TI TPS79301DBVR

 TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR
REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23
FEATURES
•
•
•
•
•
•
•
•
•
DESCRIPTION
200-mA RF Low-Dropout Regulator
With Enable
Available in 1.8-V, 2.5-V, 2.8-V, 2.85-V, 3-V,
3.3-V, 4.75-V, and Adjustable (1.22-V to 5.5-V)
High PSRR (70 dB at 10 kHz)
Ultralow-Noise (32 µVRMS, TPS79328)
Fast Start-Up Time (50 µs)
Stable With a 2.2-µF Ceramic Capacitor
Excellent Load/Line Transient Response
Very Low Dropout Voltage (112 mV at Full
Load, TPS79330)
5- and 6-Pin SOT23 (DBV) and NanoStar Wafer
Chip Scale (YEQ) Packages
The TPS793xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in NanoStar wafer chip scale and SOT23
packages. NanoStar packaging gives an ultrasmall
footprint as well as an ultralow profile and package
weight, making it ideal for portable applications such
as handsets and PDAs. Each device in the family is
stable, with a small 2.2-µF ceramic capacitor on the
output. The TPS793xx family uses an advanced,
proprietary BiCMOS fabrication process to yield extremely low dropout voltages (e.g., 112 mV at
200 mA, TPS79330). Each device achieves fast
start-up times (approximately 50 µs with a 0.001-µF
bypass capacitor) while consuming very low quiescent current (170 µA typical). Moreover, when the
device is placed in standby mode, the supply current
is reduced to less than 1 µA. The TPS79328 exhibits
approximately 32 µVRMS of output voltage noise at
2.8-V output with a 0.1-µF bypass capacitor. Applications with
analog components
that
are
noise-sensitive, such as portable RF electronics,
benefit from the high PSRR and low-noise features
as well as the fast response time.
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Cellular and Cordless Telephones
Bluetooth™, Wireless LAN
Handheld Organizers, PDAs
DBV PACKAGE
(TOP VIEW)
GND
2
EN
3
5
OUT
4
NR
Fixed Option
DBV PACKAGE
(TOP VIEW)
OUT
IN
1
6
GND
2
5
FB
EN
3
4
NR
Adjustable Option
YEQ
PACKAGE
(TOP VIEW)
IN
C3
A3
EN
C1
B2
A1
OUT
TPS79328
TPS79328
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
RIPPLE REJECTION
vs
FREQUENCY
0.30
100
VIN = 3.8 V
COUT = 2.2 µF
CNR = 0.1 µF
0.25
90
IOUT = 200 mA
80
Ripple Rejection (dB)
1
Output Spectral Noise Density (µV/√Hz)
IN
0.20
0.15
IOUT = 1 mA
0.10
IOUT = 200 mA
70
60
50
40
IOUT = 10 mA
30
20
0.05
VIN = 3.8 V
COUT = 10 µF
CNR = 0.01 µF
10
0
0
100
NR
1k
10 k
Frequency (Hz)
100 k
10
100
1k
10 k
100 k
1M
10 M
Frequency (Hz)
GND
Figure 1.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth Sig, Inc.
NanoStar is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 2001–2004, Texas Instruments Incorporated
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
AVAILABLE OPTIONS (1) (2)
PRODUCT
VOLTAGE
PACKAGE
SYMBOL
PART NUMBER
TPS79301
1.22 V to 5.5 V
SOT23 (DBV)
PGVI
TPS79301DBVR
TPS79318
1.8 V
SOT23 (DBV)
PHHI
TPS79318DBVR
TPS79325
2.5 V
TPS79328
2.8 V
TPS793285
(1)
(2)
2.85 V
TJ
CSP (YEQ)
E3
TPS79318YEQ
SOT23 (DBV)
PGWI
TPS79325DBVR
CSP (YEQ)
E4
TPS79325YEQ
PGXI
TPS79328DBVR
SOT23 (DBV)
CSP (YEQ)
SOT23 (DBV)
-40°C to +125°C
E2
TPS79328YEQ
PHII
TPS793285DBVR
CSP (YEQ)
E5
TPS793285YEQ
SOT23 (DBV)
PGYI
TPS79330DBVR
TPS79330
3V
CSP (YEQ)
E6
TPS79330YEQ
TPS79333
3.3 V
SOT23 (DBV)
PHUI
TPS79333DBVR
TPS793475
4.75 V
SOT23 (DBV)
PHJI
TPS793475DBVR
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
DBVR indicates tape and reel of 3000 parts. YEQR indicates tape and reel of 3000 parts. YEQT indicates tape and reel of 250 parts.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted) (1)
UNIT
VIN range
-0.3 V to 6 V
VEN range
-0.3 V to VIN + 0.3 V
VOUT range
Peak output current
-0.3 V to 6 V
Internally limited
ESD rating, HBM
2 kV
ESD rating, CDM
500 V
Continuous total power dissipation
See Dissipation Ratings Table
Junction temperature range, DBV package
-40°C to 150°C
Junction temperature range, YEQ package
-40°C to 125°C
Storage temperature range, Tstg
-65°C to 150°C
(1)
2
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
DISSIPATION RATINGS TABLE
TA ≤ 25°C
POWER
RATING
TA = 70°C
POWER
RATING
TA = 85°C
POWER
RATING
BOARD
PACKAGE
RθJC
RθJA
DERATING FACTOR
ABOVE TA = 25°C
Low-K (1)
DBV
65°C/W
255°C/W
3.9 mW/°C
390 mW
215 mW
155 mW
High-K (2)
DBV
65°C/W
180°C/W
5.6 mW/°C
560 mW
310 mW
225 mW
Low-K (1)
YEQ
27°C/W
255°C/W
3.9 mW/°C
390 mW
215 mW
155 mW
High-K (2)
YEQ
27°C/W
190°C/W
5.3 mW/°C
530 mW
296 mW
216 mW
(1)
(2)
The JEDEC low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top
of the board.
The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1 ounce internal power and
ground planes and 2 ounce copper traces on top and bottom of the board.
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range TJ = -40 to 125°C, VEN = VIN, VIN = VOUT(nom) + 1 V (1), IOUT = 1 mA,
COUT = 10 µF, CNR = 0.01 µF (unless otherwise noted). Typical values are at 25°C.
PARAMETER
VIN Input
TEST CONDITIONS
MIN
voltage (1)
TYP
MAX
UNIT
2.7
5.5
V
IOUT Continuous output current
0
200
mA
VFB Internal reference (TPS79301)
1.201
Output voltage range (TPS79301)
VFB
Output voltage
2.8 V < VIN < 5.5 V
1.764
1.8
1.836
V
0 µA < IOUT < 200 mA,
3.5 V < VIN < 5.5 V
2.45
2.5
2.55
V
TPS79328
0 µA < IOUT < 200 mA,
3.8 V < VIN < 5.5 V
2.744
2.8
2.856
V
TPS793285
0 µA < IOUT < 200 mA,
3.85 V < VIN < 5.5 V
2.793
2.85
2.907
V
TPS79330
0 µA < IOUT < 200 mA,
4 V < VIN < 5.5 V
2.94
3
3.06
V
TPS79333
0 µA ≤ IOUT < 200 mA,
4.3 V < VIN < 5.5 V
3.234
3.3
3.366
V
TPS793475
0 µA < IOUT < 200 mA,
5.25 V < VIN < 5.5 V
4.655
4.75
4.845
V
0.05
0.12
%/V
0 µA < IOUT < 200 mA,
TJ = 25°C
5
mV
TPS79328
IOUT = 200 mA
120
200
TPS793285
IOUT = 200 mA
120
200
TPS79330
IOUT = 200 mA
112
200
TPS79333
IOUT = 200 mA
102
180
TPS793475
IOUT = 200 mA
77
Output current limit
VOUT = 0 V
GND pin current
0 µA < IOUT < 200 mA
VEN = 0 V, 2.7 V < VIN < 5.5 V
current (3)
FB pin current
285
TPS79328
125
mA
170
220
µA
0.07
1
µA
1
µA
f = 100 Hz, TJ = 25°C,
IOUT = 10 mA
70
f = 100 Hz, TJ = 25°C,
IOUT = 200 mA
68
f = 10 kHz, TJ = 25°C,
IOUT = 200 mA
70
f = 100 kHz, TJ = 25°C,
IOUT = 200 mA
BW = 200 Hz to 100 kHz,
IOUT = 200 mA
mV
600
VFB = 1.8 V
Output noise voltage (TPS79328)
(1)
(2)
(3)
V
0 µA < IOUT < 200 mA,
Load regulation (∆VOUT%/∆IOUT)
Power-supply ripple rejection
V
TPS79325
VOUT + 1 V < VIN≤ 5.5 V
Shutdown
1.250
5.5 - VDO
TPS79318
Line regulation (∆VOUT%/∆VIN) (1)
Dropout voltage (2)
(VIN = VOUT(nom) - 0.1V)
1.225
dB
43
CNR = 0.001 µF
55
CNR = 0.0047 µF
36
CNR = 0.01 µF
33
CNR = 0.1 µF
32
µVRMS
Minimum VIN is 2.7 V or VOUT + VDO, whichever is greater.
Dropout is not measured for the TPS79318 and TPS79325 since minimum VIN = 2.7 V.
For adjustable versions, this applies only after VIN is applied; then VEN transitions high to low.
3
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating temperature range TJ = -40 to 125°C, VEN = VIN, VIN = VOUT(nom) + 1 V, IOUT = 1 mA,
COUT = 10 µF, CNR = 0.01 µF (unless otherwise noted). Typical values are at 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
CNR = 0.001 µF
50
CNR = 0.0047 µF
70
MAX
UNIT
Time, start-up (TPS79328)
RL = 14 Ω, COUT = 1 µF
High level enable input voltage
2.7 V < VIN < 5.5 V
1.7
VIN
V
Low level enable input voltage
2.7 V < VIN < 5.5 V
0
0.7
V
EN pin current
VEN = 0
-1
UVLO threshold
VCC rising
CNR = 0.01 µF
UVLO hysteresis
4
µs
100
1
2.25
µA
2.65
100
V
mV
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
FUNCTIONAL BLOCK DIAGRAMS
ADJUSTABLE VERSION
IN
OUT
UVLO
2.45V
59 k
Current
Sense
ILIM
GND
R1
SHUTDOWN
_
+
FB
EN
R2
UVLO
Thermal
Shutdown
Bandgap
Reference
1.22V
IN
External to
the Device
QuickStart
250 kΩ
Vref
NR
FIXED VERSION
IN
OUT
UVLO
2.45V
Current
Sense
GND
SHUTDOWN
ILIM
R1
_
+
EN
UVLO
R2
Thermal
Shutdown
R2 = 40 kΩ
QuickStart
Bandgap
Reference
1.22V
IN
250 kΩ
Vref
NR
Terminal Functions
TERMINAL
DESCRIPTION
NAME
SOT23
ADJ
SOT23
FIXED
WCSP
FIXED
NR
4
4
B2
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap.
This improves power-supply rejection and reduces output noise.
EN
3
3
A3
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
FB
5
N/A
N/A
This terminal is the feedback input voltage for the adjustable device.
GND
2
2
A1
Regulator ground
IN
1
1
C3
Unregulated input to the device.
OUT
6
5
C1
Output of the regulator.
5
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE)
TPS79328
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TPS79328
OUTPUT VOLTAGE
vs
JUNCTION TEMPERATURE
2.805
250
2.805
VIN = 3.8 V
COUT = 10 µF
TJ = 25°C
2.804
2.803
VIN = 3.8 V
COUT = 10 µF
2.800
VOUT (V)
2.800
2.799
IGND (µA)
2.795
2.801
2.790
IOUT = 200 mA
2.785
2.798
2.797
2.795
0
50
100
150
2.775
200
100
VIN = 3.8 V
COUT = 10 µF
−40 −25 −10 5
0
−40 −25 −10 5
20 35 50 65 80 95 110 125
IOUT (mA)
20 35 50 65 80 95 110 125
TJ (°C)
TJ (°C)
Figure 2.
