Standard Products UT7R995 & UT7R995C RadClockTM RadHard 2.5V/3.3V 200MHz High-Speed Multi-phase PLL Clock Buffer Datasheet February, 2007 The devices also feature split output bank power supplies that enable banks 1 & 2, bank 3, and bank 4 to operate at a different power supply levels. The ternary PE/HD pin controls the synchronization of output signals to either the rising or the falling edge of the reference clock and selects the drive strength of the output buffers. The UT7R995 and UT7R995C both interface to a digital clock while the UT7R995C will also interface to a quartz crystal. FEATURES: +3.3V Core Power Supply +2.5V or +3.3V Clock Output Power Supply - Independent Clock Output Bank Power Supplies Output frequency range: 6 MHz to 200 MHz Bank pair output-output skew < 100 ps Cycle-cycle jitter < 50 ps 50% ± 2% maximum output duty cycle at 100MHz Eight LVTTL outputs with selectable drive strength Selectable positive- or negative-edge synchronization Selectable phase-locked loop (PLL) frequency range and lock indicator Phase adjustments in 625 to 1300 ps steps up to ± 7.8 ns (1-6,8,10,12) x multiply and (1/2,1/4) x divide ratios Compatible with Spread-Spectrum reference clocks Power-down mode Selectable reference input divider Radiation performance - Total-dose tolerance: 100 krad (Si) - SEL Immune to a LET of 109 MeV-cm2/mg - SEU Immune to a LET of 109 MeV-cm2/mg Military temperature range: -55oC to +125oC Extended industrial temp: -40oC to +125oC Packaging options: - 48-Lead Ceramic Flatpack Standard Microcircuit Drawing: 5962-05214 - QML-Q and QML-V compliant part 4F0 4F1 sOE PD/DIV PE/HD VDD VDDQ3 3Q1 3Q0 VSS VSS VDD FB VDD VSS VSS 2Q1 2Q0 VDDQ1 LOCK VSS DS0 DS1 1F0 INTRODUCTION: The UT7R995/UT7R995C is a low-voltage, low-power, eightoutput, 6-to-200 MHz clock driver. It features output phase programmability which is necessary to optimize the timing of high-performance microprocessor and communication systems. The user programs both the frequency and the phase of the output banks through nF[1:0] and DS[1:0] pins. The adjustable phase feature allows the user to skew the outputs to lead or lag the reference clock. Connect any one of the outputs to the feedback input to achieve different reference frequency multiplication and division ratios. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 UT7R995 & UT7R995C 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 3F1 3F0 FS VSS VSS VDDQ4 4Q1 4Q0 VSS VSS VDD XTAL1 NC/XTAL2 VDD VSS VSS 1Q1 1Q0 VDDQ1 VSS TEST 2F1 2F0 1F1 Figure 1. 48-Lead Ceramic Flatpack Pin Description 1 PD/DIV TEST PE/HD FS 3 3 3 VDDQ1 3 XTAL1 /R NC/XTAL2 LOCK PLL /N FB 3 3 DS[1:0] 3 1F[1:0] 3 3 2F[1:0] 3 3 3F[1:0] 3 1Q0 Phase Select 1Q1 2Q0 Phase Select 2Q1 3Q0 Phase Select and /K 3Q1 VDDQ3 3 4F[1:0] 3 Phase Select and /M 4Q0 4Q1 VDDQ4 Figure 2. UT7R995 & UT7R995C Block Diagram 2 sOE 1.0 DEVICE CONFIGURATION: Table 2: Reference Divider Settings (R-factor) The outputs of the UT7R995/C can be configured to run at frequencies ranging from 6 MHz to 200 MHz. Each output bank has the ability to run at separate frequencies and with various phase skews. Furthermore, numerous clock division and multiplication options exist. The following discussion and list of tables will summarize the available configuration options for the UT7R995/C. Tables 1 through 12, are relevant to the following configuration discussions. PD/DIV Operating Mode Reference Input Divider - (R) LOW 1 Powered Down Not Applicable MID Normal Operation 2 HIGH Normal Operation 1 Notes: 1. When PD/DIV = LOW, the device enters power-down mode. Table 1. Feedback Divider Settings (N-factor) Table 2. Reference Divider Settings (R-Factor) Table 3. Output Divider Settings - Bank 3 (K-factor) Table 4. Output Divider Settings - Bank 4 (M-Factor) Table 5. Frequency Divider Summary Table 6. Calculating Output Frequency Settings Table 7. Frequency Range Select Table 8. Multiplication Factor (MF) Calculation Table 9. Signal Propagation Delays in Various Media Table 10: Output Skew Settings Table 11. PE/HD Settings Table 12. Power Supply Constraints In addition to the reference and feedback dividers, the UT7R995/C includes output dividers on Bank 3 and Bank 4, which are controlled by 3F[1:0] and 4F[1:0] as indicated in Tables 3 and 4, respectively. Table 3: Output Divider Settings - Bank 3 (K-factor) 1.1 Divider Configuration Settings: 3F(1:0) Bank 3 Output Divider - (K) LL 2 HH 4 Other 1 1 Notes: 1. These states are used to program the phase of the respective banks. Please see Equation 1 along with Tables 8 and 10. The feedback input divider is controlled by the 3-level DS[1:0] pins as indicated in Table 1 and the reference input divider is controlled by the 3-level PD/DIV pin as indicated in Table 2. Although