MICROCHIP MCP1701T

M
MCP1701
2 µA Low Dropout Positive Voltage Regulator
Features
General Description
• 2.0 µA Typical Quiescent Current
• Input Operating Voltage Range up to 10.0V
• Low Dropout Voltage:
- 250 mV (typ.) @ 100 mA
- 500 mV (typ.) @ 200 mA
• High Output Current: 250 mA (VOUT = 5.0V)
• High-Accuracy Output Voltage: ±2% (max)
• Low Temperature Drift: ±100 ppm/°C (typ.)
• Excellent Line Regulation: 0.2%/V (typ.)
• Package Options: 3-Pin SOT-23A, 3-Pin SOT-89
and 3-Pin TO-92
• Short-Circuit Protection
• Standard Output Voltage Options:
- 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
The MCP1701 is a family of CMOS low dropout (LDO),
positive voltage regulators that can deliver up to
250 mA of current while consuming only 2.0 µA of
quiescent current (typical). The input operating range is
specified up to 10V, making it ideal for lithium-ion (one
or two cells), 9V alkaline and other two and three
primary cell battery-powered applications.
Applications
•
•
•
•
•
•
•
•
•
•
•
•
Battery-Powered Devices
Battery-Powered Alarm Circuits
Smoke Detectors
CO2 Detectors
Smart Battery Packs
PDAs
Low Quiescent Current Voltage Reference
Cameras and Portable Video Equipment
Pagers and Cellular Phones
Solar-Powered Instruments
Consumer Products
Microcontroller Power
Related Literature
The MCP1701 is capable of delivering 250 mA with an
input-to-output voltage differential (dropout voltage) of
650 mV. The low dropout voltage extends the battery
operating lifetime. It also permits high currents in small
packages when operated with minimum VIN – VOUT
differentials.
The MCP1701 has a tight tolerance output voltage
regulation of ±0.5% (typical) and very good line regulation at ±0.2%. The LDO output is stable when using
only 1 µF of output capacitance of either tantalum or
aluminum-electrolytic style capacitors. The MCP1701
LDO also incorporates short-circuit protection to
ensure maximum reliability.
Package options include the 3-Pin SOT-23A, 3-Pin
SOT-89 and 3-Pin TO-92.
Package Types
3-Pin SOT-23A
VIN
3-Pin SOT-89
VIN
3
MCP1701
MCP1701
1
2
GND
VOUT
1
2
3
GND VIN VOUT
3-Pin TO-92
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• AN766, “Pin-Compatible CMOS Upgrades to
Bipolar LDOs”, DS00766,
Microchip Technology Inc., 2002
123
Bottom
View
GND VIN VOUT
Note:
 2004 Microchip Technology Inc.
The 3-Pin SOT-23A is equivalent to
the EIAJ SC-59.
DS21874A-page 1
MCP1701
Functional Block Diagram
MCP1701
VIN
VOUT
Short-Circuit
Protection
+
–
Voltage
Reference
GND
Typical Application Circuits
MCP1701
GND
VOUT
3.3V
IOUT
50 mA
DS21874A-page 2
VIN
VOUT
VIN
9V Alkaline Battery
CIN
1 µF Tantalum
COUT
1 µF Tantalum
 2004 Microchip Technology Inc.
MCP1701
1.0
ELECTRICAL
CHARACTERISTICS
† Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings†
Input Voltage ........................................................ +12V
Output Current (Continuous)..........PD/(VIN – VOUT)mA
Output Current (peak) ..................................... 500 mA
Output Voltage ............... (GND – 0.3V) to (VIN + 0.3V)
Continuous Power Dissipation:
3-Pin SOT-23A ............................................ 150 mW
3-Pin SOT-89 .............................................. 500 mW
3-Pin TO-92 ................................................. 300 mW
PIN FUNCTION TABLE
Symbol
Description
GND
Ground Terminal
VOUT
Regulated Voltage Output
VIN
Unregulated Supply Input
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25°C.