Figure 3.
Figure 4.
TPS79328 OUTPUT SPECTRAL
NOISE DENSITY
vs
FREQUENCY
TPS79328 OUTPUT SPECTRAL
NOISE DENSITY
vs
FREQUENCY
TPS79328 OUTPUT SPECTRAL
NOISE DENSITY
vs
FREQUENCY
0.30
1.6
VIN = 3.8 V
COUT = 2.2 µF
CNR = 0.1 µF
0.25
0.20
0.15
IOUT = 1 mA
0.10
IOUT = 200 mA
0.05
0
100
1k
10 k
Frequency (Hz)
VIN = 3.8 V
COUT = 10 µF
CNR = 0.1 µF
0.25
0.20
IOUT = 1 mA
0.15
0.10
IOUT = 200 mA
0.05
0
100
100 k
Output Spectral Noise Density (µV/√Hz)
0.30
Output Spectral Noise Density (µV/√Hz)
1k
10 k
VIN = 3.8 V
IOUT = 200 mA
COUT = 10 µF
1.4
1.2
CNR = 0.001 µF
1.0
CNR = 0.0047 µF
0.8
CNR = 0.01 µF
0.6
CNR = 0.1 µF
0.4
0.2
0
100
100 k
1k
10 k
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
Figure 7.
ROOT MEAN SQUARE OUTPUT
NOISE
vs
CNR
OUTPUT IMPEDANCE
vs
FREQUENCY
TPS79328
DROPOUT VOLTAGE
vs
JUNCTION TEMPERATURE
2.5
60
VOUT = 2.8 V
IOUT = 200 mA
COUT = 10 µF
50
2.0
160
VIN = 2.7 V
COUT = 10 µF
140
40
120
ZO (Ω)
1.5
30
IOUT = 1 mA
1.0
20
IOUT = 100 mA
IOUT = 200 mA
100
80
60
0.5
10
100 k
180
VIN = 3.8 V
COUT = 10 µF
TJ = 25° C
VDO (mV)
Output Spectral Noise Density (µV/√Hz)
IOUT = 200 mA
150
50
2.780
2.796
RMS, Output Noise (VRMS)
IOUT = 1 mA
200
IOUT = 1 mA
2.802
VOUT (V)
TPS79328
GROUND CURRENT
vs
JUNCTION TEMPERATURE
40
20
IOUT = 10 mA
BW = 100 Hz to 100 kHz
0
0.001
0.01
CNR (µF)
Figure 8.
6
0.1
0
10
100
1k
10 k 100 k
Frequency (Hz)
Figure 9.
1M
10 M
0
−40 −25 −10 5
20 35 50 65 80 95 110 125
TJ (°C)
Figure 10.
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
100
90
90
IOUT = 200 mA
Ripple Rejection (dB)
70
60
50
40
IOUT = 10 mA
30
20
VIN = 3.8 V
COUT = 10 µF
CNR = 0.01 µF
10
0
10
100
1k
10 k
100 k
1M
80
IOUT = 200 mA
70
60
50
IOUT = 10 mA
40
30
60
50
IOUT = 10 mA
40
30
20
10
0
10
100
1k
10 k
100 k
1M
10 M
10
1k
10 k
100 k
1M
10 M
Frequency (Hz)
Figure 13.
TPS79328 OUTPUT VOLTAGE,
ENABLE VOLTAGE
vs
TIME (START-UP)
TPS79328
LINE TRANSIENT RESPONSE
TPS79328
LOAD TRANSIENT RESPONSE
0
CNR = 0.001 µF
4.8
3.8
IOUT = 200 mA
COUT = 2.2 µF
CNR = 0.01 µF
CNR = 0.0047 µF
1
VIN (mV)
2
0
-20
CNR = 0.01 µF
0
−20
−40
dv
0.4 V
µs
dt
0
200
0
60 80 100 120 140 160 180 200
10
20
30 40
50 60
70 80
1mA
100
0
20 40
di
0.02A
µs
dt
300
IOUT (mA)
20
3
VIN = 3.8 V
COUT = 10 µF
20
∆VOUT (mV)
VIN = 3.8 V
VOUT = 2.8 V
IOUT = 200 mA
COUT = 2.2 µF
TJ = 25°C
VOUT (mV)
Figure 12.
