF
ǒ1 ) RR Ǔ
1
2
(3)
Where:
•
VREF = 1.225V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 50μA divider current. Lower value resistors can be used
for improved noise performance, but the solution consumes more power. Higher resistor values should be
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially
increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended
design procedure is to choose R2 = 30.1kΩ to set the divider current at 50μA, C1 = 15pF for stability, and then
calculate R1 using Equation 4:
R1 =
VOUT
VREF
- 1 ´ R2
(4)
In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be
placed between OUT and FB. For voltages < 1.8V, the value of this capacitor should be 100pF. For voltages >
1.8V, the approximate value of this capacitor can be calculated as shown in Equation 5:
(3 x 10*7) x (R 1 ) R 2)
C1 +
(R 1 x R2)
(5)
The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is
not used (such as in a unity-gain configuration) or if an output voltage < 1.8V is chosen, then the minimum
recommended output capacitor is 4.7μF instead of 2.2μF.
8
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
OUTPUT VOLTAGE
PROGRAMMING GUIDE
VIN
IN
1m F
OUT
TPS73001
EN
NR
VOUT
R1
C1
2.2mF
GND
FB
0.01mF
R2
OUTPUT
VOLTAGE
R1
R2
C1
1.22V
short
open
0pF
2.5V
31.6kW
30.1kW
22pF
3.3V
51kW
30.1kW
15pF
3.6V
59kW
30.1kW
15pF
Figure 17. TPS73001 Adjustable LDO Regulator Programming
Regulator Protection
The TPS730xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (for example, during power-down). Current is conducted from the output
to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting
might be appropriate.
The TPS730xx features internal current limiting and thermal protection. During normal operation, the TPS730xx
limits output current to approximately 400mA. When current limiting engages, the output voltage scales back
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,
care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum
voltage ratings of the device. If the temperature of the device exceeds approximately +165°C, thermal-protection
circuitry shuts it down. Once the device has cooled down to below approximately +140°C, regulator operation
resumes.
Copyright © 2004–2007, Texas Instruments Incorporated
Submit Documentation Feedback
9
TPS730xx
www.ti.com
SBVS054H – NOVEMBER 2004 – REVISED OCTOBER 2007
TPS730xxYZQ NanoStar™ Wafer Chip Scale Information
0,79
0,84
1,30
1,34
0.625 Max
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
D. This package is tin-lead (SnPb); consult the factory for availability of lead-free material.
NanoStar is a trademark of Texas Instruments.
Figure 18. NanoStar™ Wafer Chip Scale Package
10
Submit Documentation Feedback
Copyright © 2004–2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS73001DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73001DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73001DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73001DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73018DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73018DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73018DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73018DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73018YZQR
ACTIVE
DSBGA
YZQ
5
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS73018YZQT
ACTIVE
DSBGA
YZQ
5
250
SNAGCU
Level-1-260C-UNLIM
TPS73025DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73025DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73025DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73025DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73025YZQR
ACTIVE
DSBGA
YZQ
5
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS73025YZQT
ACTIVE
DSBGA
YZQ
5
250
SNAGCU
Level-1-260C-UNLIM
TPS730285DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS730285DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS730285DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS730285DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS730285YZQR
ACTIVE
DSBGA
YZQ
5
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS730285YZQT
ACTIVE
DSBGA
YZQ
5
250
SNAGCU
Level-1-260C-UNLIM
TPS73028DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73028DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73028DBVT
ACTIVE
SOT-23
DBV
5
250
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2008
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS73028DBVTG4
ACTIVE
SOT-23
DBV
5
250
TPS73028YZQR
ACTIVE
DSBGA
YZQ
5
TPS73028YZQT
ACTIVE
DSBGA
YZQ
TPS73030DBVR
ACTIVE
SOT-23
TPS73030DBVRG4
ACTIVE
TPS73030DBVT
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
5
250
SNAGCU
Level-1-260C-UNLIM
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73030DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73030YZQR
PREVIEW
DSBGA
YZQ
5
3000
TBD
Call TI
Call TI
TPS73030YZQT
PREVIEW
DSBGA
YZQ
5
250
TBD
Call TI
Call TI
TPS73033DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73033DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73033DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73033DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73047DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73047DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73047DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS73047DBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2008
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
21-May-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
TPS73001DBVR
SOT-23
DBV
6
3000
179.0
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73001DBVT
SOT-23
DBV
6
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73018DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73018DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73018YZQR
DSBGA
YZQ
5
3000
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS73018YZQT
DSBGA
YZQ
5
250
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS73025DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73025DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73025YZQR
DSBGA
YZQ
5
3000
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS73025YZQT
DSBGA
YZQ
5
250
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS730285DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS730285DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS730285YZQR
DSBGA
YZQ
5
3000
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS730285YZQT
DSBGA
YZQ
5
250
178.0
8.4
0.96
1.46
0.69
4.0
8.0
Q1
TPS730285YZQT
DSBGA
YZQ
5
250
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS73028DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73028DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73028YZQR
DSBGA
YZQ
5
3000
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
21-May-2008
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS73028YZQT
DSBGA
YZQ
5
250
178.0
8.4
0.98
1.46
0.69
4.0
8.0
Q1
TPS73030DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73030DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73033DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73033DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73047DBVR
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS73047DBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS73001DBVR
SOT-23
DBV
6
3000
195.0
200.0
45.0
TPS73001DBVT
SOT-23
DBV
6
250
195.0
200.0
45.0
TPS73018DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73018DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS73018YZQR
DSBGA
YZQ
5
3000
217.0
193.0
35.0
TPS73018YZQT
DSBGA
YZQ
5
250
217.0
193.0
35.0
TPS73025DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73025DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS73025YZQR
DSBGA
YZQ
5
3000
217.0
193.0
35.0
TPS73025YZQT
DSBGA
YZQ
5
250
217.0
193.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-May-2008
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS730285DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS730285DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS730285YZQR
DSBGA
YZQ
5
3000
217.0
193.0
35.0
TPS730285YZQT
DSBGA
YZQ
5
250
195.2
193.7
34.9
TPS730285YZQT
DSBGA
YZQ
5
250
217.0
193.0
35.0
TPS73028DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73028DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS73028YZQR
DSBGA
YZQ
5
3000
217.0
193.0
35.0
TPS73028YZQT
DSBGA
YZQ
5
250
217.0
193.0
35.0
TPS73030DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73030DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS73033DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73033DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
TPS73047DBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
TPS73047DBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated