0 XC18V00 Series In-System Programmable Configuration PROMs R DS026 (v4.0) June 11, 2003 0 0 Features • • Dual configuration modes - In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs - Endurance of 20,000 program/erase cycles - • • • • Product Specification Program/erase over full commercial/industrial voltage and temperature range (–40°C to +85°C) IEEE Std 1149.1 boundary-scan (JTAG) support Simple interface to the FPGA Cascadable for storing longer or multiple bitstreams Low-power advanced CMOS FLASH process Description Xilinx introduces the XC18V00 series of in-system programmable configuration PROMs (Figure 1). Devices in this 3.3V family include a 4-megabit, a 2-megabit, a 1-megabit, and a 512-kilobit PROM that provide an easy-to-use, cost-effective method for re-programming and storing Xilinx FPGA configuration bitstreams. When the FPGA is in Master Serial mode, it generates a configuration clock that drives the PROM. A short access time after CE and OE are enabled, data is available on the PROM DATA (D0) pin that is connected to the FPGA DIN pin. New data is available a short access time after each rising clock edge. The FPGA generates the appropriate number of clock pulses to complete the configuration. When the FPGA is in Slave Serial mode, the PROM and the FPGA are clocked by an external clock. • • • • • - Parallel (up to 264 Mb/s at 33 MHz) 5V tolerant I/O pins accept 5V, 3.3V and 2.5V signals 3.3V or 2.5V output capability Available in PC20, SO20, PC44, and VQ44 packages Design support using the Xilinx Alliance and Foundation series software packages. JTAG command initiation of standard FPGA configuration When the FPGA is in Master-SelectMAP mode, the FPGA generates a configuration clock that drives the PROM. When the FPGA is in Slave-Parallel or Slave-SelectMAP Mode, an external oscillator generates the configuration clock that drives the PROM and the FPGA. After CE and OE are enabled, data is available on the PROMs DATA (D0-D7) pins. New data is available a short access time after each rising clock edge. The data is clocked into the FPGA on the following rising edge of the CCLK. A free-running oscillator can be used in the Slave-Parallel or Slave-SelecMAP modes. Multiple devices can be concatenated by using the CEO output to drive the CE input of the following device. The clock inputs and the DATA outputs of all PROMs in this chain are interconnected. All devices are compatible and can be cascaded with other members of the family or with the XC17V00 one-time programmable Serial PROM family. CLK CE TCK TMS TDI Control and JTAG Interface Serial Slow/Fast configuration (up to 33 MHz) OE/Reset Data Memory Address Data TDO CEO Serial or Parallel Interface D0 DATA Serial or Parallel Mode 7 D[1:7] Parallel Interface CF DS026_01_090502 Figure 1: XC18V00 Series Block Diagram ©2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and further disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. NOTICE OF DISCLAIMER: Xilinx is providing this design, code, or information "as is." By providing the design, code, or information as one possible implementation of this feature, application, or standard, Xilinx makes no representation that this implementation is free from any claims of infringement. You are responsible for obtaining any rights you may require for your implementation. Xilinx expressly disclaims any warranty whatsoever with respect to the adequacy of the implementation, including but not limited to any warranties or representations that this implementation is free from claims of infringement and any implied warranties of merchantability or fitness for a particular purpose. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 1 R XC18V00 Series In-System Programmable Configuration PROMs Pinout and Pin Description Table 1 provides a list of the pin names and descriptions for the 44-pin VQFP and PLCC and the 20-pin SOIC and PLCC packages. Table 1: Pin Names and Descriptions Pin Name Boundary Scan Order Function Pin Description D0 4 DATA OUT 3 OUTPUT ENABLE 6 DATA OUT 5 OUTPUT ENABLE 2 DATA OUT 1 OUTPUT ENABLE 8 DATA OUT 7 OUTPUT ENABLE 24 DATA OUT 23 OUTPUT ENABLE 10 DATA OUT 9 OUTPUT ENABLE 17 DATA OUT 16 OUTPUT ENABLE 14 DATA OUT 13 OUTPUT ENABLE CLK 0 DATA IN OE/ RESET 20 DATA IN 19 DATA OUT 18 OUTPUT ENABLE 15 DATA IN D1 D2 D3 D4 D5 D6 D7 CE 2 44-pin VQFP 44-pin PLCC 20-pin SOIC & PLCC D0 is the DATA output pin to provide data for configuring an FPGA in serial mode. 40 2 1 D0-D7 are the output pins to provide parallel data for configuring a Xilinx FPGA in Slave-Parallel/SelectMap mode. D1-D7 remain in HIGHZ state when the PROM operates in serial mode. D1-D7 can be left unconnected when the PROM is used in serial mode. 29 35 16 42 4 2 27 33 15 9 15 7(1) 25 31 14 14 20 9 19 25 12 Each rising edge on the CLK input increments the internal address counter if both CE is Low and OE/RESET is High. 43 5 3 When Low, this input holds the address counter reset and the DATA output is in a high-impedance state. This is a bidirectional open-drain pin that is held Low while the PROM is reset. Polarity is NOT programmable. 