the Reference divider will continue to operate when the UT7R995/C is in the standard TEST mode of operation, the Feedback Divider will not be available. Table 4: Output Divider Settings - Bank 4 (M-factor) Table 1: Feedback Divider Settings (N-factor) 4F[1:0] Bank 4 Output Divider (M) LL 2 Other 1 1 DS[1:0] Feedback Input Divider - (N) Permitted Output Divider (K or M) Connected to FB Notes: 1. These states are used to program the phase of the respective banks. Please see Equation 1 along with Tables 8 and 10. LL 2 1 or 2 LM 3 1 LH 4 1, 2, or 4 Each of the four divider options and their respective settings are summarized in Table 5. By applying the divider options in Table 5 to the calculations shown in Table 6, the user determines the proper clock frequency for every output bank. ML 5 1 or 2 MM 1 1, 2, or 4 MH 6 1 or 2 HL 8 1 or 2 HM 10 1 HH 12 1 Table 5: Frequency Divider Summary 3 Division Factors Available Divider Settings N 1, 2, 3, 4, 5, 6, 8, 10, 12 R 1, 2 K 1, 2, 4 M 1, 2 Table 6: Calculating Output Frequency Settings Configuration Output Frequency 1Q[1:0] 1 and Clock Output Connected to FB 2Q[1:0] 3Q[1:0] 4Q[1:0] 1 1Qn or 2Qn (N/R) * fXTAL (N/R) * (1/K) * fXTAL (N/R) * (1/M) * fXTAL 3Qn (N/R) * K * fXTAL (N/R) * fXTAL (N/R) * (K/M) * fXTAL 4Qn (N/R) * M * fXTAL (N/R) * (M/K) * fXTAL (N/R) * fXTAL Notes: 1. These outputs are undivided copies of the VCO clock. Therefore, the formulas in this column can be used to calculate the nominal VCO operating frequency (fNOM) at a given reference frequency (fXTAL) and the divider and feedback configuration. The user must select a configuration and a reference frequency that will generate a VCO frequency that is within the range specified by FS pin. Please see Table 7. After calculating the time unit (tU) based on the nominal PLL frequency (fNOM) and multiplication factor (MF), the circuit designer plans routing requirements of each clock output and its respective destination receiver. With an understanding of signal propagation delays through a conductive medium (see Table 9), the designer specifies trace lengths which ensure a signal propagation delay that is equal to one of the tU multiples show in Table 10. For each output bank, the tU skew factors are selected with the tri-level, bank-specific, nF[1:0] pins. 1.2 Frequency Range and Skew Selection: The PLL in the UT7R995/C operates within three nominal frequency ranges. Depending upon the desired PLL operating frequency, the user must define the state of the ternary FS control pin. Table 7 defines the required FS selections based upon the nominal PLL operating frequency ranges. Because the clock outputs on Bank 1 and Bank 2 do not include a divider option, they will always reflect the current frequency of the PLL. Reference the first column of equations in Table 6 to calculate the value of fNOM for any given feedback clock. Table 8: MF Calculation Table 7: Frequency Range Select FS Nominal PLL Frequency Range (fNOM) L 24 to 50 MHz M 48 to 100MHz H 96 to 200 MHz Selectable output skew is in discrete increments of time unit (tU). The value of tU is determined by the FS setting and the PLL’s operating frequency (fNOM). Use the following equation to calculate the time unit (tU): Equation 1. t u = NOM MF fNOM examples that result in a tU of 1.0ns L 32 31.25 MHz M 16 62.5 MHz H 8 125 MHz Table 9: Signal Propagation Delays in Various Media Medium 1 (f FS * MF) The fNOM term, which is calculated with the help of Table 6, must be compatible with the nominal frequency range selected by the FS signal as defined in Table 7. The multiplication factor (MF), also determined by FS, is shown in Table 8. The UT7R995/C output skew steps have a typical accuracy of +/15% of the calculated time unit (tU). Air (Radio Waves) 85 1.0 Coax. Cable (75% Velocity) 113 1.8 Coax. Cable (66% Velocity) 129 2.3 FR4 PCB, Outer Trace 140 - 180 2.8 - 4.5 FR4 PCB, Inner Trace 180 4.5 240 - 270 8 - 10 Alumina PCB, Inner Trace 4 Propagation Dielectric Delay (ps/inch) Constant A graphical summary of Table 10 is shown in Figure 3. The drawing assumes that the FB input is driven by a clock output programmed with zero skew. Depending upon the state of the nF[1:0] pins the respective clocks will be skewed, divided, or inverted relative to the fedback output as shown in Figure 3. Table 10: Output Skew Settings4 nF[1:0] Skew 1Q[1:0], 2Q[1:0] Skew 3Q[1:0] Skew 4Q[1:0] LL 1, 2 -4tU Divide by 2 Divide by 2 LM -3tU -6tU -6tU 1.3 Output Drive, Synchronization, and Power Supplies: LH -2tU -4tU -4tU ML -1tU -2tU -2tU MM Zero Skew Zero Skew Zero Skew MH +1tU +2tU +2tU HL +2tU +4tU +4tU The UT7R995/C employs flexible output buffers providing the user with selectable drive strengths, independent power supplies, and synchronization to either edge of the reference input. Using the 3-level PE/HD pin, the user selects the reference edge synchronization and the output drive strength for all clock outputs. The options for edge synchronization and output drive strength selected by the PE/HD pin are listed in Table 11. HM +3tU +6tU +6tU HH 2 +4tU Divide by 4 Inverted 3 Table 11: PE/HD Settings PE/HD Synchronization Output Drive Strength 1 Notes: 1. nF[1:0] = LL disables bank specific outputs if TEST=MID and sOE = HIGH. 2. When TEST=MID or HIGH, the Divide-by-2, Divide-by-4, and Inversionoptions function as defined in Table 9. 