AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 1.0 General Description The AMIS-42671 CAN transceiver with autobaud is the interface between a controller area network (CAN) protocol controller and the physical bus. It may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS42671 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. The AMIS-42671 is primarily intended for industrial network applications where long network lengths are mandatory. Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be low. AMIS-42671 allows low transmit data rates down 10 Kbit/s or lower. The autobaud function allows the CAN controller to determine the incoming baud rate without influencing the CAN communication on the bus. 2.0 Key Features • • • • • • • • • • • • • • Fully compatible with the ISO 11898-2 standard Autobaud function Wide range of bus communication speed (0 up to 1 Mbit/s) Allows low transmit data rate in networks exceeding 1 km Ideally suited for 12V and 24V industrial and automotive applications Low electromagnetic emission (EME) common-mode choke is no longer required Differential receiver with wide common-mode range (+/- 35V) for high EMS No disturbance of the bus lines with an un-powered node Thermal protection Bus pins protected against transients Silent mode in which the transmitter is disabled Short circuit proof to supply voltage and ground Logic level inputs compatible with 3.3V devices ESD protection for CAN bus at ± 8 kV 3.0 Technical Characteristics Table 1: Technical Characteristics Symbol Parameter VCANH DC voltage at pin CANH VCANL DC voltage at pin CANL Vi(dif)(bus_dom) Differential bus output voltage in dominant state tpd(rec-dom) Propagation delay TxD to RxD tpd(dom-rec) Propagation delay TxD to RxD CM-range Input common-mode range for comparator VCM-peak VCM-step Common-mode peak Common-mode step Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit 42.5Ω < RLT < 60Ω See Figure 8 See Figure 8 Guaranteed differential receiver threshold and leakage current See Figure 9 and Figure 10 (Notes) See Figure 9 and Figure 10 (Notes) Min. -45 -45 1.5 70 100 -35 Max. +45 +45 3 245 245 +35 Unit V V V ns ns V -500 -150 500 150 mV mV Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission. 4.0 Ordering Information Ordering Code (Tubes) 0ICAB-001-XTD Ordering Code (Tape) 0ICAB-001-XTP AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice Marketing Name AMIS 42671AGA 1 Package SOIC-8 GREEN Temp. Range -40°C…125°C AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 5.0 Block Diagram VCC AUTB 8 3 Thermal shutdown VCC TxD Slope Control 1 7 Driver control 6 Autobaud Control RxD 4 CANH CANL AMIS-42671 COMP Ri(cm) Vcc/2 + VREF 5 Ri(cm) 2 GND PC20070930.2 Figure 1: Block Diagram 6.0 Typical Application 6.1 Application Schematic VBAT IN 5V-reg 60 Ω OUT VCC CAN controller 47 nF VCC AUTB RxD TxD 3 8 4 7 AMIS42671 5 6 1 GND PC20071001.1 Figure 2: Application Diagram www.amis.com Specifications subject to change without notice 2 CANH VREF CAN BUS CANL 60 Ω 2 AMI Semiconductor – Oct. 07, Rev. 1.0 60 Ω GND 60 Ω 47 nF AMIS-42671 High-Speed CAN Transceiver For Long Networks 6.2 Pin Description 6.2.1. Pin Out (Top View) 1 GND 2 VCC 3 RxD 4 AMIS42671 TxD 8 AUTB 7 CANH 6 CANL 5 VREF PC20070929.1 Figure 3: Pin Configuration 6.3 Pin Description Table 2: Pin Out Pin Name 1 TxD 2 GND 3 VCC 4 RxD 5 VREF 6 CANL 7 CANH 8 AUTB Description Transmit data input; low input → dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter→ low output Reference voltage output Low-level CAN bus line (low in dominant mode) High-level CAN bus line (high in dominant mode) Autobaud mode control input; internal pull-down current AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 3 Data Sheet AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 7.0 