Parameters
Sym
Min
Typ
Max
Output Voltage Regulation
VOUT
VR – 2%
VR±0.5%
VR + 2%
V
Maximum Output Current
IOUTMAX
250
—
—
mA
200
—
—
V OUT = 4.0V
150
—
—
V OUT = 3.3V
150
—
—
V OUT = 3.0V
125
—
—
V OUT = 2.5V
110
—
—
V OUT = 1.8V
-1.60
±0.8
+1.60
-2.25
±1.1
+2.25
V OUT = 4.0V, 1 mA ≤ IOUT ≤ 100 mA
-2.72
±1.3
+2.72
V OUT = 3.3V, 1 mA ≤ IOUT ≤ 80 mA
-3.00
±1.5
+3.00
V OUT = 3.0V, 1 mA ≤ IOUT ≤ 80 mA
-3.60
±1.8
+3.60
V OUT = 2.5V, 1 mA ≤ IOUT ≤ 60 mA
-1.60
±0.8
+1.60
—
400
630
—
400
630
IOUT = 200 mA, VR = 4.0V
—
400
700
IOUT = 160 mA, VR = 3.3V
—
400
700
IOUT = 160 mA, VR = 3.0V
—
400
700
IOUT = 120 mA, VR = 2.5V
—
180
300
IOUT = 20 mA, VR = 1.8V
IQ
—
2.0
3.0
µA
∆VOUT•100
—
0.2
0.3
%/V
VIN
—
—
10
V
TCVOUT
—
±100
—
ppm/
°C
IOUT = 40 mA, -40°C ≤ TA ≤ +85°C,
(Note 2)
TR
—
200
—
µsec
10% V R to 90% VR, VIN = 0V to VR +1V,
RL = 25Ω resistive.
Load Regulation (Note 3)
Dropout Voltage
∆VOUT/ VOUT
VIN - VOUT
Input Quiescent Current
Line Regulation
Units
%
Conditions
IOUT = 40 mA, (Note 1)
V OUT = 5.0V
(VIN = VR + 1.0V)
V OUT = 5.0V, 1 mA ≤ IOUT ≤ 100 mA
V OUT = 1.8V, 1 mA ≤ IOUT ≤ 30 mA
mV
IOUT = 200 mA, VR = 5.0V
VIN = VR + 1.0V
IOUT = 40 mA, (VR +1) ≤ VIN ≤ 10.0V
∆VIN •VOUT
Input Voltage
Temperature Coefficient of
Output Voltage
Output Rise Time
1:
2:
3:
VR is the nominal regulator output voltage. For example: V R = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V.
The input voltage VIN = VR + 1.0V, IOUT = 40 mA.
TCV OUT = (VOUT-HIGH – VOUT-LOW) *106/(VR * ∆Temperature), V OUT-HIGH is equal to the highest voltage measured
over the temperature range, while VOUT-LOW is equal to the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
 2004 Microchip Technology Inc.
DS21874A-page 3
MCP1701
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (I)
TA
-40
—
+85
°C
Storage Temperature Range
TA
-40
—
+125
°C
θJA
—
335
—
°C/W
Minimum trace width single
layer application.
—
230
—
°C/W
Typical FR4, 4-layer
application.
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, 3L-SOT-23A
Thermal Resistance, 3L-SOT-89
θJA
—
52
—
°C/W
Typical when mounted on
1 square inch of copper.
Thermal Resistance, 3L-TO-92
θJA
—
131.9
—
°C/W
EIA/JEDEC JESD51-751-7
4-layer board.
DS21874A-page 4
 2004 Microchip Technology Inc.
MCP1701
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
1.95
VR = 1.8V
Supply Current (µA)
Supply Current (µA)
Notes: Unless otherwise specified, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
+25°C
0°C
-40°C
2
3
4
5
6
7
8
9
2.10
2.05
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
1.55
1.50
1.45
1.40
1.35
1.30
1.25
1.20
10
+25°C
+85°C
0°C
-40°C
V IN = 4.0V
V R = 3.0V
0
20
40
60
VR = 3.0V
+25°C
+85°C
-40°C
3
4
5
6
7
8
9
2.75
2.70
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
10
0°C
-40°C
20
40
60
+85°C
2.40
2.25
-40°C
2.10
1.95
1.80
1.65
1.50
5
6
7
8
9
10
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
100
120
140
160
180
200
VR = 5.0V
VR = 1.8V
VR = 3.0V
VIN = VR + 1V
IOUT = 0 µA
-40
-20
Input Voltage (V)
FIGURE 2-3:
Supply Current vs. Input
Voltage (VR = 5.0V).