3. When 4Q[1:0] are set to run inverted (4F[1:0] = HH), sOE disables these outputs HIGH when PE/HD = HIGH or MID, sOE disables them LOW when PE/HD = LOW. 4. Skew accuracy is within +/- 15% of n*tU where "n" is the selected number of skew steps. Supplied as a design limit, but not tested or guaranteed. L Negative Low Drive M Positive High Drive H Positive Low Drive t0 - 5tU t0 - 4tU t0 - 3tU t0 - 2tU t0 - 1tU t0 t0 + 1tU t0 + 2tU t0 + 3tU t0 + 4tU t0 + 5tU t0 + 6tU t0 - 6tU Notes: 1. Please refer to "DC Parameters" section for IOH/IOL specifications. XTAL1 Input FB Input 1F[1:0] 2F[1:0] 3F[1:0] 4F[1:0] (N/A) LL LM LH ML MM MH HL HM HH (N/A) (N/A) LL LM LH ML MM MH HL HM HH (N/A) LM LH (N/A) ML (N/A) MM (N/A) MH (N/A) HL HM LM LH (N/A) ML (N/A) MM (N/A) MH (N/A) HL HM (N/A) (N/A) LL/HH LL DIVIDED (N/A) (N/A) (N/A) HH INVERTED -6tU -4tU -3tU -2tU -1tU 0tU +1tU +2tU +3tU +4tU +6tU Figure 3. Typical Outputs with FB Connected to a Zero-Skewed Output 5 When the outputs are configured for low drive operation, they will provide a minimum 12mA of drive current regardless of the selected output power supply. If the outputs are configured for high drive operation, they will provide a minimum 24mA of drive current under a 3.3V power supply and 20mA when powered from a 2.5V supply. UT7R995C XTAL1 The UT7R995/C features split power supply buses for Banks 1 and 2, Bank 3, and Bank 4. These independent power supplies enable the user to obtain both 3.3V and 2.5V output signals from one UT7R995/C device. The core power supply (VDD) must run from a 3.3V power supply. Table 12 summarizes the various power supply options available with the UT7R995/C. XTAL2 R1 Rdc Y1 L1 Table 12: Power Supply Constraints 1 VDD VDDQ1 VDDQ3 VDDQ4 3.3V 3.3V or 2.5V 3.3V or 2.5V 3.3V or 2.5V C2 C1 Cdc Notes: 1. VDDQ1/3/4 must not be set at a level higher than that of VDD. Rdc = ~10MΩ; 1.4 Reference Clock Interfaces C2 is used to tune the circuit for stable oscillation. Typical values for C2 range from 30pF to 50pF. Fundamental Frequency Pierce Crystal Oscillator When an external, LVCMOS/LVTTL, digital clock is used to drive the UT7R995 and UT7R995C, the reference clock signal should drive the XTAL1 input of the RadClock, while the XTAL2 output should be left unconnected (see Figure 4). Note, for the UT7R995 only, the XTAL2 pin is defined as a noconnect. N/C Cdc = Not Used R1 and C1 are selected to create a time constant that facilitates the fundamental frequency (fF) of the quartz crystal as defined in equation 2. Equation 2. fF = 1 (2π * R1* C1) As an example, selecting a value of 100Ω for R1 and 80pF for C1 would facilitate the reliable operation of a 20MHz, AT-cut, quartz crystal. Higher Frequency Pierce Crystal Oscillator NC/XTAL2 Rdc = ~10MΩ; External Digital Oscillator L1 = Not Used; XTAL1 Cdc = ~1.5nF; C2 = Tuning capacitor similar to prior example R1 and C1 are selected to create a time constant that facilitates the overtone frequency (fOT) of the quartz crystal as shown in equation 3. VSS Equation 3. f OT = 1 (2π * R1* C1) Additionally, L1 is selected such that its relationship with C1 facilitates a frequency falling between the fundamental frequency (fF) and the specified overtone frequency (fOT) of the quartz crystal as shown in equation 4. Figure 4. External Digital Clock Oscillator Interface Equation 4. In addition to a digital clock reference, the UT7R995C can interface to a quartz crystal. When interfacing to a quartz crystal, XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier within the RadClock. This inverting amplifier provides the initial 180o phase shift of the reference clock whose frequency, and subsequent 180o phase shift, is set by the quartz crystal and its surrounding RLC network. Figure 5 shows a typical pierce-oscillator with tank-circuit that will support reliable startup of fundamental and odd-harmonic, ATcut, quartz crystals. fM = (2π * 1 L1* C1 ) As an example, selecting the following component values will result in a 50MHz Pierce Crystal Oscillator based upon an 3rd overtone, AT-cut, quartz crystal having a fundamental frequency of 16.6666MHz. Rdc = 10MΩ; R1 = 50Ω; fF = 16.6666MHz; Cdc = 