XILINX XC95144XV

0
XC95144XV High-Performance
CPLD
R
DS051 (v3.0) June 25, 2007
0
1
Note: This product is being discontinued. You cannot
order parts after May 14, 2008. Xilinx recommends replacing XC95144XV devices with equivalent XC95144XL
devices in all designs as soon as possible. Recommended
replacements are pin compatible, however require a VCC
change to 3.3V, and a recompile of the design file. In addition, there is no 1.8V I/O support, and only one output bank
is supported. See XCN07010 for details regarding this discontinuation, including device replacement recomendations
for the XC95144XV CPLD.
Features
•
•
•
•
•
•
•
•
144 macrocells with 3,200 usable gates
Available in small footprint packages
- 100-pin TQFP (81 user I/O pins)
- 144-pin TQFP (117 user I/O pins)
- 144-pin CSP (117 user I/O pins)
Optimized for high-performance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Two separate output banks
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- 20 year data retention
- ESD protection exceeding 2,000V
Product Specification
Power Estimation
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XV device may be configured for low-power
mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power.
For a general estimate of ICC, the following equation may be
used:
PTOTAL = PINT + PIO = ICCINT x VCCINT + PIO
Separating internal and I/O power here is convenient
because XC9500XV CPLDs also separate the corresponding power pins. PIO is a strong function of the load capacitance driven, so it is handled by I = CVf. ICCINT is another
situation that reflects the actual design considered and the
internal switching speeds. An estimation expression for
ICCINT (taken from simulation) is:
ICCINT(mA) = MCHS(0.122 X PTHS + 0.238) + MCLP(0.042 x
PTLP + 0.171) + 0.04(MCHS + MCLP) x fMAX x MCTOG
where:
MCHS = # macrocells used in high speed mode
MCLP = #macrocells used in low power mode
PTHS = average p-terms used per high speed macrocell
PTLP = average p-terms used over low power macrocell
fMAX = max clocking frequency in the device
MCTOG = % macrocells toggling on each clock (12% is
frequently a good estimate
This calculation was derived from laboratory measurements
of an XC9500XV part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual ICC
value varies with the design application and should be verified during normal system operation. Figure 1 shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
Description
The XC95144XV is a 2.5V CPLD targeted for high-performance, low-voltage applications in leading-edge communications and computing systems. It is comprised of eight
54V18 Function Blocks, providing 3,200 usable gates with
propagation delays of 5 ns.
© 2005, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS051 (v3.0) June 25, 2007
Product Specification
www.xilinx.com
1-800-255-7778
1
R
XC95144XV High-Performance CPLD
application note XAPP361, “Planning for High Speed
XC9500XV Designs.”
250
221 MHz
Typical ICC (mA)
200
150
H
P
igh
e rf o
rma
nce
120 MHz
100
Low
50
0
40
Pow
er
120
80
Clock Frequency (MHz)
160
200
DS051_01_121501
Figure 1: Typical ICC vs. Frequency for XC95144XV
2
www.xilinx.com
DS051 (v3.0) June 25, 2007
Product Specification
R
XC95144XV High-Performance CPLD
3
1
JTAG Port
JTAG
Controller
In-System Programming Controller
54
18
I/O
Function
Block 1
Macrocells
1 to 18
I/O
Fast CONNECT II Switch Matrix
I/O
I/O
I/O
Blocks
I/O
I/O
I/O
54
18
Function
Block 2
Macrocells
1 to 18
54
18
Function
Block 3
Macrocells
1 to 18
I/O
3
I/O/GCK
54
1
18
I/O/GSR
4
I/O/GTS
54
18
Function
Block 4
Macrocells
1 to 18
Function
Block 8
Macrocells
1 to 18
DS051_02_041000
Figure 2: XC95144XV Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
Supported I/O Standards
Table 1: IOSTANDARD Options
IOSTANDARD
VCCIO
LVTTL
3.3V
LVCMOS2
2.5V
X25TO18
1.8V
DS051 (v3.0) June 25, 2007
Product Specification
The XC95144XV CPLD features both LVCMOS and LVTTL
I/O implementations. See Table 1 for I/O standard voltages.
The LVTTL I/O standard is a general purpose EIA/JEDEC
standard for 3.3V applications that use an LVTTL input
buffer and Push-Pull output buffer. The LVCMOS2 standard
is used in 2.5V applications.