 2004 Microchip Technology Inc.
80
V IN = 6.0V
V R = 5.0V
FIGURE 2-5:
Supply Current vs. Load
Current (VR = 5.0V).
Supply Current (µA)
Supply Current (µA)
+25°C
2.55
160
+85°C
0
V R = 5.0V
2.70
140
Load Current (mA)
FIGURE 2-2:
Supply Current vs. Input
Voltage (VR = 3.0V).
2.85
120
+25°C
Input Voltage (V)
3.00
100
FIGURE 2-4:
Supply Current vs. Load
Current (VR = 3.0V).
Supply Current (µA)
Supply Current (µA)
FIGURE 2-1:
Supply Current vs. Input
Voltage (VR = 1.8V).
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
80
Load Current (mA)
Input Voltage (V)
0
20
40
60
80
100
Temperature (°C)
FIGURE 2-6:
Temperature.
Supply Current vs.
DS21874A-page 5
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
1.85
IOUT = 0.1 mA
1.83
Output Voltage (V)
Output Voltage (V)
1.84
+25°C
1.83
+85°C
1.82
0°C
1.81
1.80
-40°C
1.79
1.78
2
3
4
5
6
7
8
9
+85°C
1.81
1.80
0°C
1.79
-40°C
1.78
1.77
10
0
10
20
Input Voltage (V)
Output Voltage (V)
Output Voltage (V)
+25°C
+85°C
3.01
0°C
3.00
-40°C
2.99
2.98
2.97
60
70
80
90
VIN = 4.0V
3.04
3.02
+25°C
+85°C
3.00
0°C
2.98
-40°C
2.96
2.94
4.0
5.0
6.0
7.0
8.0
9.0
10.0
0
15
30
Input Voltage (V)
5.10
5.09
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
45
60
75
90
105
120
135
150
Load Current (mA)
FIGURE 2-8:
Output Voltage vs. Input
Voltage (VR = 3.0V).
FIGURE 2-11:
Output Voltage vs. Load
Current (VR = 3.0V).
5.07
IOUT = 0.1 mA
VIN = 6.0V
+25°C
5.05
+25°C
Output Voltage (V)
Output Voltage (V)
50
3.06
IOUT = 0.1 mA
3.02
40
FIGURE 2-10:
Output Voltage vs. Load
Current (VR = 1.8V).
3.04
3.03
30
Load Current (mA)
FIGURE 2-7:
Output Voltage vs. Input
Voltage (VR = 1.8V).
3.05
VIN = 2.8V
+25°C
1.82
+85°C
0°C
5.03
+85°C
5.01
0°C
4.99
4.97
4.95
-40°C
-40°C
4.93
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
Input Voltage (V)
FIGURE 2-9:
Output Voltage vs. Input
Voltage (VR = 5.0V).
DS21874A-page 6
0
25
50
75
100
125
150
175
200
225
250
Load Current (mA)
FIGURE 2-12:
Output Voltage vs. Load
Current (VR = 5.0V).
 2004 Microchip Technology Inc.
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
Dropout Voltage (V)
0.7
VR = 1.8V
0.6
VIN = 0V to
2.8V
0.5
0.4
+85°C
0°C
0.3
-40°C
0.2
RLOAD = 25 ohms
COUT = 1 µF Tantalum
0.1
VR = 1.8V
0.0
0
10
20
30
40
50
60
70
80
90
Load Current (mA)
FIGURE 2-13:
Dropout Voltage vs. Load
Current (VR = 1.8V).
FIGURE 2-16:
(VR = 1.8V).