1.5nF; C1 = 55pF; fOT = 50MHz C2 = 30pF; L1 = 300nH Figure 5. Pierce Crystal Oscillator with Tank Circuit 6 2.0 RADIATION HARDNESS Table 13: Radiation Hardness Design Specifications Parameter Limit Units Total Ionizing Dose (TID) >1E6 rads(Si) Single Event Latchup (SEL) 1, 2 >109 MeV-cm2/mg Onset Single Event Upset (SEU) LET Threshold 3, 4 >109 MeV-cm2/mg Onset Single Event Transient (SET) LET Threshold (@ 50MHz; FS=L)5 >74 MeV-cm2/mg 1.0E14 n/cm2 Neutron Fluence Notes: 1. The UT7R995/C are latchup immune to particle LETs >109 MeV-cm2/mg. 2. Worst case temperature and voltage of TC = +125oC, VDD = 3.6V, VDDQ1/Q3/Q4 = 3.6V for SEL. 3. Worst case temperature and voltage of TC = +25oC, VDD = 3.0V, VDDQ1/Q3/Q4 = 3.0V for SEU. 4. All SEU data specified in this datasheet is based on the storage elements used in the UT7R995/C. 5. For characterization data on the UT7R995/C SET performance over allowable operating ranges, please contact the factory. 3.0 PIN DESCRIPTION Flatpack Pin No. Name I/O Type Description Primary reference clock input. When interfacing a single-ended reference clock to the UT7R995 or UT7R995C, this input must be driven by an LVTTL/LVCMOS clock source. 37 XTAL1 I LVTTL If a quartz crystal is used as the reference clock source (UT7R995C only), the second pin on the crystal must be connected to XTAL2. If a singled ended reference clock is supplied to this pin, then XTAL2 should be left unconnected. N/C -- -- No Connect. UT7R995 Only. XTAL2 O N/A Feedback output from the on-board crystal oscillator. When a crystal is used to supply the reference clock for the UT7R995C, this pin must be connected to the second terminal of the quartz crystal. If a single-ended reference clock is supplied to XTAL1, then this output should be left unconnected. 13 FB I LVTTL Feedback input for the PLL. When FB is not driven by an active clock output the PLL will run to its maximum frequency, unless the device is placed in power-down. 28 TEST 1 I Built-in test control signal. When Test is set to the MID or HIGH level, it disables 3-Level the PLL and the XTAL1 reference frequency is driven to all outputs (except for the conditions described in note 1). Set Test LOW for normal operation. 36 7 Flatpack Pin No. Name I/O Type Description Synchronous Output Enable. The sOE input is used to synchronously enable/ disable the output clocks. Each clock output that is controlled by the sOE pin is synchronously enabled/disabled by the individual output clock. When HIGH, sOE disables all clocks except 2Q0 and 2Q1. When disabled, 1Q0, 1Q1, 3Q0, and 3Q1 will always enter a LOW state when PE/HD is MID or HIGH, and they will disable into a HIGH state when PE/HD is LOW. The disabled state of 4Q0 and 4Q1 is dependent upon the state of PE/HD and 4F[1:0]. The following table illustrates the disabled state of bank 4 outputs as they are controlled by the state of PE/HD and 4F[1:0]. 3 sOE I LVTTL PE/HD 4F[1:0]* 4Q0 4Q1 LOW HH LOW LOW MID HH HIGH HIGH HIGH HH HIGH HIGH *All other combinations of 4F[1:0] will result in 4Q0 and 4Q1 disabling into a LOW state when PE/HD is MID or HIGH, and they will disable into a HIGH state when PE/HD is LOW. When TEST is held at the MID level and sOE is HIGH, the nF[1:0] pins act as individual output enable/disable controls for each output bank, excluding bank 2. Setting both nF[1:0] signals LOW disables the corresponding output bank. Set sOE LOW to place the UT7R995/C RadClockTM outputs into their normal operating modes. 1, 2, 24, 25, 26, 27, 47, 48 nF[1:0] I Output divider and phase skew selection for each output bank. 3-Level Please see Tables 3, 4, 5, 6, and 9 for a complete explanation of the nF[1:0] control functions and their effects on output frequency and skew. 46 FS I 3-Level VCO operating frequency range selection. Please see Tables 7 and 8. 8, 9, 17, 18, 31, 32, 41, 42 nQ[1:0] O LVTTL Four clock banks of two outputs each. Please see Table 6 for frequency settings and Table 9 for skew settings. 22, 23 DS[1:0] I 3-Level Feedback input divider selection. Please see Table 1 for a summary of the feedback input divider settings. Positive/negative edge control and high/low output drive strength selection. The PE portion of this pin controls which edge of the reference input synchronizes the clock outputs. The HD portion of this pin controls the drive strength of the output clock buffers. The following table summarizes the effects of the PE/HD pin during normal operation. 