2
0
100
Frequency (Hz)
Figure 11.
4
VEN (V)
IOUT = 200 mA
70
10
Frequency (Hz)
VOUT (V)
80
20
0
10 M
VIN = 3.8 V
COUT = 2.2 µF
CNR = 0.1 µF
90
90 100
0
50 100 150 200 250 300 350 400 450 500
Time (µs)
Time (µs)
Time (µs)
Figure 14.
Figure 15.
Figure 16.
POWER-UP / POWER-DOWN
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
TPS79301
DROPOUT VOLTAGE
vs
INPUT VOLTAGE
200
250
VOUT = 3 V
RL = 15 Ω
TJ = 125°C
200
150
VDO (mV)
500 mV/div
TJ = 125°C
VIN
150
VDO (mV)
Ripple Rejection (dB)
80
100
VIN = 3.8 V
COUT = 2.2 µF
CNR = 0.01 µF
Ripple Rejection (dB)
100
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
TJ = 25°C
100
TJ = 25°C
100
VOUT
TJ = −55°C
50
50
TJ = −40°C
IOUT = 200 mA
0
1s/div
0
0
20 40 60 80 100 120 140 160 180 200
IOUT (mA)
Figure 17.
Figure 18.
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
Figure 19.
7
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
100
COUT = 2.2 µF
VIN = 5.5 V, VOUT ≥ 1.5 V
TJ = −40°C to 125°C
ESR, Equivalent Series Resistance (Ω)
ESR, Equivalent Series Resistance (Ω)
100
10
Region of Instability
1
0.1
Region of Stability
0.01
COUT = 10 µF
VIN = 5.5 V
TJ = −40°C to 125°C
10
Region of Instability
1
0.1
Region of Stability
0.01
0
0.02
0.04
0.06
IOUT (A)
Figure 20.
8
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
0.08
0.20
0
0.02
0.04
0.06
IOUT (A)
Figure 21.
0.08
0.20
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
APPLICATION INFORMATION
The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive
battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output
noise, low quiescent current (170 µA typically), and enable-input to reduce supply currents to less than 1 µA
when the regulator is turned off.
A typical application circuit is shown in Figure 22.
VIN
VIN
IN
VOUT
OUT
TPS793xx
EN
0.1µF
GND
NR
VOUT
2.2µF
0.01µF
Figure 22. Typical Application Circuit
External Capacitor Requirements
A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the
TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A
higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device
is located several inches from the power source.
Like most low dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND
to stabilize the internal control loop. The minimum recommended capacitance is 2.2 µF. Any 2.2-µF or larger
ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load
current is not expected to exceed 100 mA, a 1.0-µF ceramic capacitor can be used.
The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has an NR pin which
is connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in
conjunction with an external bypass capacitor connected to the NR pin, creates a low pass filter to reduce the
voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate
properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR
drop across the internal resistor thus creating an output error. Therefore, the bypass capacitor must have
minimal leakage current. The bypass capacitor should be no more than 0.1-µF to ensure that it is fully charged
during the quickstart time provided by the internal switch shown in the Functional Block Diagrams
As an example, the TPS79328 exhibits only 32 µVRMS of output voltage noise using a 0.1-µF ceramic bypass
capacitor and a 2.2-µF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance
increases due to the RC time constant at the NR pin that is created by the internal 250-kΩ resistor and external
capacitor.
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board
be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND
pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND
pin of the device.
9
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
www.ti.com
APPLICATION INFORMATION (continued)
Power Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or
equal to PD(max).
The maximum power dissipation limit is determined using Equation 1:
T max T A
P D(max) J
R JA
(1)
Where:
•
•
•
TJmax is the maximum allowable junction temperature.
RθJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table).
TA is the ambient temperature.