Start-up From VIN
0
Dropout Voltage (V)
0.6
VR = 3.0V
0.5
VIN = 0V to
0.4
4.0V
0.3
+85°C
0°C
0.2
-40°C
RLOAD = 25 ohms
COUT = 1 µF Tantalum
0.1
0
0
15
30
45
60
75
90
105
120
135
150
VR = 3.0V
Load Current (mA)
FIGURE 2-14:
Dropout Voltage vs. Load
Current (VR = 3.0V).
0.8
FIGURE 2-17:
(VR = 3.0V).
Start-up From VIN
VR = 5.0V
Dropout Voltage (V)
0.7
0.6
VIN = 0V to
6.0V
0.5
+85°C
0.4
0°C
0.3
-40°C
0.2
0.1
0.0
0
25
50
75
100
125
150
175
200
225
250
VR = 5.0V
RLOAD = 25 ohms
COUT = 1 µF Tantalum
Load Current (mA)
FIGURE 2-15:
Dropout Voltage vs. Load
Current (VR = 5.0V).
 2004 Microchip Technology Inc.
FIGURE 2-18:
(VR = 5.0V).
Start-up From VIN
DS21874A-page 7
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
0.15
V R = 1.8V
IOUT = 1 to 30mA
Line Regulation (%/V)
Load Regulation (%)
0.00
-0.05
-0.10
-0.15
-0.20
VIN = 6.0V
VIN = 4.0V
-0.25
-0.30
VIN = 2.8V
-0.35
-0.40
VR = 1.8V
VIN = 2.8V to 10V
0.14
IOUT = 90 mA
0.13
IOUT = 40 mA
0.12
IOUT = 1 mA
0.11
IOUT = 10 mA
0.10
-40 -30 -20 -10
0
10 20 30 40 50
60 70 80 90
-40 -30 -20 -10
0
Temperature (°C)
Line Regulation (%/V)
Load Regulation (%)
-0.40
-0.45
VIN = 6.0V
-0.50
-0.55
-0.60
VIN = 4.0V
VIN = 10.0V
-0.65
-0.70
60 70
80
90
80
90
0.12
IOUT = 1 mA
0.11
0.10
IOUT = 10 mA
0.09
0.08
0.07
IOUT = 150 mA
VR = 3.0V
VIN = 4.0V to 10V
0
10 20 30 40 50
60 70 80 90
-40 -30 -20 -10
0
Temperature (°C)
0.0
Line Regulation (%/V)
VIN = 7.0V
30 40
50
0.17
-0.2
-0.3
20
60 70
FIGURE 2-23:
Line Regulation vs.
Temperature (VR = 3.0V).
VR = 5.0V
IOUT = 1 to 100 mA
-0.1
10
Temperature (°C)
FIGURE 2-20:
Load Regulation vs.
Temperature (VR = 3.0V).
Load Regulation (%)
50
0.06
-40 -30 -20 -10
-0.4
30 40
0.13
VR = 3.0V
IOUT = 1 to 80 mA
-0.35
20
FIGURE 2-22:
Line Regulation vs.
Temperature (VR = 1.8V).
FIGURE 2-19:
Load Regulation vs.
Temperature (VR = 1.8V).
-0.30
10
Temperature (°C)
VIN = 6.0V
V IN = 10.0V
-0.5
-0.6
VR = 5.0V
VIN = 6.0V to 10V
0.16
0.15
IOUT = 10 mA
IOUT = 1 mA
0.14
0.13
0.12
0.11
0.10
IOUT = 100 mA
IOUT = 250 mA
0.09
0.08
-40 -30 -20 -10
0
10
20
30
40
50
60
70
Temperature (°C)
FIGURE 2-21:
Load Regulation vs.
Temperature (VR = 5.0V).
DS21874A-page 8
80
90
-40 -30 -20 -10
0
10
20
30 40
50
60 70
80
90
Temperature (°C)
FIGURE 2-24:
Line Regulation vs.
Temperature (VR = 5.0V).
 2004 Microchip Technology Inc.
MCP1701
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
SOT-23A
Pin No.
SOT-89
Pin No.