5 PE/HD I 3-Level PE/HD LOW MID HIGH Synchronization Negative Edge Positive Edge Positive Edge Output Drive Strength Low Drive High Drive Low Drive Low drive strength outputs provide 12mA of drive strength while the high drive condition results in 24mA of current drive. Output banks operating from a 2.5V power supply guarantee a high drive of 20mA. 8 Flatpack Pin No. 4 Name PD/DIV I/O I Type Description 3-Level Power down and reference divider control. This dual function pin controls the power down operation and selects the input reference divider. Holding the pin low during power up ensures clean RadClock startup that is independent of the behavior of the reference clock. The pin may also be driven low at any time to force a reset to the PLL. The following table summarizes the operating states controlled by the PD/DIV pin. PD/DIV LOW MID Operating Mode Powered Down Normal Operation Input Reference Divider N/A ÷2 HIGH Normal Operation ÷1 PLL lock indication signal. A HIGH state indicates that the PLL is in a locked condition. A LOW state indicates that the PLL is not locked and the outputs may not be synchronized to the input. As the following table indicates, the level of phase alignment between XTAL1 and FB that will cause the LOCK pin to change states is dependent upon the frequency range selected by the FS input. 20 LOCK O FS L M H LVTTL LOCK Resolution 1.6ns typical 1.6ns typical 800ps typical ** Note: The LOCK pin can only be considered as a valid output when the RadClock is in a normal mode of operation (e.g. PD/DIV != LOW, TEST = LOW, and a valid reference clock is supplied to the XTAL1 input). Until these conditions are met, RadClock is not in a normal operating mode and the LOCK pin may be HIGH or LOW and therefore should not be used in making any logical decisions until the device is in a normal operating mode. Reference the tLOCK parameter in the AC timing specification to determine the delay for the LOCK pin to become valid HIGH following a stable input reference clock and the application of a clock to the FB input. 43 VDDQ4 2 PWR Power Power supply for Bank 4 output buffers. Please see Table 12 for supply level constraints. 7 VDDQ3 2 PWR Power Power supply for Bank 3 output buffers. Please see Table 12 for supply level constraints. 19, 30 VDDQ1 2 PWR Power Power supply for Bank 1 and Bank 2 output buffers. Please see Table 12 for supply level constraints. 6, 12, 14, 35, 38 VDD 2 PWR Power Power supply for internal circuitry. Please see Table 12 for supply level constraints. 10, 11, 15, 16, 21, 29, 33, 34, 39, 40, 44, 45 VSS PWR Power Ground Notes: 1. When TEST = MID and sOE = HIGH, the PLL remains active with nF[1:0] = LL functioning as an output disable control for individual output banks. Skew selections remain in effect unless nF[1:0] = LL. 2. A bypass capacitor (0.1μF) should be placed as close as possible to each positive power pin (<0.2"). An additional 1μF capacitor should be located within 0.2" of the output bank power supplies (VDDQ1, VDDQ3, and VDDQ4). If these bypass capacitors are not close to the pins, their high frequency filtering characteristics will be cancelled by the parasitic inductance of the traces. Additionally, it is recommend that wide traces (0.025" or wider) be used when connecting the decoupling capacitors to their respective power pins on the RadClock. 9 4.0 ABSOLUTE MAXIMUM RATINGS:1 (Referenced to VSS) Symbol VDD VDDQ1, VDDQ3, and VDDQ4 VIN VOUT VO Description Limits Units Core Power Supply Voltage -0.3 to 4.0 V Output Bank Power Supply Voltage -0.3 to 4.0 V -0.3 to VDD + 0.3 V -0.3 to VDDQn + 0.3 V -0.3 to VDD + 0.3 V Voltage Any Input Pin Voltage Any Clock Bank Output Voltage on XTAL2 and LOCK Outputs II DC Input Current +10 mA PD Maximum Power Dissipation 1.5 W -65 to +150 °C +150 °C 15 °C/W 3000 V TSTG TJ ΘJC ESDHBM Storage Temperature Maximum Junction Temperature 2 Thermal Resistance, Junction to Case ESD Protection (Human Body Model) - Class II Notes: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. Maximum junction temperature may be increased to +175°C during burn-in and steady-static life. 5.0 RECOMMENDED OPERATING CONDITIONS: Symbol VDD VDDQ1, VDDQ3, and VDDQ4 VIN VOUT TC Description Limits Units Core Operating Voltage 3.0 to 3.6 V Output Bank Operating Voltage 2.25 to 3.6 V 0 to VDD V Voltage Any Bank Output 0 to VDDQn V Case Operating Temperature -55 to +125 °C Voltage Any Configuration and Control Input 10 6.0 DC INPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDD = +3.3V + 0.3V; TC = -55°C to +125°C) (For "W" screening, TC = -40°C to +125°C) Symbol Description VIH 4 VIL 4 Conditions Min. Max. Units High-level input voltage (XTAL1, FB and sOE inputs) 2.0 -- V Low-level input voltage (XTAL1, FB and sOE inputs) -- 0.8 V VIHH 1, 3 High-level input voltage VDD - 0.6 -- V VIMM 1, 3 Mid-level input voltage VDD÷2 - 0.3 VDD÷2 + 0.3 V VILL 1, 3 Low-level input voltage -- 0.6 V VIN = VDD or VSS; VDD = Max -5 5 μA HIGH, VIN = VDD -- 200 μA MID, VIN = VDD/2 -50 50 μA LOW, VIN = VSS -200 -- μA TC = +25°C -- 100 μA TC = +125°C -- 150 μA TC = -55°C -- 4.5 mA IIL I3L 1 IDDPD Input leakage current (XTAL1, FB and sOE inputs) 3-Level input DC current Power-down current VDD = VDDQn = +3.0V; TEST & sOE = HIGH; XTAL1, PD/DIV, FB, FS, & PE/ HD = LOW; All other inputs are floated; Outputs are not loaded CIN-2L 2 Input pin capacitance 2-level inputs f = 1MHz @ 0V; VDD = Max 8.5 pF CIN-3L 2 Input pin capacitance 3-level inputs f = 1MHz @ 0V; VDD = Max 15 pF Notes: * Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si). 