SURFACE MOUNT MICROPROCESSOR CRYSTAL FEATURES SERIES TT-SMDC AT CUT CRYSTAL PERFORMANCE THERMOPLASTIC PACKAGE SUITED FOR REFLOW SOLDERING EXCELLENT FOR HIGH DENSITY CIRCUIT BOARDS SPECIFICATIONS MODEL TYPE TT-SMDC FREQUENCY RANGE 3.579545 MHz TO 70.000 MHz FUNDAMENTAL MODE OF OSCILLATION 3.579545 MHz TO 30.000 MHz THIRD OVERTONE FREQUENCY TOLERANCE AT 25 C ±50 PPM MAX (±30 PPM AVAILABLE) FREQUENCY STABILITY OVER TEMPERATURE ±50 PPM MAX (±30 PPM AVAILABLE) TEMPERATURE RANGE 30.10 MHz TO 70.000 MHz OPERATING -10 C TO +60 C EXTENDED -40 C TO +85 C LOAD CAPACITANCE 12 pF TO 32 pF OR SERIES SHUNT CAPACITANCE 7 pF MAXIMUN EQUIVALENT SERIES RESISTANCE (ESR) SEE TABLE 1 DRIVE LEVEL 100 W MAXIMUM SHOCK RESISTANCE ±5 PPM MA XIMUM 75 cm DROP TEST IN 3 AXES ONTO A HARD SURFACE OR 3000 g/0.3 ms x ‰ SINEWAVE IN 3 AXES REFLOW CONDITIONS 240 C FOR 10 S MAXIMUM TABLE 1 MODE FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL THIRD OVERTONE MAXIMUM ESR (OHM) 200 150 100 50 100 REFLOW SOLDERING PROFILE OUTLINE DRAWINGS Scale none Dimension in 4 3 1 2 1.8 .071 REFLOW 240 C – 5 TEMPERATURE FREQUENCY (MHz) 3.50 TO 3.999 4.00 TO 5.999 6.00 TO 9.999 10.00 TO 30.00 30.10 TO 90.00 mm inch 10 s COOLING PREHEATING 150 C 100 s 25 C 180s MAX 1.8 .071 TIME (SECONDS) M A R K IN G A R E A 2.0 .079 4.6 M A X .181 M A X 4.0 .16 1.75 .069 1.5 D IA .06 D IA 11.5 .453 12.8 .504 0.8 .03 24 .945 0.8 .03 1.8 .071 3.7 M A X .146 M A X 12.5 M A X .492 M A X 9.4 .370 1.7 .067 CARRIER TAPE DIMENSIONS 7.6 .299 S O LD E R PAT T E R N 4.8 .189 5.0 .197 12.0 .472 PACKAGING PART NUMBERING SYSTEM HOLDER TYPE TT-SMDC FREQUENCY - IN MHz 330 mm REEL DIAMETER, 24mm TAPE WIDTH. QUANTITY: 1000 PIECES PER REEL LOAD CAPACITANCE - 12 TO 32 pF FOR PARALLEL F S FOR SERIES 3OT MODE FUNDAMENTAL THIRD OVERTONE TAPE AND REEL TR EXAMPLE: TT-SMDC-12.288-22-TR Raltron Electronics Corporation 10651 NW 19th St. Miami, Florida 33172 U.S.A. Tel: 305-593-6033 Fax: 305-594-3973 e-mail: [email protected] Internet: http://www.raltron.com