TO-92
Name
1
1
1
GND
Ground terminal
2
3
3
VOUT
Regulated voltage output
3
2
2
VIN
Unregulated supply input
3.1
Ground Terminal (GND)
Regulator ground. Tie GND to the negative side of both
the output and the input capacitor. Only the LDO bias
current (2 µA, typical) flows out of this pin, as there is
no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this
pin and the negative side of the load.
3.2
Regulated Voltage Output (VOUT)
Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be located as close
as possible to the LDO VOUT pin. The current flowing
out of this pin is equal to the DC load current.
 2004 Microchip Technology Inc.
Function
3.3
Unregulated Supply Input (VIN)
Connect the input supply voltage and the positive side
of the input capacitor to VIN. Like all low dropout linear
regulators, low source impedance is necessary for the
stable operation of the LDO. The amount of capacitance
required to ensure low source impedance will depend
on the proximity of the input source capacitors or battery
type. The input capacitor should be located as close as
possible to the VIN pin. For most applications, 1 µF of
capacitance will ensure stable operation of the LDO
circuit. For applications that have load currents below
100 mA, the input capacitance requirement can be
lowered. The type of capacitor used can be ceramic,
tantalum or aluminum-electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR
performance at high frequencies. The current flow into
this pin is equal to the DC load current, plus the LDO
bias current (2 µA, typical).
DS21874A-page 9
MCP1701
4.0
DETAILED DESCRIPTION
The MCP1701 is a low quiescent current, precision,
fixed-output voltage LDO. Unlike bipolar regulators,
the MCP1701 supply current does not increase
proportionally with load current.
4.1
Output Capacitor
A minimum of 1 µF output capacitor is required. The
output capacitor should have an effective series
resistance (esr) greater than 0.1Ω and less than 5Ω,
plus a resonant frequency above 1 MHz. Larger output
capacitors can be used to improve supply noise
rejection and transient response. Care should be taken
when increasing COUT to ensure that the input
impedance is not high enough to cause high input
impedance oscillation.
4.2
Input Capacitor
A 1 µF input capacitor is recommended for most
applications when the input impedance is on the order
of 10Ω. Larger input capacitance may be required for
stability when operating from a battery input, or if there
is a large distance from the input source to the LDO.
When large values of output capacitance are used, the
input capacitance should be increased to prevent high
source impedance oscillations.
4.3
Overcurrent
The MCP1701 internal circuitry monitors the amount of
current flowing through the P-channel pass transistor.
In the event of a short-circuit or excessive output
current, the MCP1701 will act to limit the output current.
VIN
VOUT
Short-Circuit
Protection
+
–
Voltage
Reference
GND
FIGURE 4-1:
DS21874A-page 10
MCP1701 Block Diagram.
 2004 Microchip Technology Inc.
MCP1701
5.0
THERMAL CONSIDERATIONS
5.1
Power Dissipation
The amount of power dissipated internal to the LDO
linear regulator is the sum of the power dissipation
within the linear pass device (P-channel MOSFET) and
the quiescent current required to bias the internal reference and error amplifier. The internal linear pass
device power dissipation is calculated as shown in
Equation 5-1.
EQUATION 5-1:
PD (Pass Device) = (VIN – VOUT) x IOUT
The internal power dissipation, which is due to the bias
current for the LDO internal reference and error amplifier, is calculated as shown in Equation 5-2.
EQUATION 5-2:
PD (Bias) = VIN x IGND
The total internal power dissipation is the sum of PD
(Pass Device) and PD (Bias).
To determine the junction temperature of the device, the
thermal resistance from junction-to-ambient must be
known. The 3-pin SOT-23 thermal resistance from
junction-to-air (RθJA) is estimated to be approximately
335°C/W. The SOT-89 RθJA is estimated to be
approximately 52°C/W when mounted on 1 square inch
of copper. For the TO-92, RθJA is estimated to be
131.9°C/W. The RθJA will vary with physical layout,
airflow and other application-specific conditions.
The device junction temperature is determined by
calculating the junction temperature rise above
ambient, then adding the rise to the ambient
temperature.