1. These inputs are normally wired to VDD, VSS, or left unconnected. Internal termination resistors bias unconnected inputs to VDD/2 + 0.3V. The 3-level inputs include: TEST, PD/DIV, PE/HD, FS, nF[1:0], DS[1:0]. 2. Capacitance is measured for initial qualification and when design changes may affect the input/output capacitance. Capacitance is measured between the designated terminal and VSS at a frequency of 1MHz and a signal amplitude of 50mV rms maximum. 3. Pin FS is guaranteed by functional testing. 4. For pin FB, this specification is supplied as a design limit, but is neither guaranteed nor tested. 11 7.0 DC OUTPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDDQn = +2.5V + 10%; VDD = +3.3V + 0.3V; TC = -55°C to +125°C) (For "W" screening, TC = -40°C to +125°C) (Note 1) Symbol VOL VOH IOSQn 2 I DDOP 3,5,6 COUT 4 Description Output low voltage High-level output voltage Short-circuit output current Dynamic supply current Output pin capacitance Conditions Min. Max. Units IOL = 12mA (PE/HD = LOW or HIGH); (Pins: nQ[1:0]) -- 0.4 V IOL = 20mA (PE/HD = MID); (Pins: nQ[1:0]) -- 0.4 V IOL = 2mA (Pins: LOCK) -- 0.4 V IOH = -6mA (PE/HD=LOWorHIGH); (Pins: nQ[1:0]; VDDQn = +2.25V) 2.0 -- V IOH = -10mA (PE/HD=LOWor HIGH); (Pins: nQ[1:0]; VDDQn = +2.375V) 2.0 -- V IOH = -10mA (PE/HD = MID); (Pins: nQ[1:0]; VDDQn = +2.25V) 2.0 -- V IOH = -20mA (PE/HD = MID); (Pins: nQ[1:0]; VDDQn = +2.375V) 2.0 -- V IOH = -2mA (Pins: LOCK) 2.4 -- V VO = VDDQn or VSS; VDDQn = +2.75V; PE/HD = MID -500 500 mA VO = VDDQn or VSS; VDDQn = +2.75V; PE/HD = LOW or HIGH -300 300 mA UT7R995 -- 200 mA UT7R995C -- 280 mA UT7R995 -- 130 mA UT7R995C -- 145 mA @200MHz (FS = HIGH); VDD = Max; VDDQn = +2.75V; CL = 20pF/output @50MHz (FS = LOW); VDD = Max; VDDQn = +2.75V; CL = 20pF/output f = 1MHz @ 0V; VDD = Max; VDDQn = +2.75V 15 pF Notes: * Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si). 1. Unless otherwise noted, these tests are performed with VDD and VDDQn at their minimum levels. 2. Supplied as a design limit. Neither guaranteed nor tested. 3. When measuring the dynamic supply current, all outputs are loaded in accordance with the equivalent test load defined in figure 10. 4. Capacitance is measured for initial qualification and when design changes may affect the input/output capacitance. Capacitance is measured between the designated terminal and VSS at a frequency of 1MHz and a signal amplitude of 50mV rms maximum. 5. For the UT7R995, the 200MHz test condition is based on an XTAL1 frequency of 200MHz. For the UT7R995C, the 200MHz test condition is based on an XTAL1 frequency of 16.666667MHz, and a N-divider setting of 12. 6. To reduce power consumption for the device, the user may tie the unused VDDQn pins to VSS. 12 7.0 DC OUTPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDDQn = +3.3V + 0.3V; VDD = +3.3V + 0.3V; TC = -55°C to +125°C) (For "W" screening, TC = -40°C to +125°C) (Note 1) Symbol VOL VOH IOSQn 2 Description Output low voltage High-level output voltage Short-circuit output current Conditions Min. Max. Units IOL = 12mA (PE/HD = LOW or HIGH); (Pins: nQ[1:0]) -- 0.4 V IOL = 24mA (PE/HD = MID); (Pins: nQ[1:0]) -- 0.4 V IOL = 2mA (Pins: LOCK) -- 0.4 V IOH = -12mA (PE/HD = LOW or HIGH); (Pins: nQ[1:0]) 2.4 -- V IOH = -24mA (PE/HD = MID); (Pins: nQ[1:0]) 2.4 -- V IOH = -2mA (Pins: LOCK) 2.4 -- V VO = VDDQn or VSS; VDDQn = +3.6V; PE/HD = MID -600 600 mA VO = VDDQn or VSS; VDDQn = +3.6V; PE/HD = LOW or HIGH -300 300 mA UT7R995 -- 250 mA UT7R995C -- 360 mA UT7R995 -- 150 mA UT7R995C -- 160 mA @200MHz (FS = HIGH); VDD = Max; VDDQn = +3.6V; CL = 20pF/output I 3,5,6 DDOP Dynamic supply current @50MHz (FS = LOW); VDD = Max; VDDQn = +3.6V; CL = 20pF/output COUT 4 Output pin capacitance f = 1MHz @ 0V; VDD = Max; VDDQn = +3.6V 15 pF Notes: * Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019, Condition A up to a TID level of 1.0E6 rad(Si). 1. Unless otherwise noted, these tests are performed with VDD and VDDQn at their minimum levels. 2. Supplied as a design limit. Neither guaranteed nor tested. 3. When measuring the dynamic supply current, all outputs are loaded in accordance with the equivalent test load defined in figure 10. 