TAK_CHEONG KELDB3

KELDB3
SE MICO NDU C TOR
DO-35 Hermetically
Sealed Glass BI-directional Trigger Diode
AXIAL LEAD
DO35
Absolute Maximum Ratings
Symbol
TA = 25°C unless otherwise noted
Parameter
Value
Units
150
mW
PD
Power Dissipation
@ Ta = 50℃
ITRM
Repetitive peak on-state current
tp = 20us, F = 120Hz
2
A
Tstg
Tj
Storage temperature range
Operating junction temperature
-40 ~ 125
°C
DEVICE MARKING DIAGRAM
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
VBO = 32V
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All External Surfaces Are Corrosion Resistant And Leads Are Readily Solderable
RoHS Compliant
Solder Hot Dip Tin (Sn) Terminal Finish
Electrical Characteristics
Symbol
VBO
[VBO’ ]- [VBO]
[ΔV]
TA = 25°C unless otherwise noted
Parameter
Limits
Test Condition
Breakover Voltage
C = 22nF (note 2)
Breakover Voltage Symmetry
C = 22nF (note 2)
Dynamic Breakover Voltage
VBO and VF at 10mA
Unit
Min
Max
28
36
Volts
3
Volts
5
Volts
5
Volts
See diagram 2
Vo
Output Voltage
(R = 20Ω)
IBO
Breakover Current
C = 22nF (note 2)
50
uA
TR
Rise Time
See diagram 3
2
uS
IB
Leakage Current
VR = 0.5VBO max
10
uA
IP
Peak Current
See diagram 2
0.3
A
Notes:
1. All parameters applicable to both forward and reverse directions.
2. Connected in parallel in the device
Number: DB-131
November 2008 / A
Page 1
SE MICO NDU C TOR
DIAGRAM 1: VOLTAGE – CURRENT CHARACTERISTIC CURVE
DIAGRAM 2: TEST CIRCUIT
DIAGRAM 3: RISE TIME MEASUREMENT
Package Outline
Package
Case Outline
DO-35
DO-35
DIM
Millimeters
Inches
Min
Max
Min
Max
A
0.46
0.55
0.018
0.022
B
3.05
5.08
0.120
0.200
C
25.40
38.10
1.000
1.500
D
1.53
2.28
0.060
0.090
Notes:
1.
All dimensions are within JEDEC standard.
Number: DB-131
November 2008 / A
Page 2
DISC LA IMER NOTIC E
NOTICE
The information presented in this document is for reference only. Tak Cheong reserves the right to make
changes without notice for the specification of the products displayed herein.
The product listed herein is designed to be used with ordinary electronic equipment or devices, and not
designed to be used with equipment or devices which require high level of reliability and the malfunction of
with would directly endanger human life (such as medical instruments, transportation equipment, aerospace
machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong
Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers
resulting from such improper use of sale.
This publication supersedes & replaces all information previously supplied. For additional information, please
visit our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further
assistance.
Number: DB-111
April 29, 2008 / A