13 19 8 When CE is High, the device is put into low-power standby mode, the address counter is reset, and the DATA pins are put in a high-impedance state. 15 21 10 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs Table 1: Pin Names and Descriptions (Continued) Pin Name Boundary Scan Order Function CF 22 DATA OUT 21 OUTPUT ENABLE 12 DATA OUT 11 OUTPUT ENABLE CEO GND 44-pin VQFP 44-pin PLCC 20-pin SOIC & PLCC Allows JTAG CONFIG instruction to initiate FPGA configuration without powering down FPGA. This is an open-drain output that is pulsed Low by the JTAG CONFIG command. 10 16 7(1) Chip Enable Output (CEO) is connected to the CE input of the next PROM in the chain. This output is Low when CE is Low and OE/RESET input is High, AND the internal address counter has been incremented beyond its Terminal Count (TC) value. CEO returns to High when OE/RESET goes Low or CE goes High. 21 27 13 6, 18, 28 & 41 3, 12, 24 & 34 11 Pin Description GND is the ground connection. TMS MODE SELECT The state of TMS on the rising edge of TCK determines the state transitions at the Test Access Port (TAP) controller. TMS has an internal 50K ohm resistive pull-up on it to provide a logic “1” to the device if the pin is not driven. 5 11 5 TCK CLOCK This pin is the JTAG test clock. It sequences the TAP controller and all the JTAG test and programming electronics. 7 13 6 TDI DATA IN This pin is the serial input to all JTAG instruction and data registers. TDI has an internal 50K ohm resistive pull-up on it to provide a logic “1” to the system if the pin is not driven. 3 9 4 TDO DATA OUT This pin is the serial output for all JTAG instruction and data registers. TDO has an internal 50K ohm resistive pull-up on it to provide a logic “1” to the system if the pin is not driven. 31 37 17 Positive 3.3V supply voltage for internal logic. 17, 35 & 38(3) 23, 41 & 44(3) 18 & 20(3) Positive 3.3V or 2.5V supply voltage connected to the input buffers(2) and output voltage drivers. 8, 16, 26 & 36 14, 22, 32 & 42 19 No connects. 1, 2, 4, 11, 12, 20, 22, 23, 24, 30, 32, 33, 34, 37, 39, 44 1, 6, 7, 8, 10, 17, 18, 26, 28, 29, 30, 36, 38, 39, 40, 43 VCCINT VCCO NC Notes: 1. 2. 3. By default, pin 7 is the D4 pin in the 20-pin packages. However, CF --> D4 programming option can be set to override the default and route the CF function to pin 7 in the Serial mode. For devices with IDCODES 0502x093h, the input buffers are supplied by VCCINT. For devices with IDCODES, 0503x093h, these VCCINT pins are no connects: pin 38 in 44-pin VQFP package, pin 44 in 44-pin PLCC package and pin 20 in 20-pin SOIC and20-pin PLCC packages. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 3 R XC18V00 Series In-System Programmable Configuration PROMs 7 8 9 10 11 12 13 14 15 16 17 39 38 37 36 35 34 33 32 31 30 29 PC44 Top View NC NC TDO NC D1 GND D3 VCCO D5 NC NC 20 19 18 17 16 15 14 13 12 11 SO20 Top View *See pin descriptions. VCCINT* VCCO VCCINT* TDO D1 D3 D5 CEO D7 GND DS026_14_060403 *See pin descriptions. DS026_12_060403 TDI TMS TCK D4/CF* OE/RESET 4 5 6 7 8 18 PC20 17 Top View 16 15 14 9 10 11 12 13 NC OE/RESET D6 CE VCCO VCCINT* GND D7 NC CEO NC 3 2 1 20 19 18 19 20 21 22 23 24 25 26 27 28 NC NC TDI NC TMS GND TCK VCCO D4 CF NC 1 2 3 4 5 6 7 8 9 10 DATA(D0) D2 CLK TDI TMS TCK CF/D4* OE/RESET D6 CE CLK D2 D0 VCCINT* VCCO 6 5 4 3 2 1 44 43 42 41 40 NC CLK D2 GND D0 NC VCCINT* NC VCCO VCCINT* NC Pinout Diagrams VCCINT* TDO D1 D3 D5 D6 CE GND D7 CEO NC CLK D2 GND D0 NC VCCINT* NC VCCO VCCINT* NC *See pin descriptions. 44 43 42 41 40 39 38 37 36 35 34 DS026_15_060403 1 2 3 4 5 6 7 8 9 10 11 33 32 31 30 29 28 27 26 25 24 23 VQ44 Top View NC NC TDO NC D1 GND D3 VCCO D5 NC NC NC OE/RESET D6 CE VCCO VCCINT* GND D7 NC CEO NC 12 13 14 15 16 17 18 19 20 21 22 NC NC TDI NC TMS GND TCK VCCO D4 CF NC *See pin descriptions. 4 DS026_13_060403 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs Xilinx FPGAs and Compatible PROMs Table 2 provides a list of Xilinx FPGAs and compatible PROMs. Table 2: Xilinx FPGAs and Compatible PROMs Table 2: Xilinx FPGAs and Compatible PROMs Device Configuration Bits XC18V00 Solution XC18V00 Solution XCV800 4,715,616 Device Configuration Bits XC18V04 + XC18V512 XC2VP2 1,305,440 XC18V02 XCV1000 6,127,744 XC18V04 + XC18V02 XC2VP4 3,006,560 XC18V04 XCV50E 630,048 XC18V01 XC2VP7 4,485,472 XC18V04 + XC18V512 XCV100E 863,840 XC18V01 XC2VP20 8,214,624 2 of XC18V04 XCV200E 1,442,016 XC18V02 XC2VP30 11,364,608 3 of XC18V04 XCV300E 1,875,648 XC18V02 XC2VP40 15,563,264 4 of XC18V04 XCV400E 2,693,440 XC18V04 XC2VP50 19,021,472 5 of XC18V04 XCV405E 3,430,400 XC18V04 XC2VP70 25,604,096 6 of XC18V04 + XC18V512 XCV600E 3,961,632 XC18V04 XCV812E 6,519,648 2 of XC18V04 XC2VP100 33,645,312 8 of XC18V04 + XC18V512 XCV1000E 6,587,520 2 of XC18V04 XCV1600E 8,308,992 2 of XC18V04 XC2VP125 42,782,208 10 of XC18V04 + XC18V01 XCV2000E 10,159,648 3 of XC18V04 XC2V40 360,096 XC18V512 XCV2600E 12,922,336 4 of XC18V04 XC2V80 635,296 XC18V01 XCV3200E 16,283,712 4 of XC18V04 XC2V250 1,697,184 