4. Capacitance is measured for initial qualification and when design changes may affect the input/output capacitance. Capacitance is measured between the designated terminal and VSS at a frequency of 1MHz and a signal amplitude of 50mV rms maximum. 5. For the UT7R995, the 200MHz test condition is based on an XTAL1 frequency of 200MHz. For the UT7R995C, the 200MHz test condition is based on an XTAL1 frequency of 16.666667MHz, and a N-divider setting of 12. 6.To reduce power consumption for the device, the user may tie the unused VDDQn pins to VSS. 13 8.0 AC INPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDD = VDDQn = +3.3V + 0.3V; TC = -55°C to +125°C) (Note 1) Symbol Description tR, tF 2, 3 Input rise/fall time tPWC6 Min. Max. Unit VIH(min)-VIL(max) -- 20 ns/V Input clock pulse HIGH or LOW 2 -- ns tXTAL7 Input clock period 1÷FXTAL 5 500 ns tDCIN6 Input clock duty cycle HIGH or LOW 10 90 % FS = LOW; PD/DIV = HIGH 2 50 MHz FS = LOW; PD/DIV = MID 4 100 MHz FS = MID; PD/DIV = HIGH 4 100 MHz FS = MID; PD/DIV = MID 8 200 MHz FS = HIGH; PD/DIV = HIGH 8 200 MHz FS = HIGH; PD/DIV = MID 16 200 MHz fXTAL 4, 5, 7 Digital reference input frequency Condition Notes: * Post-radiation performance guaranteed at 25°C per MIL-STD-883 Method 1019. 1. Reference Figure 11 for clock output loading circuit that is equivalent to the load circuit used for all AC testing. The input waveform used to test these parameters is shown in Figure 9. 2. Supplied only as a design guideline, neither tested nor guaranteed. 3. When driving the UT7R995C with a crystal, the XTAL1 pin does not define maximum input rise/fall time. 4. Although the input reference frequencies are defined as-low-as 2MHz, the N and R dividers must be selected to ensure the PLL operates from 24MHz-50MHz when FS = LOW, 48MHz-100MHz when FS = MID, and 96MHz-200MHz when FS = HIGH. 5. The UT7R995C is guaranteed by characterization for quartz crystal frequencies ranging from 2MHz to 48MHz. Contact the factory for support using quartz crystals that oscillate above 48MHz. 6. For the UT7R995C only, this parameter is guaranteed by characterization, but not tested. 7. For the UT7R995C only, this parameter is guaranteed by characterization, but only tested for frequencies <100 MHz. 14 9.0 AC OUTPUT ELECTRICAL CHARACTERISTICS (Pre- and Post-Radiation)* (VDD = +3.3V + 0.3V; TC = -55°C to +125°C) (For "W" screening, TC = -40°C to +125°C) (Note 1) Symbol Description fOR Output frequency range Min. Max. Unit VDDQn = +3.3V 6 200 MHz VCO lock range VDDQn = +3.3V 24 200 MHz VCOLBW 2 VCO loop bandwidth VDD = VDDQn = +3.3V; TC = Room Temperature 0.25 3.5 MHz tSKEWPR 3, 8 Matched-pair skew Skew between the earliest and the latest output transitions within the same bank. -- 100 ps tSKEW0 3, 8 Skew between the earliest and the latest output transitions among all outputs at 0tU. -- 200 ps tSKEW1 3,8 Skew between the earliest and the latest output transitions among all outputs for which the same phase delay has been selected. -- 200 ps Skew between the nominal output rising edge to the inverted output falling edge -- 500 ps tSKEW3 3 Skew between non-inverted outputs running at different frequencies. -- 500 ps tSKEW4 3 Skew between nominal to inverted outputs running at different frequencies. -- 600 ps tSKEW5 3 Skew between nominal outputs at different power supply levels. -- 650 ps -- 450 ps -250 +250 ps fout < 100 MHz, measured at VDD÷2 48 52 % fout > 100 MHz, measured at VDD÷2 45 55 % VCOLR tSKEW2 3 Output-output skew Condition tPART 8 Part-part skew Skew between the outputs of any two devices under identical settings and conditions (VDDQn, VDD, temp, air flow, frequency, etc). tPD0 4, 8 XTAL1 to FB propagation delay VDD = VDDQn = +3.3V; TC = Room Temperature tODCV8 Output duty cycle tPWH Output high time deviation from 50% Measured at 2.0V; VDDQn = +3.3V -- 1.5 ns tPWL Output low time deviation from 50% Measured at 0.8V; VDDQn = +3.3V -- 2.0 ns tORISE8 & tOFALL tLOCK 5 tLOCKRES 2, 6 Measured as transition time between VOH = +1.7V and VOL = +0.7V for VDD = 3.0V; VDDQn = +2.25V; CL = 40pF PE/HD = HIGH 0.30 1.5 ns PE/HD = MID 0.25 1.25 ns Measured as transition time between VOH = +2.0V and VOL = +0.8V for VDD = 3.6V; VDDQn = +3.3V; CL = 40pF PE/HD = HIGH 0.20 1.25 ns PE/HD = MID 0.10 1.0 ns -- 0.5 ms FS = LOW 1.6ns + 200ps typ. ns FS = MID 1.6ns + 200ps typ. ns FS = HIGH 800ps + 100ps typ. ps Output rise/fall time PLL lock time LOCK Pin Resolution 15 Symbol tCCJ 7 Description Cycle-cycle jitter Condition Divide by 1 output frequency, FB = divide by 12 Min. Max. Unit -- 50 ps Notes: 1. Reference Figure 11 for clock output loading circuit that is equivalent to the load circuit used for all AC testing. 2. Supplied as a design guideline. Neither guaranteed nor tested. 3. Test load = 40pF, terminated to VDD÷2. All outputs are equally loaded. See figure 11. 