XC9500XV CPLDs are also 1.8V I/O compatible. The
X25TO18 setting is provided for generating 1.8V compatible
outputs from a CPLD normally operating in a 2.5V environ-
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3
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XC95144XV High-Performance CPLD
ment. The ISE software automatically groups outputs with
matching IOSTANDARD settings into the same VCCIO bank
when no location constraints are specified. The default I/O
Standard for pads without IOSTANDARD attributes is
LVTTL for XC9500XV devices.
Absolute Maximum Ratings
Symbol
Value
Units
Supply voltage relative to GND
–0.5 to 2.7
V
VCCIO
Supply voltage for output drivers
–0.5 to 3.6
V
VIN
Input voltage relative to GND(1)
–0.5 to 3.6
V
VTS
Voltage applied to 3-state output(1)
–0.5 to 3.6
V
TSTG
Storage temperature (ambient)
–65 to +150
oC
+150
oC
VCC
TJ
Description
Junction temperature
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
3. For solder specifications, see Xilinx Packaging.
Recommended Operation Conditions
Symbol
VCCINT
VCCIO
Parameter
Min
Max
Units
+70oC
2.37
2.62
V
Industrial TA = –40oC to +85oC
2.37
2.62
Supply voltage for output drivers for 3.3V operation
3.0
3.6
V
Supply voltage for output drivers for 2.5V operation
2.37
2.62
V
Supply voltage for output drivers for 1.8V operation
1.71
1.89
V
Supply voltage for internal logic
and input buffers
Commercial TA =
0oC
to
VIL
Low-level input voltage
0
0.8
V
VIH
High-level input voltage
1.7
3.6
V
VO
Output voltage
0
VCCIO
V
Quality and Reliability Characteristics
Symbol
4
Parameter
Min
Max
Units
20
-
Years
TDR
Data retention
NPE
Program/Erase cycles (endurance)
1,000
-
Cycles
VESD
Electrostatic Discharge (ESD)
2,000
-
Volts
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DS051 (v3.0) June 25, 2007
Product Specification
R
XC95144XV High-Performance CPLD
DC Characteristics (Over Recommended Operating Conditions)
Symbol
VOH
Parameter
Test Conditions
Min
Max
Units
Output high voltage for 3.3V outputs
IOH = –4.0 mA
2.4
-
V
Output high voltage for 2.5V outputs
IOH = –1.0 mA
2.0
-
V
Output high voltage for 1.8V outputs
IOH = –100 μA
90% VCCIO
-
V
Output low voltage for 3.3V outputs
IOL = 8.0 mA
-
0.4
V
Output low voltage for 2.5V outputs
IOL = 1.0 mA
-
0.4
V
Output low voltage for 1.8V outputs
IOL = 100 μA
-
0.4
V
IIL
Input leakage current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
±10
μA
IIH
Input high-Z leakage current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
±10
μA
VCC min < VIN < 3.6V
-
±150
μA
-
10
pF
VOL
CIN
I/O capacitance
VIN = GND
f = 1.0 MHz
ICC
Operating Supply Current
(low power mode, active)
VI = GND, No load
f = 1.0 MHz
29
mA
AC Characteristics
Symbol
Parameter
XC95144XV-5
XC95144XV-7
Min
Max
Min
Max
Units
-
5.0
-
7.5
ns
3.5
-
4.8
-
ns
TPD
I/O to output valid
TSU
I/O setup time before GCK
TH
I/O hold time after GCK
0
-
0
-
ns
GCK to output valid
-
3.5
-
4.5
ns
fSYSTEM
Multiple FB internal operating frequency
-
222.2
-
125.0
MHz
TPSU
I/O setup time before p-term clock input
1.0
-
1.6
-
ns
TPH
I/O hold time after p-term clock input
2.5
-
3.2
-
ns
TCO
TPCO
P-term clock output valid
-
6.0
-
7.7
ns
TOE
GTS to output valid
-
4.0
-
5.0
ns
TOD
GTS to output disable
-
4.0
-
5.0
ns
TPOE
Product term OE to output enabled
-
7.0
-
9.5
ns
TPOD
Product term OE to output disabled
-
7.0
-
9.5
ns
TAO
GSR to output valid
-
10.0
-
12.0
ns
TPAO
P-term S/R to output valid
-
10.7
-
12.6
ns
TWLH
GCK pulse width (High or Low)
2.2
-
4.0
-
ns
TPLH