Functional Description 7.1 Operating Modes The behavior of AMIS-42671 under various conditions is illustrated in Table 3 below. In case the device is powered, one of two operating modes can be selected through pin AUTB. Table 3: Functional table of AMIS-42671 when not connected to the bus; X = don’t care VCC pin TxD pin AUTB pin CANH pin CANL Bus state pin RxD 4.75 to 5.25.V 4.75 to 5.25.V 4.75 to 5.25.V VCC<PORL (unpowered) PORL<VCC<4.75V 0 X 1 (or floating) X >2V 0 (or floating) 1 X X X High VCC/2 VCC/2 0V<CANH<VCC 0V<CANH<VCC Low VCC/2 VCC/2 0V<CANL<VCC 0V<CANL<VCC Dominant Recessive Recessive Recessive Recessive 0 1 1 1 1 7.1.1. High-Speed Mode If pin AUTB is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized to give extremely low electromagnetic emissions. 7.1.2. Autobaud Mode If pin AUTB is pulled high, AMIS-42671 is in Autobaud mode. The transmitter is disabled while the receiver remains active. All other IC functions also continue to operate. Normal bus activity can be monitored at the RxD pin and transmit data on TxD is looped back to RxD without influencing the CAN communication. TxD CANH CANL RxD AUTB PC20071002.4 Figure 4: Simplified Schematic Diagram of Autobaud Function In Autobaud mode the local CAN controller is able to detect the used communication speed of other transmitting network nodes. Bus communication is received and via the RxD pin sent to the CAN controller. If the CAN controller operates at the wrong baud rate, it will transmit an error frame. This message will be looped back to the CAN controller which will increment its error counter. The CAN controller will be reset with another baud rate. When an error-free message is received, the correct baud rate is detected. A logic low may now be applied to pin AUTB, returning to the High-Speed Mode. 7.2 Over-temperature Detection A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes high. The thermal protection circuit is particularly necessary when a bus line short-circuits. AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 4 AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 7.3 High Communication Speed Range The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications. But also high speed communication is possible up to 1Mbit/s. 7.4 Fail-safe Features A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or negative supply voltage, although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 5). Pin TxD is pulled high internally should the input become disconnected. 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin; sourcing current means the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter VCC Supply voltage VCANH DC voltage at pin CANH VCANL DC voltage at pin CANL VTxD DC voltage at pin TxD VRxD DC voltage at pin RxD VAUTB DC voltage at pin AUTB VREF DC voltage at pin VREF Vtran(CANH) Transient voltage at pin CANH Vtran(CANL) Transient voltage at pin CANL Vesd Electrostatic discharge voltage at all pins Latch-up Tstg Tamb Tjunc Static latch-up at all pins Storage temperature Ambient temperature Maximum junction temperature Notes: 1. 2. 3. 4. Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit Note 1 Note 1 Note 2 Note 4 Note 3 Min. -0.3 -45 -45 -0.3 -0.3 -0.3 -0.3 -150 -150 -4 -500 -55 -40 -40 Max. +7 +45 +45 VCC + 0.3 VCC + 0.3 VCC + 0.3 VCC + 0.3 +150 +150 +4 +500 100 +155 +125 +150 Unit V V V V V V V V V kV V mA °C °C °C Value 150 45 Unit K/W K/W Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4). Standardized human body model ESD pulses in accordance to MIL883 method 3015.7. Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993. 