4. tPD is measured at 1.5V for VDD = 3.3V with XTAL1 rise/fall times of 1ns between 0.8V-2.0V. 5. tLOCK is the time that is required before outputs synchronize to XTAL1 as determined by the phase alignment between the XTAL1 and FB inputs. This specification is valid with stable power supplies which are within normal operating limits. 6. Lock detector circuit will monitor the phase alignment between the XTAL1 and FB inputs. When the phase separation between these two inputs is greater than the amount listed, then the LOCK pin will drop low signaling that the PLL is out of lock. 7. This parameter is guaranteed by measuring cycle-cycle jitter on 55,000, back-to-back clock cycles. 8. Guaranteed by characterization, but not tested. 16 tXTAL tPWC tDCIN XTAL1 tPD0 tODCV tODCV FB tSKEWPR tCCJ(1-12) nQ0 tSKEW0, tSKEW1 nQ1 tSKEW2 Inverted Q tSKEW4 XTAL1 ÷ 2 (VDDQn = 3.3V) tSKEW3 tSKEW5 XTAL1 ÷ 4 (VDDQn = 2.5V) Figure 6. AC Timing Diagram 17 tOFALL tORISE tPWH 2.0V VTH = 1.5V 0.8V tPWL Figure 7. +3.3V LVTTL Output Waveform tOFALL tORISE tPWH 1.7V VTH = 1.25V 0.7V tPWL Figure 8. +2.5V LVTTL Output Waveform < 1ns < 1ns 3.0V 2.0V VTH = 1.5V 0.8V 0V Figure 9. +3.3V LVTTL Input Test Waveform VDDQn DUT 150Ω 100Ω CL DUT 150Ω 100Ω Figure 10. Output Test Load Circuit for LOCK and Dynamic Power Supply Current Measurements CL Figure 11. Clock Output AC Test Load Circuit Note: This is not the recommended termination for normal user operation. 18 Notes: 1. All exposed metallized areas are gold plated over electrically plated nickel per MIL-PRF38535. 2. The lid is electrically connected to VSS. 3. Lead finishes are in accordance with MILPRF-38535. 4. Dimension symbology is in accordance with MIL-PRF-38535. 5. Lead position and coplanarity are not measured. 6. ID mark symbol is vendor option: no alphanumerics. Figure 12. 48-lead Ceramic 19 ORDERING INFORMATION UT7R995 and UT7R995C: UT7R995 - * * * Lead Finish (Notes 1 & 2): (A) = Hot solder dipped (C) = Gold (X) = Factory option (gold or solder) Screening (Notes 3 & 4): (C) = Military Temperature Range flow (-55°C to +125°C) (P) = Prototype flow (W) = Extended Industrial Temperature Range Flow (-40°C to +125°C) Package Type: (X) = 48-Lead Ceramic Flatpack UT7R995C - * * * Lead Finish (Notes 1 & 2): (A) = Hot solder dipped (C) = Gold (X) = Factory option (gold or solder) Screening (Notes 3 & 4): (C) = Military Temperature Range flow (-55°C to +125°C) (P) = Prototype flow (W) = Extended Industrial Temperature Range Flow (-40°C to +125°C) Package Type: (X) = 48-Lead Ceramic Flatpack Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, then the part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3. Prototype flow per UTMC Manufacturing Flows Document. Tested at 25°C only. Lead finish is GOLD ONLY. Radiation neither tested nor guaranteed. 4. Military Temperature Range flow per Aeroflex Colorado Springs Manufacturing Flows Document. Devices are tested at -55°C, room temp, and 125°C. Radiation neither tested nor guaranteed. 20 UT7R995 and UT7R995C: SMD 5962 * 05214 ** * * * Lead Finish (Notes 1 & 2): (A) = Hot solder dipped (C) = Gold (X) = Factory Option (gold or solder) Case Outline: (X) = 48-Lead Ceramic Flatpack Class Designator: (Q) = QML Class Q (V) = QML Class V Device Type (01) = UT7R995 -> 6MHz-to-200MHz, High Speed, Multi-Phase, Zero-Delay, without Crystal Capability (02) = UT7R995 - Extended Industrial Temperature (-40°C to +125°C) (03) = UT7R995C -> 6MHz-to-200MHz, High Speed, Multi-Phase, Zero-Delay, with Crystal Capability (04) = UT7R995C - Extended Industrial Temperature (-40°C to +125°C) Drawing Number: 5962-05214 Total Dose (Note 3): (R) = 1E5 rads(Si) (F) = 3E5 rads(Si) (G) = 5E5 rads(Si) (H) = 1E6 rads(Si) (NOTE 4) (NOTE 4) (NOTE 4) Federal Stock Class Designator: No options Notes: 1.Lead finish (A,C, or X) must be specified. 2.If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3.Total dose radiation must be specified when ordering. QML Q and QML V are not available without radiation hardening. 4.These radiation screen levels are currently unavailable. Contact the factory for information regarding lead-time and availability. 21 Aeroflex Colorado Springs - Datasheet Definition Advanced Datasheet - Product In Development Preliminary Datasheet - Shipping Prototype Datasheet - Shipping QML & Reduced Hi-Rel COLORADO Toll Free: 800-645-8862 Fax: 719-594-8468 INTERNATIONAL Tel: 805-778-9229 Fax: 805-778-1980 NORTHEAST Tel: 603-888-3975 Fax: 603-888-4585 SE AND MID-ATLANTIC Tel: 321-951-4164 Fax: 321-951-4254 WEST COAST Tel: 949-362-2260 Fax: 949-362-2266 CENTRAL Tel: 719-594-8017 Fax: 719-594-8468 www.aeroflex.com [email protected] Aeroflex Colorado Springs, Inc., reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused 22