EQUATION 5-5:
T J = P D MAX × R θJA + T A
T J = 116.0 milliwatts × 335°C/W + 55°C
T J = 93.9°C
EQUATION 5-6:
EQUATION 5-3:
PTOTAL = PD (Pass Device) + PD (Bias)
For the MCP1701, the internal quiescent bias current is
so low (2 µA, typical) that the PD (Bias) term of the
power dissipation equation can be ignored. The
maximum power dissipation can be estimated by using
the maximum input voltage and the minimum output
voltage to obtain a maximum voltage differential
between input and output. The next step would be to
multiply the maximum voltage differential by the
maximum output current.
JUNCTION
TEMPERATURE - SOT-23
EXAMPLE:
JUNCTION
TEMPERATURE - SOT-89
EXAMPLE:
T J = 116.0 milliwatts × 52°C/W + 55°C
T J = 61°C
EQUATION 5-7:
JUNCTION
TEMPERATURE - TO-92
EXAMPLE:
T J = 116.0 milliwatts × 131.9°C/W + 55°C
T J = 70.3°C
EQUATION 5-4:
PD = (VINMAX – VOUTMIN) x IOUTMAX
Given:
VIN = 3.3V to 4.1V
VOUT = 3.0V ± 2%
IOUT = 1 mA to 100 mA
TAMAX = 55°C
PMAX = (4.1V – (3.0V x 0.98)) x 100 mA
PMAX = 116.0 milliwatts
 2004 Microchip Technology Inc.
DS21874A-page 11
MCP1701
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Pin SOT-23A
1
1
2
2
3
3-Pin TO-92
3-Pin SOT-89
2
4
1
3
1 2 3 4
5 6 7 8
4
9 10 11 12
represents first voltage digit
1V, 2V, 3V, 4V, 5V, 6V
1 , 2 , 3 & 4
Ex: 3.xV =
5
represents first voltage digit (1-6)
6
represents first voltage decimal (0-9)
7
represents extra feature code: fixed: 0
8
represents regulation accuracy
2 = ±2.0% (standard)
3
represents first decimal place voltage (x.0 - x.9)
Ex: 3.4V =
3
E
Symbol
Voltage
Symbol
Voltage
A
B
C
D
E
x.0
x.1
x.2
x.3
x.4
F
H
K
L
M
x.5
x.6
x.7
x.8
x.9
3
represents polarity
0 = Positive (fixed)
4
represents assembly lot number
DS21874A-page 12
= M701 (fixed)