P-term clock pulse width (High or Low)
5.0
-
6.5
-
ns
Asynchronous preset/reset pulse width (High or Low)
5.0
-
6.5
-
ns
TAPRPW
DS051 (v3.0) June 25, 2007
Product Specification
www.xilinx.com
5
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XC95144XV High-Performance CPLD
VTEST
R1
Output Type
Device Output
R2
CL
VCCIO
VTEST
R1
R2
CL
3.3V
3.3V
320Ω
360Ω
35 pF
2.5V
2.5V
250Ω
660Ω
35 pF
1.8V
1.8V
10KΩ
14KΩ
35 pF
DS051_03_0601000
Figure 3: AC Load Circuit
Internal Timing Parameters
Symbol
Parameter
XC95144XV-5
XC95144XV-7
Min
Max
Min
Max
Units
Buffer Delays
TIN
Input buffer delay
-
2.0
-
2.3
ns
TGCK
GCK buffer delay
-
1.2
-
1.5
ns
TGSR
GSR buffer delay
-
2.0
-
3.1
ns
TGTS
GTS buffer delay
-
4.0
-
5.0
ns
TOUT
Output buffer delay
-
2.1
-
2.5
ns
TEN
Output buffer enable/disable delay
-
0
-
0
ns
Product Term Control Delays
TPTCK
Product term clock delay
-
1.7
-
2.4
ns
TPTSR
Product term set/reset delay
-
0.7
-
1.4
ns
TPTTS
Product term 3-state delay
-
5.0
-
7.2
ns
-
0.2
-
1.3
ns
2.0
-
2.6
-
ns
Internal Register and Combinatorial Delays
TPDI
Combinatorial logic propagation delay
TSUI
Register setup time
THI
Register hold time
1.5
-
2.2
-
ns
TECSU
Register clock enable setup time
2.0
-
2.6
-
ns
TECHO
Register clock enable hold time
1.5
-
2.2
-
ns
TCOI
Register clock to output valid time
-
0.2
-
0.5
ns
TAOI
Register async. S/R to output delay
-
5.9
-
6.4
TRAI
Register async. S/R recover before clock
TLOGI
Internal logic delay
-
0.7
-
1.4
ns
TLOGILP
Internal low power logic delay
-
5.7
-
6.4
ns
-
1.6
-
3.5
ns
-
0.7
-
0.8
ns
5.0
7.5
ns
ns
Feedback Delays
TF
Fast CONNECT II feedback delay
Time Adders
6
TPTA
Incremental product term allocator delay
TPTA2
Adjacent macrocell p-term allocator delay
-
0.3
-
0.3
ns
TSLEW
Slew-rate limited delay
-
3.0
-
4.0
ns
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DS051 (v3.0) June 25, 2007
Product Specification
R
XC95144XV High-Performance CPLD
XC95144XV I/O Pins
Function MacroBlock
cell
1
TQ100
TQ144
CS144
BScan
Order
Bank
-
23
H3
429
1
1
Function MacroBlock
cell
3
TQ100
TQ144
CS144
BScan
Order
Bank
1
-
39
M3
321
1
32(1)
L1(1)
318
1
1
2
11
16
F1
426
1
3
2
23(1)
1
3
12
17
G2
423
1
3
3
-
41
K4
315
1
1
4
-
25
J1
420
1
3
4
-
44
N4
312
1
1
5
13
19
G3
417
1
3
5
24
33
L2
309
1
1
6
14
20
G4
414
1
3
6
25
34
L3
306
1
1
7
-
-
-
411
-
3
7
-
46
L5
303
1
1
8
15
21
H1
408
1
3
8
27(1)
38(1)
N2(1)
300
1
1
9
16
22
H2
405
1
3
9
28
40
N3
297
1
1
10
-
31
K3
402
1
3
10
-
48
N5
294
1
1
11
17
24
H4
399
1
3
11
29
43
M4
291
1
1
12
18
26
J2
396
1
3
12
30
45
K5
288
1
1
13
-
-
-
393
-
3
13
-
-
-
285
-
1
14
19
27
J3
390
1
3
14
32
49
K6
282
1
1
15
20
28
J4
387
1
3
15
33
50
L6
279
1
1
16
-
35
M1
384
1
3
16
-
-
-
276
-
1
17
22(1)
30(1)
K2(1)
381
1
3
17
34
51
M6
273
1
1
18
-
-
-
378
-
3
18
-
-
-
270
-
2
1
-
142
C3
375
2
4
1
-
118
C9
267
2
2
2
99(1)
143(1)
A2(1)
372
2
4
2
87
126
A7
264
2
2
3
-
-
-
369
-
4
3
-
133
A5
261
2
2
4
-
4
C1
366
2
4
4
-
-
-
258
-
2
5
1(1)
2(1)
B1(1)
363
2
4
5
89
128
D7
255
2
2
6
2(1)
3(1)
C2(1)
360
2
4
6
90
129
A6
252
2
2
7
-
-
-
357
-
4
7
-
-
-
249
-
8
3(1)
5(1)
D4(1)
354
2
4
8
91
130
B6
246
2
2
9
4(1)
6(1)
D3(1)
351
2
4
9
92
131
C6
243
2
2
10
-
7
D2
348
2
4
10
-
135
C5
240
2
2
11
6
9
E4
345
2
4
11
93
132
D6
237
2
2
12
7
10
E3
342
2
4
12
94
134
B5
234
2
2
13
-
12
E1
339
2
4
13
-
137
A4
231
2
2
14
8
11
E2
336
2
4
14
95
136
D5
228
2
2
15
9
13
F4
333
2
4
15
96
138
B4
225
2
2
16
-
14
F3
330
2
4
16
-
139
C4
222
2
2
17
10
15
F2
327
2
4
17
97
140
A3
219
2
2
18
-
-
-
324
-
4
18
-
-
-
216
-
2
Notes:
1. Global control pin.
DS051 (v3.0) June 25, 2007
Product Specification
www.xilinx.com
7
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XC95144XV High-Performance CPLD
XC95144XV I/O Pins (Continued)
Function MacroBlock
cell
8
TQ100
TQ144
CS144
BScan
Order Bank
Function
Block
Macrocell
TQ100
TQ144
CS144
BScan
Order
Bank
5
1
-
-
-
213
-
7
1
-
-
-
105
-
5
2
35
52
N6
210
1
7
2
50
71
N12
102
1
5
3
-
59
L8
207
1
7
3
-
75
L12
99
1
5
4
-
-
-
204
-
7
4
-
-
-
96
-
5
5
36
53
M7
201
1
7
5
52
74
M13
93
1
5
6
37
54
N7
198
1
7
6
53
76
L13
90
1
5
7
-
66
M10
195
1
7
7
-
77
K10
87
1
5
8
39
56
K7
192
1
7
8
54
78
K11
84
1
5
9
40
57
N8
189
1
7
9
55
80
K13
81
1
5
10
-
68
N11
186
1
7
10
-
79
K12
78
1
5
11
41
58
M8
183
1
7
11
56
82
J11
75
1
5
12
42
60
K8
180
1
7
12
58
85
H10
72
1
5
13
-
70
L11
177
1
7
13
-
81
J10
69
1
5
14
43
61
N9
174
1
7
14
59
86
H11
66
1
5
15
46
64
K9
171
1
7
15
60
87
H12
63
1
5
16
-
-
-
168
-
7
16
-
83
J12
60
1
5
17
49
69
M11
165
1
7
17
61
88
H13
57
1
5
18
-
-
-
162
-
7
18
-
-
-
54
-
6
1
-
-
-
159
-
8
1
-
-
-
51
-
6
2
74
106
C11
156
2
8
2
63
91
G11
48
2
6
3
-
-
-
153
-
8
3
-
95
F11
45
2
6
4
-
111
B11
150
2
8
4
-
97
E13
42
2
6
5
76
110
A12
147
2
8
5
64
92
G10
39
2
6
6
77
112
A11
144
2
8
6
65
93
F13
36
2
6
7
-
-
-
141
-
8
7
-
-
-
33
-
6
8
78
113
D10
138
2
8
8
66
94
F12
30
2
6
9
79
116
A10
135
2
8
9
67
96
F10
27
2
6
10
-
115
B10
132
2
8
10
-
101
D13
24
2
6
11
80
119
B9
129
2
8
11
68
98
E12
21
2
6
12
81
120
A9
126
2
8
12
70
100
E10
18
2
6
13
-
-
-
123
-
8
13
-
103
D11
15
2
6
14
82
121
D8
120
2
8
14
71
102
D12
12
2
6
15
85
124
A8
117
2
8
15
72
104
C13
9
2
6
16
-
117
D9
114
2
8
16
-
107
B13
6
2
6
17
86
125
B7
111
2
8
17
73
105
C12
3
2
6
18
-
-
-
108
-
8
18
-
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-
0
-
www.xilinx.com
DS051 (v3.0) June 25, 2007
Product Specification
R
XC95144XV High-Performance CPLD
XC95144XV Global, JTAG and Power Pins
Pin Type
TQ100
TQ144
CS144
I/O/GCK1
22
30
K2
I/O/GCK2
23
32
L1
I/O/GCK3
27
38
N2
I/O/GTS1
3
5
D4
I/O/GTS2
4
6
D3
I/O/GTS3
1
2
B1
I/O/GTS4
2
3
C2
I/O/GSR
99
143
A2
TCK
48
67
L10
TDI
45
63
L9
TDO(1)
83
122
C8
TMS
47
65
N10
VCCINT 2.5V
5, 57, 98
8, 42, 84, 141
B3, D1, J13, L4
VCCIO1
26, 38, 51
37, 55, 73
L7, N1, N13
VCCIO2
88
1, 109, 127
A1, A13, C7
GND
21, 31, 44, 62, 69, 75, 84,
100
18, 29, 36, 47, 62, 72, 89, 90,
99, 108, 114, 123, 144
B2, B8, B12, C10, E11, G1,
G12, G13, K1, M2, M5, M9,
M12
No Connects
-
-
-
Notes:
1. TDO voltage is controlled by VCCIO2.
DS051 (v3.0) June 25, 2007
Product Specification
www.xilinx.com
9
R
XC95144XV High-Performance CPLD
Device Part Marking and Ordering Combination Information
R
XC95xxxXV
TQ144
Device Type
Package
This line not
related to device
part number
7C
Speed
Operating Range
1
Sample package with part marking.
Speed
(pin-to-pin
delay)
Pkg.
Symbol
No. of
Pins
Package Type
Operating
Range(1)
XC95144XV-5TQ100C
5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
C
XC95144XV-5TQ144C
5 ns
TQ144
144-pin
Thin Quad Flat Pack (TQFP)
C
XC95144XV-5CS144C
5 ns
CS144
144-ball
Chip Scale Package (CSP)
C
XC95144XV-7TQ100C
7.5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
C
XC95144XV-7TQ144C
7.5 ns
TQ144
144-pin
Thin Quad Flat Pack (TQFP)
C
XC95144XV-7CS144C
7.5 ns
CS144
144-ball
Chip Scale Package (CSP)
C
XC95144XV-7TQ100I
7.5 ns
TQ100
100-pin
Thin Quad Flat Pack (TQFP)
I
XC95144XV-7TQ144I
7.5 ns
TQ144
144-pin
Thin Quad Flat Pack (TQFP)
I
XC95144XV-7CS144I
7.5 ns
CS144
144-ball
Chip Scale Package (CSP)
I
Device Ordering and
Part Marking Number
Notes:
1. C = Commercial: TA = 0° to +70°C; I = Industrial: TA = –40° to +85°C
2. Some packages available in Pb-free option. See Xilinx Packaging for more information.
10
www.xilinx.com
DS051 (v3.0) June 25, 2007
Product Specification
R
XC95144XV High-Performance CPLD
Revision History
The following table shows the revision history for this document..
Date
Version
06/28/00
1.0
Initial Xilinx release. Advance information specification.
01/25/01
2.0
Added -4 performance specifications.Updated ICC vs. Frequency Figure 1.
05/15/01
2.1
Updated ICC formula, Recommended Operation Conditions, -4 and -5 AC Characteristics
and Internal Timing Parameters
08/27/01
2.2
Changed VCCIO 3.3V from 3.13 to 3.0 (min), 3.46 to 3.60 (max); DC characteristics: IIL added "low" current, IIH - changed to "Input leakage high current"; Internal Timing: -5 TAOI
from 6.5 to 5.9.
06/20/02
2.3
Updated ICC equation on page 1. Updated Component Availability chart. Changed to
Preliminary. Added second test condition and max measurement to IIH DC Characteristics.
Added Part Marking Information to Ordering Information. Removed -4 device.
06/25/02
2.4
Fixed Note 1 in XC95144XV Global, JTAG and Power Pins table.
01/08/03
2.5
Corrected link on first page.
06/18/03
2.6
Updated TSOL from 260 to 220oC. Updated Device Part Marking.
08/21/03
2.7
Updated Package Device Marking Pin 1 orientation.
04/15/05
2.8
Added TAPRPW specification to AC Characteristics. Added IOSTANDARD information.
06/25/07
3.0
Notice of discontinuance.
DS051 (v3.0) June 25, 2007
Product Specification
Revision
www.xilinx.com
11