XC18V02 XC2S15 197,696 XC18V512 XC2V500 2,761,888 XC18V04 XC2S30 336,768 XC18V512 XC2V1000 4,082,592 XC18V04 XC2S50 559,200 XC18V01 XC2V1500 5,659,296 XC18V04 + XC18V02 XC2S100 781,216 XC18V01 XC2S150 1,040,096 XC18V01 XC2V2000 7,492,000 2 of XC18V04 XC2S200 1,335,840 XC18V02 XC2V3000 10,494,368 3 of XC18V04 XC2S50E 630,048 XC18V01 XC2V4000 15,659,936 4 of XC18V04 XC2S100E 863,840 XC18V01 XC2V6000 21,849,504 5 of XC18V04 + XC18V02 XC2S150E 1,134,496 XC18V02 XC2S200E 1,442,016 XC18V02 XC2V8000 29,063,072 7 of XC18V04 XC2S300E 1,875,648 XC18V02 XCV50 559,200 XC18V01 XC2S400E 2,693,440 XC18V04 XCV100 781,216 XC18V01 XC2S600E 3,961,632 XC18V04 XCV150 1,040,096 XC18V01 XC3S50 439,264 XC18V512 XCV200 1,335,840 XC18V02 XC3S200 1,047,616 XC18V01 XCV300 1,751,808 XC18V02 XC3S400 1,699,136 XC18V02 XCV400 2,546,048 XC18V04 XC3S1000 3,223,488 XC18V04 XCV600 3,607,968 XC18V04 DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 5 R XC18V00 Series In-System Programmable Configuration PROMs Table 2: Xilinx FPGAs and Compatible PROMs Device Configuration Bits XC18V00 Solution XC3S1500 5,214,784 XC18V04 + XC18V01 XC3S2000 7,673,024 2 of XC18V04 XC3S4000 11,316,864 3 of XC18V04 XC3S5000 13,271,936 3 of XC18V04 + XC18V01 protocol as shown in Figure 2. In-system programming offers quick and efficient design iterations and eliminates unnecessary package handling or socketing of devices. The Xilinx development system provides the programming data sequence using either Xilinx iMPACT software and a download cable, a third-party JTAG development system, a JTAG-compatible board tester, or a simple microprocessor interface that emulates the JTAG instruction sequence. The iMPACT software also outputs serial vector format (SVF) files for use with any tools that accept SVF format and with automatic test equipment. All outputs are held in a high-impedance state or held at clamp levels during in-system programming. Capacity Devices Configuration Bits XC18V04 4,194,304 XC18V02 2,097,152 XC18V01 1,048,576 XC18V512 524,288 OE/RESET The ISP programming algorithm requires issuance of a reset that causes OE to go Low. External Programming In-System Programming In-System Programmable PROMs can be programmed individually, or two or more can be daisy-chained together and programmed in-system via the standard 4-pin JTAG Xilinx reprogrammable PROMs can also be programmed by the Xilinx HW-130, Xilinx MultiPRO, or a third-party device programmer. This provides the added flexibility of using pre-programmed devices with an in-system programmable option for future enhancements and design changes. T V CCIN GND (a) (b) DS026_02_06/1103 Figure 2: In-System Programming Operation (a) Solder Device to PCB and (b) Program Using Download Cable Reliability and Endurance Design Security Xilinx in-system programmable products provide a guaranteed endurance level of 20,000 in-system program/erase cycles and a minimum data retention of 20 years. Each device meets all functional, performance, and data retention specifications within this endurance limit. The Xilinx in-system programmable PROM devices incorporate advanced data security features to fully protect the programming data against unauthorized reading via JTAG. Table 3 shows the security setting available. 6 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs The read security bit can be set by the user to prevent the internal programming pattern from being read or copied via JTAG. When set, it allows device erase. Erasing the entire device is the only way to reset the read security bit. Table 3: Data Security Options Default = Reset Set Read Allowed Program/Erase Allowed Verify Allowed Read Inhibited via JTAG Program/Erase Allowed Verify Inhibited IEEE 1149.1 Boundary-Scan (JTAG) The XC18V00 family is fully compliant with the IEEE Std. 1149.1 Boundary-Scan, also known as JTAG. A Test Access Port (TAP) and registers are provided to support all required boundary scan instructions, as well as many of the optional instructions specified by IEEE Std. 1149.1. In addition, the JTAG interface is used to implement in-system programming (ISP) to facilitate configuration, erasure, and verification operations on the XC18V00 device. Table 4 lists the required and optional boundary-scan instructions supported in the XC18V00. Refer to the IEEE Std. 1149.1 specification for a complete description of boundary-scan architecture and the required and optional instructions. Table 4: Boundary Scan Instructions Boundary-Scan Command Binary Code [7:0] Description Required Instructions BYPASS 11111111 Enables BYPASS SAMPLE/ PRELOAD 00000001 Enables boundary-scan SAMPLE/PRELOAD operation EXTEST 00000000 Enables boundary-scan EXTEST operation CLAMP 11111010 Enables boundary-scan CLAMP operation HIGHZ 11111100 all outputs in high-impedance state simultaneously IDCODE 11111110 Enables shifting out 32-bit IDCODE 11111101 11101110 IR[4] IR[3] IR[2] IR[1:0] 000 ISP Status Security 0 01 ->TDO Notes: 1. IR(1:0) = 01 is specified by IEEE Std. 1149.1 Figure 3: Instruction Register Values Loaded into IR