KELDB3 SE MICO NDU C TOR DO-35 Hermetically Sealed Glass BI-directional Trigger Diode AXIAL LEAD DO35 Absolute Maximum Ratings Symbol TA = 25°C unless otherwise noted Parameter Value Units 150 mW PD Power Dissipation @ Ta = 50℃ ITRM Repetitive peak on-state current tp = 20us, F = 120Hz 2 A Tstg Tj Storage temperature range Operating junction temperature -40 ~ 125 °C DEVICE MARKING DIAGRAM These ratings are limiting values above which the serviceability of the diode may be impaired. Specification Features: VBO = 32V DO-35 Package (JEDEC) Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All External Surfaces Are Corrosion Resistant And Leads Are Readily Solderable RoHS Compliant Solder Hot Dip Tin (Sn) Terminal Finish Electrical Characteristics Symbol VBO [VBO’ ]- [VBO] [ΔV] TA = 25°C unless otherwise noted Parameter Limits Test Condition Breakover Voltage C = 22nF (note 2) Breakover Voltage Symmetry C = 22nF (note 2) Dynamic Breakover Voltage VBO and VF at 10mA Unit Min Max 28 36 Volts 3 Volts 5 Volts 5 Volts See diagram 2 Vo Output Voltage (R = 20Ω) IBO Breakover Current C = 22nF (note 2) 50 uA TR Rise Time See diagram 3 2 uS IB Leakage Current VR = 0.5VBO max 10 uA IP Peak Current See diagram 2 0.3 A Notes: 1. All parameters applicable to both forward and reverse directions. 2. Connected in parallel in the device Number: DB-131 November 2008 / A Page 1 SE MICO NDU C TOR DIAGRAM 1: VOLTAGE – CURRENT CHARACTERISTIC CURVE DIAGRAM 2: TEST CIRCUIT DIAGRAM 3: RISE TIME MEASUREMENT Package Outline Package Case Outline DO-35 DO-35 DIM Millimeters Inches Min Max Min Max A 0.46 0.55 0.018 0.022 B 3.05 5.08 0.120 0.200 C 25.40 38.10 1.000 1.500 D 1.53 2.28 0.060 0.090 Notes: 1. All dimensions are within JEDEC standard. Number: DB-131 November 2008 / A Page 2 DISC LA IMER NOTIC E NOTICE The information presented in this document is for reference only. Tak Cheong reserves the right to make changes without notice for the specification of the products displayed herein. The product listed herein is designed to be used with ordinary electronic equipment or devices, and not designed to be used with equipment or devices which require high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), Tak Cheong Semiconductor Co., Ltd., or anyone on its behalf, assumes no responsibility or liability for any damagers resulting from such improper use of sale. This publication supersedes & replaces all information previously supplied. For additional information, please visit our website http://www.takcheong.com, or consult your nearest Tak Cheong’s sales office for further assistance. Number: DB-111 April 29, 2008 / A