TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com SAW Filter 173.91 MHz(BW=20.0MHz) SMD 5.0mmX7.0mm MODEL NO.: TB0835A REV.1.0 A. MAXIMUM RATING: 1. Operating Temperature: -20 °C ~ +70 °C 2. Storage Temperature: -40 °C ~ +85 °C 3. Input power: 10dBm B. Characteristics : RoHS Compliant Lead free Lead-free soldering Ambient Temperature: 25 °C Value Typ. Characteristics Min. Center frequency FC Minimum Insertion loss I.L. 1dB BW Passband Ripple (FC ± 10MH) MHz dB MHz dB - Max. - 173.910 10.0 23.8 0.6 13 1.5 53 48 -94 - Attenuation (Reference to Minimum Insertion loss) 100 ~ 153.91MHz dB 45 208.91 ~ 350MHz dB 40 Temp Coefficient ppm/K Matching: 1.The input of the filter will be matched to 50 ohm 2.The output of the filter will be matched to 50 ohm TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document Note - 2 C. FREQUENCY CHARACTERISTICS : 1.S21 Response: (span : 200MHz) 2. Group-Delay Ripple: (span : 30MHz) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 3. S11 Smith Chart: (span : 200MHz) 4. S22 Smith Chart (span : 200MHz) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 E. MEASUREMENT CIRCUIT Zin= Zout= 50 ohm L1 J D SAW Filter Zin L2 Zout L1=47nH, L2=68nH F.OUTLINE DRAWING: 835 Τ △ □ Pin J: input Pin D: output Pin A, B, C, F, G, H, I, L: To be Ground □ : Week Code (Follow the table from planner each year) Unit : mm (week01, 02, 03…52 =>A, B, C…z) △ : Product / Year Code Year 2005 2009 2006 2010 2007 2011 2008 2012 Product Code B b B b TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 G. PCB Footprint Unit: mm H. PACKING: 1. REEL DIMENSION Unit: mm TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 2. TAPE DIMENSION 835 Unit: mm 360 340 320 300 280 260 240 220 200 180 160 140 120 100 80 60 40 20 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 Temp ( Deg C) I. RECOMMENDED REFLOW PROFILE : Time (Sec) TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 7