as Part of an Instruction Scan Sequence Boundary Scan Register The boundary-scan register is used to control and observe the state of the device pins during the EXTEST, SAMPLE/PRELOAD, and CLAMP instructions. Each output pin on the XC18V00 has two register stages that contribute to the boundary-scan register, while each input pin only has one register stage. For each output pin, the register stage nearest to TDI controls and observes the output state, and the second stage closest to TDO controls and observes the High-Z enable state of the pin. For each input pin, the register stage controls and observes the input state of the pin. The IDCODE is a fixed, vendor-assigned value that is used to electrically identify the manufacturer and type of the device being addressed. The IDCODE register is 32 bits wide. The IDCODE register can be shifted out for examination by using the IDCODE instruction. The IDCODE is available to any other system component via JTAG. vvvv:ffff:ffff:aaaa:aaaa:cccc:cccc:ccc1 Enables shifting out 32-bit USERCODE where Initiates FPGA configuration by pulsing CF pin Low once v = the die version number f = the family code (50h for XC18V00 family) a = the ISP PROM product ID (36h for the XC18V04) Instruction Register The Instruction Register (IR) for the XC18V00 is eight bits wide and is connected between TDI and TDO during an DS026 (v4.0) June 11, 2003 Product Specification TDI-> IR[7:5] The IDCODE register has the following binary format: XC18V00 Specific Instructions CONFIG The ISP Status field, IR(4), contains logic “1” if the device is currently in ISP mode; otherwise, it contains logic “0”. The Security field, IR(3), contains logic “1” if the device has been programmed with the security option turned on; otherwise, it contains logic “0”. Identification Registers Optional Instructions USERCODE instruction scan sequence. In preparation for an instruction scan sequence, the instruction register is parallel loaded with a fixed instruction capture pattern. This pattern is shifted out onto TDO (LSB first), while an instruction is shifted into the instruction register from TDI. The detailed composition of the instruction capture pattern is illustrated in Figure 3. c = the company code (49h for Xilinx) Note: The LSB of the IDCODE register is always read as logic “1” as defined by IEEE Std. 1149.1. www.xilinx.com 1-800-255-7778 7 R XC18V00 Series In-System Programmable Configuration PROMs the XC18V00 device. If the device is blank or was not loaded during programming, the USERCODE register contains FFFFFFFFh. Table 5 lists the IDCODE register values for the XC18V00 devices. Table 5: IDCODES Assigned to XC18V00 Devices XC18V00 TAP Characteristics ISP-PROM IDCODE XC18V01 05024093h or 05034093h XC18V02 05025093h or 05035093h XC18V04 05026093h or 05036093h XC18V512 05023093h or 05033093h The XC18V00 family performs both in-system programming and IEEE 1149.1 boundary-scan (JTAG) testing via a single 4-wire Test Access Port (TAP). This simplifies system designs and allows standard Automatic Test Equipment to perform both functions. The AC characteristics of the XC18V00 TAP are described as follows. TAP Timing The USERCODE instruction gives access to a 32-bit user programmable scratch pad typically used to supply information about the device’s programmed contents. By using the USERCODE instruction, a user-programmable identification code can be shifted out for examination. This code is loaded into the USERCODE register during programming of Figure 4 shows the timing relationships of the TAP signals. These TAP timing characteristics are identical for both boundary-scan and ISP operations. TCKMIN1,2 TCK TMSS TMSH TMS TDIS TDIH TDI TDOV TDO DS026_04_032702 Figure 4: Test Access Port Timing TAP AC Parameters Table 6 shows the timing parameters for the TAP waveforms shown in Figure 4. Table 6: Test Access Port Timing Parameters Symbol 8 Parameter Min Max Units TCKMIN1 TCK minimum clock period 100 - ns TCKMIN2 TCK minimum clock period, Bypass Mode 50 - ns TMSS TMS setup time 10 - ns TMSH TMS hold time 25 - ns TDIS TDI setup time 10 - ns TDIH TDI hold time 25 - ns TDOV TDO valid delay - 25 ns www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs Connecting Configuration PROMs Connecting the FPGA device with the configuration PROM (see Figure 5 and Figure 6). • • • • • • The DATA output(s) of the PROM(s) drives the DIN input of the lead FPGA device. The Master FPGA CCLK output drives the CLK input(s) of the PROM(s) (in Master-Serial and Master-SelectMAP modes only). The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any). The OE/RESET pins of all PROMs are connected to the INIT pins of all FPGA devices. This connection assures that the PROM address counter is reset before the start of any (re)configuration, even when a reconfiguration is initiated by a VCCINT glitch. The PROM CE input can be driven from the DONE pin. The CE input of the first (or only) PROM can be driven by the DONE output of all target FPGA devices, provided that DONE is not permanently grounded. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary supply current of 10 mA maximum. Slave-Parallel/SelectMap mode is similar to slave serial mode. The DATA is clocked out of the PROM one byte per CCLK instead of one bit per CCLK cycle. See FPGA data sheets for special configuration requirements. Initiating FPGA Configuration The XC18V00 devices incorporate a pin named CF that is controllable through the JTAG CONFIG instruction. Executing the CONFIG instruction through JTAG pulses the CF low once for 300-500 ns, which resets the FPGA and initiates configuration. The CF pin must be connected to the PROGRAM pin on the FPGA(s) to use this feature. The iMPACT software can also issue a JTAG CONFIG command to initiate FPGA configuration through the “Load FPGA” setting. The 20-pin packages do not have a dedicated CF pin. For 20-pin packages, the CF --> D4 setting can be used to route the CF pin function to pin 7 only if the parallel output mode is not used. Selecting Configuration Modes The XC18V00 accommodates serial and parallel methods of configuration. The configuration modes are selectable DS026 (v4.0) June 11, 2003 Product Specification through a user control register in the XC18V00 device. This control register is accessible through JTAG, and is set using the “Parallel mode” setting on the Xilinx iMPACT software. Serial output is the default configuration mode. Master Serial Mode Summary The I/O and logic functions of the Configurable Logic Block (CLB) and their associated interconnections are established by a configuration program. The program is loaded either automatically upon power up, or on command, depending on the state of the three FPGA mode pins. In Master Serial mode, the FPGA automatically loads the configuration program from an external memory. Xilinx PROMs are designed to accommodate the Master Serial mode. Upon power-up or reconfiguration, an FPGA enters the Master Serial mode whenever all three of the FPGA mode-select pins are Low (M0=0, M1=0, M2=0). Data is read from the PROM sequentially on a single data line. Synchronization is provided by the rising edge of the temporary signal CCLK, which is generated by the FPGA during configuration. Master Serial Mode provides a simple configuration interface. Only a serial data line, a clock line, and two control lines are required to configure an FPGA. Data from the PROM is read sequentially, accessed via the internal address and bit counters which are incremented on every valid rising edge of CCLK. If the user-programmable, dual-function DIN pin on the FPGA is used only for configuration, it must still be held at a defined level during normal operation. The Xilinx FPGA families take care of this automatically with an on-chip pull-up resistor. Cascading Configuration PROMs For multiple FPGAs configured as a serial daisy-chain, or a single FPGA requiring larger configuration memories in a serial or SelectMAP configuration mode, cascaded PROMs provide additional memory (Figure 5). Multiple XC18V00 devices can be concatenated by using the CEO output to drive the CE input of the downstream device. The clock inputs and the data outputs of all XC18V00 devices in the chain are interconnected. After the last data from the first PROM is read, the next clock signal to the PROM asserts its CEO output Low and drives its DATA line to a high-impedance state. The second PROM recognizes the Low level on its CE input and enables its DATA output. See Figure 7. After configuration is complete, address counters of all cascaded PROMs are reset if the PROM OE/RESET pin goes Low or CE goes High. www.xilinx.com 1-800-255-7778 9 R XC18V00 Series In-System Programmable Configuration PROMs VCCO (See Note 2) VCCO VCCINT VCCO VCCINT (See Note 2) (See Note 2) 4.7K MODE PINS MODE PINS (See Note 1) DIN VCCINT VCCINT D0 VCCO J1 1 TDI TMS TCK 4 TDO VCCO 4.7K Master Serial (See Note 1) First PROM Xilinx FPGA Slave Serial CLK CCLK CCLK TMS CE TMS CE DONE DONE TCK CEO TCK CEO TDI 2 3 Xilinx FPGA XC18V00 Cascaded PROM DIN DOUT D0 VCCO XC18V00 (See Note 1) CLK TDI OE/RESET OE/RESET CF CF TDO GND TDO GND INIT INIT PROGRAM PROGRAM TDI TDI TMS TMS TCK TCK TDO TDO Notes: 1For Mode pin connections and DONE pin pullup value, refer to appropriate FPGA data sheet. 2For compatible voltages, refer to the appropriate FPGA data sheet. DS026_08_061003 Figure 5: Configuring Multiple Devices in Master/Slave Serial Mode (2) VCCO (2) (2) VCCO VCCINT VCCO VCCINT 4.7K (1) MODE PINS MODE PINS D[0:7] (3) VCCINT (3) D[0:7] VCCO J1 TDI TMS TCK TDO 1 2 3 4 D[0:7] VCCINT (3) VCCO XC18V00 XC18V00 Cascaded PROM First PROM (2) VCCO (1) **D[0:7] Xilinx Virtex-II FPGA Xilinx Virtex-II FPGA 4.7K Master Serial/ SelectMAP Slave Serial/ SelectMAP CLK CCLK CCLK TMS CE TMS CE DONE DONE TCK CEO TCK CEO TDI GND CLK TDI OE/RESET OE/RESET CF CF TDO GND TDO INIT INIT PROGRAM PROGRAM TDI TDI TMS TCK Notes: 1 For Mode pin connections and DONE pin pullup value, refer to the appropriate FPGA data sheet. 2 For compatible voltges, refer to the appropriate FPGA data sheet. 