The regulator dissipation is calculated using Equation 2:
P D VINV OUT I OUT
(2)
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
Programming the TPS79301 Adjustable LDO Regulator
The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as
shown in Figure 23. The output voltage is calculated using Equation 3:
V OUT VREF 1 R1
R2
(3)
Where:
•
VREF = 1.2246 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be
used for improved noise performance, but the solution consumes more power. Higher resistor values should be
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended
design procedure is to choose R2 = 30.1 kΩ to set the divider current at 50 µA, C1 = 15 pF for stability, and then
calculate R1 using Equation 4:
V OUT
R1 R2
Vref 1
(4)
In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be
placed between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages
>1.8 V, the approximate value of this capacitor can be calculated as shown in Equation 5:
(3 x 107) x (R 1 R 2)
C1 (R 1 x R2)
(5)
The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is
not used (such as in a unity-gain configuration) or if an output voltage <1.8 V is chosen, then the minimum
recommended output capacitor is 4.7 µF instead of 2.2 µF.
10
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
APPLICATION INFORMATION (continued)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
VIN
IN
1 µF
OUT
TPS793xx
EN
NR
0.01 µF
GND
VOUT
R1
FB
C1
1 µF
OUTPUT
VOLTAGE
1.22 V
R2
R1
R2
C1
short
open
0 pF
2.5 V
31.6 k Ω 30.1 k Ω
22 pF
3.3 V
51 k Ω 30.1 k Ω
15 pF
3.6 V
59 k Ω 30.1 k Ω
15 pF
Figure 23. TPS79301 Adjustable LDO Regulator Programming
Regulator Protection
The TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (e.g., during power-down). Current is conducted from the output to the
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be
appropriate.
The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx
limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,
care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum
voltage ratings of the device. If the temperature of the device exceeds approximately 165°C, thermal-protection
circuitry shuts it down. Once the device has cooled down to below approximately 140°C, regulator operation
resumes.
11
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
SLVS348H – JULY 2001 – REVISED OCTOBER 2004
TPS793xxYEQ NanoStar™ Wafer Chip Scale Information
0,79
0,84
1,30
1,34
0.625 Max
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
D. This package is tin-lead (SnPb); consult the factory for availability of lead-free material.
NanoStar is a trademark of Texas Instruments.
Figure 24. NanoStar™ Wafer Chip Scale Package
12
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS79301DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
TPS79301DBVRG4
ACTIVE
SOT-23
DBV
6
3000
TPS79318DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79318DBVRG4
ACTIVE
SOT-23
DBV
5
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79318DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79318YEQR
ACTIVE
DSBGA
YEQ
5
3000
None
Call TI
Level-1-240C-UNLIM
TPS79318YEQT
ACTIVE
DSBGA
YEQ
5
250
None
Call TI
Level-1-240C-UNLIM
TPS79325DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79325DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79325YEQR
ACTIVE
DSBGA
YEQ
5
3000
None
Call TI
Level-1-240C-UNLIM
TPS79325YEQT
ACTIVE
DSBGA
YEQ
5
250
None
Call TI
Level-1-240C-UNLIM
TPS793285DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS793285DBVRG4
ACTIVE
SOT-23
DBV
5
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS793285DBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS793285YEQR
ACTIVE
DSBGA
YEQ
5
3000
None
Call TI
Level-1-240C-UNLIM
TPS793285YEQT
ACTIVE
DSBGA
YEQ
5
250
None
Call TI
Level-1-240C-UNLIM
TPS79328DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79328DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79328YEQR
ACTIVE
DSBGA
YEQ
5
3000
None
Call TI
Level-1-240C-UNLIM
TPS79328YEQT
ACTIVE
DSBGA
YEQ
5
250
None
Call TI
Level-1-240C-UNLIM
TPS79330DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79330DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79330YEQR
ACTIVE
DSBGA
YEQ
5
3000
None
Call TI
Level-1-240C-UNLIM
None
None
Lead/Ball Finish
CU NIPDAU
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
TPS79330YEQT
ACTIVE
DSBGA
YEQ
5
250
Call TI
Level-1-240C-UNLIM
TPS79333DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS79333DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS793475DBVR
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS793475DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
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