Tel: 0044 (0)118 979 1238 Fax: 0044 (0)118 979 1283 E-mail: [email protected] ACT26 The ACT26 is a miniature cylindrical package offering high vibration and shock resistance together with high stability. It is most suitable for portable equipment and close packing density. The series offers a wide, low frequency range and is popular for use in Microprocessor, Consumer and Instrumentation applications Specification Parameter Symbol Frequency Range Frequency Tolerance @25°C fo Δf/fo 25.00 ~ 200KHz ±10ppm ~ 100ppm Turnover Temperature Freq. Temp. coefficient Temp Operating Range Temp Storage Range Equivalent Series Resistance Shunt Capacitance Load Capacitance Motional Capacitance Drive Level Capacitance Ratio Q Factor Insulation Resistance Aging Tm β Topr Tstg ESR C0 CL C1 DL γ Qf IR Fa 25°C ±5°C -0.034 ± 0.006ppm / °C² max -10 ~ +60°C -20 ~ +70°C See Table 1.8pF typical 12.5pF (Others available.) 3.0fF 1.0μ W max 450 typical 60,000 typical 500MΩ Min ±5ppm 6.0 max Specification 7.0 0.65 ± 0.15 2.0 Dimensions in mm Condition 150KHz ~ 200KHz, supplied as ±100ppm only @ 25°C Please specify ( Typical ) @ 25°C ±3°C Frequency KHz ESR KΩ max 25.00 30.00 32.00 40.00 80.00 150.00 50 40 35 30 25 40 ~ 30.00 ~ 32.00 ~ 40.00 ~ 80.00 ~ 150.00 ~ 200.00 ∅ 0.24 ± 0.07 Please note that all parameters can not necessarily be specified in the same device Customer to Specify : Frequency, Frequency Tolerance, Operating Temperature Range & Load Capacitance In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice. ISO9001: 2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK http://www.actcrystals.com 1 of 2 Issue : 3C1 Date : 03/08/04 Tel : Fax : email : 0044 (0)118 979 1238 0044 (0)118 979 1283 [email protected] SOLDERING of CYLINDER CRYSTALS Lead wire should be soldered within 10seconds with the iron having a tip temperature of less than 270°C. With regard to wave soldering it is recommended that the process is carried out with the crystal unit set upright on the circuit board. Should the process be carried out with the crystal unit on its side then steps must be taken to prevent heat transfer through the can. Should the whole crystal unit be heated (in a re-flow oven for example) it will result in amarked deterioration of the performance or even failure to oscillate. This is due to the internal construction of the crystal unit which involves the use of solder. In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice. ISO9001: 2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK http://www.actcrystals.com 2 of 2