3 Master/Slave Serial Mode does not require D[1:7] to be connected. TMS TDO TCK TDO DS026_09_051003 Figure 6: Configuring Multiple Virtex-II Devices with Identical Patterns in Master/Slave or Serial/SelectMAP Modes 10 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs OPTIONAL Daisy-chained FPGAs with different configurations DOUT FPGA Vcco(2) OPTIONAL Slave FPGAs with identical configurations VCCINT VCCO(2) 4.7K Modes (1) Vcco(2) (2) VCCINT VCCO Vcco(2) 4.7K VCCINT VCCO VCCINT VCCO DATA First CLK PROM CEO CE DIN CCLK DONE INIT PROGRAM DATA CLK Cascaded PROM CE OE/RESET OE/RESET CF CF Notes: 1 For Mode pin connections and Done pullup value, refer to the appropriate FPGA data sheet. 2 For compatible voltages, refer to the appropriate FPGA data sheet. (a) Master Serial Mode I/O(1) I/O (1) Modes(2) WRITE 1K VIRTEX Select MAP NC External Osc (3) CS VCCINT VCCO (4) VCCINT VCCO (4) 1K (4) Vcco Vcco(4) BUSY VCCINT VCCO 4.7K (2) (4) Vcco XC18Vxx 4.7K CLK CCLK 8 PROGRAM D[0:7] CEO D[0:7] CE DONE OE/RESET INIT VCCINT VCCO XC18Vxx CLK D[0:7] CE CF OE/RESET CEO CF Notes: 1 CS and WRITE must be either driven Low or pulled down externally. One option is shown. 2 For Mode pin connections and Done pullup value, refer to the appropriate FPGA data sheet. 3 External oscillator required for Virtex/Virtex-E SelectMAP or Virtex-II/Virtex-II Pro Slave-SelectMAP modes. 4 For compatible voltages, refer to the appropriate FPGA data sheet. (b) Virtex/Virtex-E/Virtex-II/Virtex-II Pro SelectMAP Mode I/O(1) I/O (1) Modes(2) WRITE Spartan-II, Spartan-IIE NC External Osc (3) CS BUSY 1K 1K Vcco(4) Vcco (4) PROGRAM D[0:7] VCCINT VCCO 3.3K (2) CCLK (4) VCCINT VCCO (4) VCCINT XC18Vxx 4.7K CLK 8 DONE INIT D[0:7] CE OE/RESET CF Notes: 1 CS and WRITE must be pulled down to be used as I/O. One option is shown. 2 For Mode pin connections and Done pullup value and if Drive Done configuration option is not active, refer to the appropriate FPGA data sheet. 3 External oscillator required for Spartan-II/Spartan-IIE Slave-Parallel modes. 4 For compatible voltages, refer to the appropriate FPGA data sheet. (c) Spartan-II/Spartan-IIE Slave-Parallel Mode DS026_05_060403 Figure 7: (a) Master Serial Mode (b) Virtex/Virtex-E/Virtex-II Pro SelectMAP Mode (c) Spartan-II/Spartan-IIE Slave-Parallel Mode (dotted lines indicate optional connection) DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 11 R XC18V00 Series In-System Programmable Configuration PROMs Reset Activation On power up, OE/RESET is held low until the XC18V00 is active (1 ms). OE/RESET is connected to an external resistor to pull OE/RESET HIGH releasing the FPGA INIT and allowing configuration to begin. If the power drops below 2.0V, the PROM resets. OE/RESET polarity is not programmable. See Figure 8 for power-up requirements. 3.6V Recommended Operating Range 3.0V Volts Recommended VCCINT Rise Time remains in a high-impedance state regardless of the state of the OE input. JTAG pins TMS, TDI and TDO can be in a high-impedance state or High. See Table 7. 5V Tolerant I/Os The I/Os on each re-programmable PROM are fully 5V tolerant even through the core power supply is 3.3V. This allows 5V CMOS signals to connect directly to the PROM inputs without damage. In addition, the 3.3V VCCINT power supply can be applied before or after 5V signals are applied to the I/Os. In mixed 5V/3.3V/2.5V systems, the user pins, the core power supply (VCCINT), and the output power supply (VCCO) can have power applied in any order. This makes the PROM devices immune to power supply sequencing issues. Customer Control Bits 0V 0ms 1ms 50ms Time (ms) ds026_10_061103 Figure 8: VCCINT Power-Up Requirements Standby Mode The PROM enters a low-power standby mode whenever CE is asserted High. The address is reset. The output The XC18V00 PROMs have various control bits accessible by the customer. These can be set after the array has been programmed using “Skip User Array” in Xilinx iMPACT software. The iMPACT software can set these bits to enable the optional JTAG read security, parallel configuration mode, or CF-->D4 pin function. See Table 7. Table 7: Truth Table for PROM Control Inputs Control Inputs Outputs OE/RESET CE Internal Address DATA CEO ICC High Low If address < TC(1): increment If address > TC (1): don’t change Active High-Z High Low Active Reduced Low Low Held reset High-Z High Active High High Held reset High-Z High Standby Low High Held reset High-Z High Standby Notes: 1. TC = Terminal Count = highest address value. TC + 1 = address 0. 