8.3 Thermal Characteristics Table 5: Thermal Characteristics Symbol Parameter Rth(vj-a) Thermal resistance from junction to ambient in SO8 package Rth(vj-s) Thermal resistance from junction to substrate of bare die AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 5 Conditions In free air In free air AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 8.4 DC and Timing Characteristics VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise. Table 6: DC and Timing Characteristics Symbol Parameter Supply (Pin VCC) ICC Supply current Transmitter Data Input (Pin TxD) VIH High-level input voltage VIL Low-level input voltage IIH High-level input current IIL Low-level input current Ci Input capacitance Mode Select (Pin AUTB) VIH High-level input voltage VIL Low-level input voltage IIH High-level input current IIL Low-level input current Receiver Data Output (Pin RxD) VOH High-level output voltage VOL Low-level output voltage Reference Voltage Output (Pin VREF) VREF Reference output voltage VREF_CM Reference output voltage for full common mode range Bus Lines (Pins CANH and CANL) Vo(reces)(CANH) Recessive bus voltage at pin CANH Vo(reces)(CANL) Recessive bus voltage at pin CANL Io(reces) (CANH) Recessive output current at pin CANH Io(reces) (CANL) Recessive output current at pin CANL Vo(dom) (CANH) Vo(dom) (CANL) Vi(dif) (bus) Dominant output voltage at pin CANH Dominant output voltage at pin CANL Differential bus input voltage (VCANH - VCANL) Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Short circuit output current at pin CANH Short circuit output current at pin CANL Differential receiver threshold voltage Vihcm(dif) (th) Differential receiver threshold voltage for high common-mode Vi(dif) (hys) Differential receiver input voltage hysteresis Ri(cm)(CANH) Common-mode input resistance at pin CANH Common-mode input resistance at pin CANL Matching between pin CANH and pin CANL common-mode input resistance Differential input resistance Matching between pin CANH and pin CANL common-mode input resistance Differential input resistance Ri(cm) (CANL) Ri(cm)(m) Ri(dif) Ri(cm)(m) Ri(dif) AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice Conditions Min. Typ. Max. Unit 25 2 45 4 65 8 mA mA Output recessive Output dominant VTxD = VCC VTxD = 0V Not tested 2.0 -0.3 -1 -75 - 0 -200 5 VCC+0.3 +0.8 +1 -350 10 V V µA µA pF Autobaud mode High-speed mode VS =2V VS =0.8V 2.0 -0.3 20 15 30 30 VCC+0.3 +0.8 50 45 V V µA µA 0.6 x VCC 0.75 x VCC 0.25 Dominant; VTXD = 0V Recessive; VTXD = VCC IRXD = - 10mA IRXD = 6mA V 0.45 V 0.50 x VCC 0.50 x VCC 0.55 x VCC V 0.60 x VCC V 2.0 2.0 -2.5 2.5 2.5 - 3.0 3.0 +2.5 V V mA -2.5 - +2.5 mA 3.0 0. 5 1.5 3.6 1.4 2.25 4.25 1.75 3.0 V V V -120 0 +50 mV -45 45 0.5 -70 70 0.7 -95 120 0.9 mA mA V 0.25 0.7 1.05 V 50 70 100 mV 15 25 37 KΩ 15 25 37 KΩ VCANH =VCANL -3 0 +3 % VCANH =VCANL 25 -3 50 0 75 +3 KΩ % 25 50 75 KΩ -50µA < IVREF < +50µA 0.45 x VCC -35V <VCANH< +35V; -35V <VCANL< +35V 0.40 x VCC VTxD = VCC; no load VTxD = VCC; no load -35V <VCANH< +35V; 0V <VCC < 5.25V -35V <VCANL < +35V; 0V <VCC < 5.25V VTxD = 0V VTxD = 0V VTxD = 0V; dominant; 42.5 Ω < RLT < 60 Ω VTxD =VCC; recessive; No load VCANH = 0V; VTxD = 0V VCANL = 36V; VTxD = 0V -5V <VCANL < +10V; -5V <VCANH < +10V; See Figure 6 -35V <VCANL < +35V; -35V <VCANH < +35V; See Figure 6 -5V <VCANL < +10V; -5V <VCANH < +10V; See Figure 6 6 AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks Table 7: DC and Timing Characteristics (continued) Symbol Parameter Ci(CANH) Input capacitance at pin CANH Ci(CANL) Input capacitance at pin CANL Ci(dif) Differential input capacitance ILI(CANH) Input leakage current at pin CANH ILI(CANL) Input leakage current at pin CANL VCM-peak Common-mode peak during transition from dom → rec or rec → dom VCM-step Difference in common-mode between dominant and recessive state Power-on-Reset (POR) PORL POR level Conditions VTxD = VCC; not tested VTxD = VCC; not tested VTxD = VCC; not tested VCC = 0V; VCANH = 5V VCC = 0V; VCANL = 5V See Figure 9 and Figure 10 Min. See Figure 9 and Figure 10 -150 CANH, CANL, Vref in tristate below POR level Thermal Shutdown Tj(sd) Shutdown junction temperature Timing Characteristics (see Figure 7 and Figure 8) td(TxD-BUSon) Delay TxD to bus active td(TxD-BUSoff) Delay TxD to bus inactive td(BUSon-RxD) Delay bus active to RxD td(BUSoff-RxD) Delay bus inactive to RxD tpd(rec-dom) Propagation delay TxD to RxD from recessive to dominant td(dom-rec) Propagation delay TxD to RxD from dominant to recessive Typ. 7.5 7.5 3.75 170 170 10 10 -500 V 150 160 180 °C 40 30 25 65 70 Vs = 0V 100 VCC 7 1 nF AMIS42671 RxD CANH 1 5 Transient Generator 1 nF 4 6 2 8 20 pF VREF AUTB CANL PC20071002.1 GND Figure 5: Test Circuit for Transients VRxD High Low Hysteresis PC20040829.7 0,9 0,5 Figure 6: Hysteresis of the Receiver AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 7 mV 4.7 +5 V TxD 150 3.5 Vs = 0V Vs = 0V Vs = 0V Vs = 0V Vs = 0V 3 Unit pF pF pF µA µA mV 2.2 8.5 Measurement Set-ups and Definitions 100 nF Max. 20 20 10 250 250 500 Vi(dif)(hys) 85 60 55 100 130 105 105 135 245 ns ns ns ns ns 245 ns AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks +5 V 100 nF VCC 3 TxD 7 1 AMIS42671 RxD 4 RLT VREF CLT 100 pF 60 Ω 6 CANL 2 8 20 pF 5 CANH AUTB GND PC20071002.3 Figure 7: Test Circuit for Timing Characteristics HIGH LOW TxD CANH CANL dominant Vi(dif) = VCANH - VCANL 0,9V 0,5V recessive RxD td(TxD-BUSon) tpd(rec-dom) 0,7 x VCC 0,3 x VCC td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) Figure 8: Timing Diagram for AC Characteristics AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 8 td(BUSoff-RxD) PC20040829.6 AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks +5 V 100 nF VCC 3 TxD 7 Active Probe AMIS42671 CANL 6 6.2 kΩ 4 5 2 8 20 pF 10 nF 1 Generator RxD 6.2 kΩ CANH AUTB 30 Ω VREF Spectrum Anayzer 30 Ω 47 nF GND PC20071002.2 Figure 9: Basic Test Set-up for Electromagnetic Measurement CANH CANL recessive Vi(com) = VCANH + VCANL VCM-step VCM-peak VCM-peak PC20040829.7 Figure 10: Common-mode Voltage Peaks (see measurement set-up Figure 9) AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 9 AMIS-42671 High-Speed CAN Transceiver For Long Networks 9.0 Package Outline SOIC-8: Plastic small outline; eight leads; body width 150mil AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 10 Data Sheet AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 10.0 Soldering 10.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used. 10.2 Re-flow Soldering Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds, depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C. 10.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results: • Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board. o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to ten seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C. Table 8: Soldering Soldering Method Wave Not suitable Not suitable (2) Suitable Not recommended (3)(4) Not recommended (5) Package BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC (3) , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes: 1. 2. 3. 4. 5. Reflow (1) Suitable Suitable Suitable Suitable Suitable All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.” These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 11 AMIS-42671 High-Speed CAN Transceiver Data Sheet For Long Networks 11.0 Company or Product Inquiries For more information about AMI Semiconductor’s high-speed Industrial CAN transceivers, visit our Web site at: http://www.amis.com 12.0 Document History Date October 2007 Revision 1.0 Change Initial release Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc. AMI Semiconductor – Oct. 07, Rev. 1.0 www.amis.com Specifications subject to change without notice 12