9 , 10 , 11 & 12
represents assembly lot number
 2004 Microchip Technology Inc.
MCP1701
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
E
E1
2
B
p1
n
D
p
1
α
c
A
φ
β
A2
A1
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
MIN
p1
A
A2
A1
E
E1
D
L
f
c
B
a
b
.040
.039
.000
.102
.059
.106
.014
0
.004
.014
0
0
INCHES*
NOM
3
.038
.076
.046
.043
.002
.110
.063
.114
.018
5
.006
.016
5
5
MAX
.051
.047
.004
.118
.071
.122
.022
10
.010
.020
10
10
MILLIMETERS
NOM
3
0.96
1.92
1.16
1.01
1.00
1.10
0.01
0.06
2.60
2.80
1.50
1.60
2.70
2.90
0.35
0.45
0
5
0.10
0.15
0.35
0.40
0
5
0
5
MIN
MAX
1.30
1.20
0.10
3.00
1.80
3.10
0.55
10
0.25
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
EIAJ SC-59 Equivalent
Drawing No. C04-104
 2004 Microchip Technology Inc.
DS21874A-page 13
MCP1701
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H
E
B1
3
B
D
D1
p1
2
p
1
B1
L
E1
A
C
Units
Dimension Limits
p
Pitch
Outside lead pitch (basic)
Overall Height
Overall Width
Molded Package Width at Base
Molded Package Width at Top
Overall Length
Tab Length
Foot Length
Lead Thickness
Lead 2 Width
Leads 1 & 3 Width
p1
A
H
E
E1
D
D1
L
c
B
B1
INCHES
MIN
MAX
.059 BSC
.118 BSC
.055
.063
.155
.167
.090
.102
.084
.090
.173
.181
.064
.072
.035
.047
.014
.017
.017
.022
.014
.019
MILLIMETERS*
MIN
MAX
1.50 BSC
3.00 BSC
1.40
1.60
3.94
4.25
2.29
2.60
2.13
2.29
4.40
4.60
1.62
1.83
0.89
1.20
0.35
0.44
0.44
0.56
0.36
0.48
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-243
Drawing No. C04-29
DS21874A-page 14
 2004 Microchip Technology Inc.
MCP1701
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
Units
Dimension Limits
n
p
β
MIN
INCHES*
NOM
MAX
MILLIMETERS
NOM
3
1.27
3.30
3.62
4.45
4.71
4.32
4.64
2.16
2.29
12.70
14.10
0.36
0.43
0.41
0.48
4
5
2
3
MIN
Number of Pins
3
Pitch
.050
Bottom to Package Flat
A
.130
.143
.155
Overall Width
E1
.175
.186
.195
Overall Length
D
.170
.183
.195
Molded Package Radius
R
.085
.090
.095
Tip to Seating Plane
L
.500
.555
.610
c
Lead Thickness
.014
.017
.020
Lead Width
B
.016
.019
.022
α
4
5
6
Mold Draft Angle Top
β
Mold Draft Angle Bottom
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
 2004 Microchip Technology Inc.
MAX
3.94
4.95
4.95
2.41
15.49
0.51
0.56
6
4
DS21874A-page 15
MCP1701
NOTES:
DS21874A-page 16
 2004 Microchip Technology Inc.
MCP1701
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X-
XX
X
X
X/
XX
Tape
Output Feature Tolerance Temp. Package
and Reel Voltage Code
Device:
MCP1701: 2 µA Low Dropout Positive Voltage Regulator
Tape and Reel:
T
Output Voltage:
18 = 1.8V “Standard”
25 = 2.5V “Standard”
30 = 3.0V “Standard”
33 = 3.3V “Standard”
50 = 5.0V “Standard”
*Contact factory for other output voltage options.
= Tape and Reel (SOT-23 and SOT-89 only)
Extra Feature Code:
0
= Fixed
Tolerance:
2
= 2.0% (Standard)
Temperature:
I
=
Package Type:
CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59)
MB = 3-Pin SOT-89
TO = 3-Pin TO-92
Examples:
a)
MCP1701T-1802I/CB:
b)
MCP1701T-1802I/MB: 1.8V LDO Positive
Voltage Regulator,
SOT89-3 package.
c)
MCP1701T-2502I/CB:
2.5V LDO Positive
Voltage Regulator,
SOT-23A-3
package.
d)
MCP1701T-3002I/CB:
3.0V LDO Positive
Voltage Regulator,
SOT-23A-3
package.
e)
MCP1701T-3002I/MB: 3.0V LDO Positive
Voltage Regulator,
SOT89-3 package.
f)
MCP1701T-3302I/CB:
g)
MCP1701T-3302I/MB: 3.3V LDO Positive
Voltage Regulator,
SOT89-3 package.
h)
MCP1701T-5002I/CB:
i)
MCP1701T-5002I/MB: 5.0V LDO Positive
Voltage Regulator,
SOT89-3 package.
-40°C to +85°C
1.8V LDO Positive
Voltage Regulator,
SOT-23A-3
package.
3.3V LDO Positive
Voltage Regulator,
SOT-23A-3
package.
5.0V LDO Positive
Voltage Regulator,
SOT-23A-3
package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2004 Microchip Technology Inc.
DS21874A-page 17
MCP1701
NOTES:
DS21874A-page 18
 2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart and rfPIC are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode,
SmartSensor, SmartTel and Total Endurance are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003. The Company’s quality system processes and procedures are for
its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
 2004 Microchip Technology Inc.
DS21874A-page 19
M
WORLDWIDE SALES AND SERVICE
AMERICAS
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02/17/04
DS21874A-page 20
 2004 Microchip Technology Inc.