12 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs Absolute Maximum Ratings(1,2) Symbol Description Value Units Supply voltage relative to GND –0.5 to +4.0 V VIN Input voltage with respect to GND –0.5 to +5.5 V VTS Voltage applied to High-Z output –0.5 to +5.5 V TSTG Storage temperature (ambient) –65 to +150 °C TSOL Maximum soldering temperature (10s @ 1/16 in.) +220 °C Junction temperature +125 °C VCCINT/VCCO TJ Notes: 1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins can undershoot to –2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less then 10 ns and with the forcing current being limited to 200 mA. 2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability. Recommended Operating Conditions Symbol VCCINT VCCO Parameter Min Max Units Internal voltage supply 3.0 3.6 V Supply voltage for output drivers for 3.3V operation 3.0 3.6 V Supply voltage for output drivers for 2.5V operation 2.3 2.7 V VIL Low-level input voltage 0 0.8 V VIH High-level input voltage 2.0 5.5 V VO Output voltage 0 VCCO V 1 50 ms –40° 85° C TVCC TA VCCINT rise time from 0V to nominal voltage(1) Operating ambient temperature Notes: 1. At power up, the device requires the VCCINT power supply to monotonically rise from 0V to nominal voltage within the specified VCCINT rise time. If the power supply cannot meet this requirement, then the device might not perform power-on-reset properly. See Figure 8. Quality and Reliability Characteristics Symbol Description Min Max Units 20 - Years TDR Data retention NPE Program/erase cycles (Endurance) 20,000 - Cycles VESD Electrostatic discharge (ESD) 2,000 - Volts DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 13 R XC18V00 Series In-System Programmable Configuration PROMs DC Characteristics Over Operating Conditions Symbol Parameter Test Conditions Min Max Units 2.4 - V 90% VCCO - V High-level output voltage for 3.3V outputs IOH = –4 mA High-level output voltage for 2.5V outputs IOH = –500 µA Low-level output voltage for 3.3V outputs IOL = 8 mA - 0.4 V Low-level output voltage for 2.5V outputs IOL = 500 µA - 0.4 V ICC Supply current, active mode 25 MHz - 25 mA ICCS Supply current, standby mode - 10 mA VOH VOL IILJ JTAG pins TMS, TDI, and TDO pull-up current VCCINT = MAX VIN = GND - 100 µA IIL Input leakage current VCCINT = Max VIN = GND or VCCINT –10 10 µA IIH Input and output High-Z leakage current VCCINT = Max VIN = GND or VCCINT –10 10 µA CIN Input capacitance VIN = GND f = 1.0 MHz - 8 pF Output capacitance VOUT = GND f = 1.0 MHz - 14 pF COUT Notes: 1. Internal pull-up resistors guarantee valid logic levels at unconnected input pins. These pull-up resistors do not guarantee valid logic levels when input pins are connected to other circuits. 14 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs AC Characteristics Over Operating Conditions for XC18V04 and XC18V02 CE TSCE THCE OE/RESET THC TLC THOE TCYC CLK TOE TCE TCAC TDF TOH DATA TOH DS026_06_012000 Symbol Description Min Max Units TOE OE/RESET to data delay - 10 ns TCE CE to data delay - 20 ns TCAC CLK to data delay - 20 ns TOH Data hold from CE, OE/RESET, or CLK 0 - ns TDF CE or OE/RESET to data float delay(2) - 25 ns Clock periods 50 - ns TLC CLK Low time(3) 10 - ns THC CLK High time(3) 10 - ns TSCE CE setup time to CLK (guarantees proper counting)(3) 25 - ns THCE CE High time (guarantees counters are reset) 250 - ns THOE OE/RESET hold time (guarantees counters are reset) 250 - ns TCYC Notes: 1. AC test load = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels. 3. Guaranteed by design, not tested. 4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. 5. If THCE High < 2 µs, TCE = 2 µs. 6. If THCE Low < 2 µs, TOE = 2 µs. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 15 R XC18V00 Series In-System Programmable Configuration PROMs AC Characteristics Over Operating Conditions for XC18V01 and XC18V512 CE TSCE THCE OE/RESET THC TLC THOE TCYC CLK TOE TCE TCAC TDF TOH DATA TOH DS026_06_012000 Symbol Description Min Max Units TOE OE/RESET to data delay - 10 ns TCE CE to data delay - 15 ns TCAC CLK to data delay - 15 ns TOH Data hold from CE, OE/RESET, or CLK 0 - ns TDF CE or OE/RESET to data float delay(2) - 25 ns Clock periods 30 - ns TLC CLK Low time(3) 10 - ns THC CLK High time(3) 10 - ns TSCE CE setup time to CLK (guarantees proper counting)(3) 20 - ns THCE CE High time (guarantees counters are reset) 250 - ns THOE OE/RESET hold time (guarantees counters are reset) 250 - ns TCYC Notes: 1. AC test load = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels. 3. Guaranteed by design, not tested. 4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. 5. If THCE High < 2 µs, TCE = 2 µs. 6. If THOE High < 2 µs, TOE = 2 µs. 16 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs AC Characteristics Over Operating Conditions When Cascading for XC18V04 and XC18V02 OE/RESET CE CLK TCDF TOCE Last Bit DATA First Bit TOCK TOOE CEO DS026_07_020300 Symbol TCDF Description CLK to data float delay(2,3) delay(3) TOCK CLK to CEO TOCE CE to CEO delay(3) TOOE OE/RESET to CEO delay(3) Min Max Units - 25 ns - 20 ns - 20 ns - 20 ns Notes: 1. AC test load = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels. 3. Guaranteed by design, not tested. 4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 17 R XC18V00 Series In-System Programmable Configuration PROMs AC Characteristics Over Operating Conditions When Cascading for XC18V01 and XC18V512 OE/RESET CE CLK TCDF TOCE Last Bit DATA First Bit TOCK TOOE CEO DS026_07_020300 Symbol Description Min Max Units TCDF CLK to data float delay(2,3) - 25 ns TOCK CLK to CEO delay(3) - 20 ns TOCE CE to CEO delay(3) - 20 ns TOOE OE/RESET to CEO delay(3) - 20 ns Notes: 1. AC test load = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels. 3. Guaranteed by design, not tested. 4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V. 18 www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs Ordering Information XC18V04 VQ44 C Device Number Operating Range/Processing XC18V04 XC18V02 XC18V01 XC18V512 C = (TA = –40°C to +85°C) Package Type VQ44 = 44-pin Plastic Quad Flat Package PC44 = 44-pin Plastic Chip Carrier(1) SO20 = 20-pin Small-Outline Package(2) PC20 = 20-pin Plastic Leaded Chip Carrier(2) Notes: 1. XC18V04 and XC18V02 only. 2. XC18V01 and XC18V512 only. Valid Ordering Combinations XC18V04VQ44C XC18V02VQ44C XC18V01VQ44C XC18V512VQ44C XC18V04PC44C XC18V02PC44C XC18V01PC20C XC18V512PC20C XC18V01SO20C XC18V512SO20C Marking Information 44-pin Package XC18V04 VQ44 Device Number Operating Range/Processing XC18V04 XC18V02 XC18V01 XC18V512 C = (TA = –40°C to +85°C) Package Type VQ44 = 44-pin Plastic Quad Flat Package PC44 = 44-pin Plastic Leaded Chip Carrier(1) Notes: 1. XC18V02 and XC18V04 only. 20-pin Package(1) Due to the small size of the serial PROM packages, the complete ordering part number cannot be marked on the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows: 18V01 S C Device Number Operating Range/Processing 18V01 18V512 C = (TA = –40°C to +85°C) Package Type S = 20-pin Small-Outline Package J = 20-pin Plastic Leaded Chip Carrier Notes: 1. XC18V01 and XC18V512 only. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 19 R XC18V00 Series In-System Programmable Configuration PROMs Revision History The following table shows the revision history for this document. 20 Date Version Revision 2/9/99 1.0 First publication of this early access specification 8/23/99 1.1 Edited text, changed marking, added CF and parallel load 9/1/99 1.2 Corrected JTAG order, Security and Endurance data. 9/16/99 1.3 Corrected SelectMAP diagram, control inputs, reset polarity. Added JTAG and CF description, 256 Kbit and 128 Kbit devices. 01/20/00 2.0 Added Q44 Package, changed XC18xx to XC18Vxx 02/18/00 2.1 Updated JTAG configuration, AC and DC characteristics 04/04/00 2.2 Removed stand alone resistor on INIT pin in Figure 5. Added Virtex-E and EM parts to FPGA table. 06/29/00 2.3 Removed XC18V128 and updated format. Added AC characteristics for XC18V01, XC18V512, and XC18V256 densities. 11/13/00 2.4 Features: changed 264 MHz to 264 Mb/s at 33 MHz; AC Spec.: TSCE units to ns, THCE CE High time units to µs. Removed Standby Mode statement: “The lower power standby modes available on some XC18V00 devices are set by the user in the programming software”. Changed 10,000 cycles endurance to 20,000 cycles. 01/15/01 2.5 Updated Figures 5 and 6, added 4.7 resistors. Identification registers: changes ISP PROM product ID from 06h to 26h. 04/04/01 2.6 Updated Figure 6, Virtex SelectMAP mode; added XC2V products to Compatible PROM table; changed Endurance from 10,000 cycles, 10 years to 20,000, 20 years; 04/30/01 2.7 Updated Figure 6: removed Virtex-E in Note 2, fixed SelectMAP mode connections. Under AC Characteristics Over Operating Conditions for XC18V04 and XC18V02, changed TSCE from 25 ms to 25 ns. 06/11/01 2.8 AC Characteristics Over Operating Conditions for XC18V01 and XC18V512. Changed Min values for TSCE from 20 ms to 20 ns and for THCE from 2 ms to 2 µs. 09/28/01 2.9 Changed the boundary scan order for the CEO pin in Table 1, updated the configuration bits values in the table under Xilinx FPGAs and Compatible PROMs, and added information to the Recommended Operating Conditions table. 11/12/01 3.0 Updated for Spartan-IIE FPGA family. 12/06/01 3.1 Changed Figure 7(c). 02/27/02 3.2 Updated Table 2 and Figure 6 for the Virtex-II Pro family of devices. 03/15/02 3.3 Updated Xilinx software and modified Figure 6 and Figure 7. 03/27/02 3.4 Made changes to pages 1-3, 5, 7-11, 13, 14, and 18. Added new Figure 8 and Figure 9. 06/14/02 3.5 Made additions and changes to Table 2. 07/24/02 3.6 Changed last bullet under Connecting Configuration PROMs, page 9. 09/06/02 3.7 Multiple minor changes throughout, plus the addition of Pinout Diagrams, page 4 and the deletion of Figure 9. 10/31/02 3.8 Made minor change on Figure 7 (b) and changed orientation of SO20 diagram on page 5. www.xilinx.com 1-800-255-7778 DS026 (v4.0) June 11, 2003 Product Specification R XC18V00 Series In-System Programmable Configuration PROMs 11/18/02 3.9 Added XC2S400E and XC2S600E to Table 2. 04/17/03 3.10 Changes to Description, External Programming, and Table 2. 06/11/03 4.0 Added alternate IDCODES to Table 5, discontinued XC18V256 density, eliminated industrial ordering combinations, extended commercial temperature range, and added MultiPRO Desktop Tool support. Changed THOE and THCE to 250 ns in the tables on page 15 and page 16. Made change in capacitance values DC Characteristics Over Operating Conditions. Added Note 3 to Table 1. Other minor edits. DS026 (v4.0) June 11, 2003 Product Specification www.xilinx.com 1-800-255-7778 21