INTEGRATED CIRCUITS DATA SHEET TJA1050 High speed CAN transceiver Preliminary specification File under Integrated Circuits, IC18 1999 Sep 27 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 FEATURES GENERAL DESCRIPTION • Fully compatible with the “ISO 11898” standard The TJA1050 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. • High speed (up to 1 Mbaud) • Transmit Data (TXD) dominant time-out function • Bus lines protected against transients in an automotive environment • Silent mode in which the transmitter is disabled The TJA1050 is the successor to the PCA82C250 high speed CAN transceiver. The most important improvements are: • Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI) • Much lower ElectroMagnetic Emission (EME) due to optimal matching of the CANH and CANL output signals • Input levels compatible with 3.3 V devices • Improved behaviour in case of an unpowered node. • Thermally protected • Short-circuit proof to battery and ground • An unpowered node does not disturb the bus lines • At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage VCANH DC voltage at CANH VCANL DC voltage at CANL Vi(dif)(bus) differential bus input voltage dominant 1.5 3 V tPD(TXD-RXD) propagation delay TXD to RXD; see Fig.4 VS = 0 V − 250 ns Tamb operating ambient temperature −40 +125 °C 0 < VCC < 5.25 V; no time limit 4.75 5.25 V −27 +40 V ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TJA1050T SO8 TJA1050U − 1999 Sep 27 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT96-1 − bare die 2 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 BLOCK DIAGRAM VCC handbook, full pagewidth S 3 8 60 µA VCC GND TEMPERATURE PROTECTION 200 µA TXD TXD DOMINANT TIME-OUT TIMER 1 DRIVER 7 VCC RXD 4 RECEIVER 0.5VCC 25 kΩ GND GND 6 Vref CANH 25 kΩ 5 REFERENCE VOLTAGE CANL TJA1050 2 MGS374 GND Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input; reads in data from the CAN controller to the bus line drivers GND 2 ground VCC 3 supply voltage GND 2 RXD 4 receive data output; reads out data from the bus lines to the CAN controller VCC RXD Vref 5 reference voltage output CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line S 8 select input for high speed mode/silent mode 1999 Sep 27 handbook, halfpage TXD 1 8 S 7 CANH 3 6 CANL 4 5 Vref TJA1050T MGS375 Fig.2 Pin configuration. 3 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 Control line S (pin 8) allows two operating modes to be selected; high speed mode or silent mode. FUNCTIONAL DESCRIPTION The TJA1050 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high speed automotive applications using baud rates from 40 kbaud up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the “ISO 11898” standard. High speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is unconnected. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative battery voltage, although power dissipation increases during this fault condition. A ‘TXD Dominant Time-out’ timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on TXD. If the duration of the LOW-level on TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on TXD. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 165 °C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. The CANH and CANL lines are protected from automotive electrical transients (according to “ISO 7637”; see Fig.6) and are also protected from Electro-Static-Discharge (ESD) of up to 4 kV from the human body. Table 1 Function table of the CAN transceiver (X = don’t care) VCC TXD S CANH CANL 4.75 to 5.25 V 0 0 (or floating) HIGH LOW dominant 0 BUS STATE RXD 4.75 to 5.25 V X 1 0.5 × VCC 0.5 × VCC recessive 1 4.75 to 5.25 V 1 (or floating) X 0.5 × VCC 0.5 × VCC recessive 1 <2 V (not powered) X X 0 V <CANH< VCC 0 V <CANL< VCC recessive X 2 V < VCC < 4.75 V >2 V X 0 V <CANH< VCC 0 V <CANL< VCC recessive X 1999 Sep 27 4 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are referenced to GND (pin 2). Positive currents flow into the IC. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT −0.3 +5.25 V −27 +40 V −0.3 VCC + 0.3 V time limit is 1 µs −55 +55 V note 1 −200 +200 V VCC supply voltage VCANL, VCANH DC voltage at CANL and CANH VTXD, VRXD, Vref and VS DC voltage at TXD, RXD, Vref and S Vtrt(CANH), Vtrt(CANL) transient voltage at CANH and CANL Vesd electrostatic discharge at CANH; CANL note 3 −4 +4 kV electrostatic discharge at TXD; VCC; RXD; Vref and S note 3 −2 +2 kV electrostatic discharge at all pins note 4 −200 +200 V 0 < VCC < 5.25 V; no time limit Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +125 °C Tj junction temperature −40 +150 °C note 2 Notes 1. The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b, (see Fig.6). 2. In accordance with “IEC 747-1”. An alternative definition of Tj is: Tj = Tamb + P × Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tj. The rating for Tj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 3. Human body model; C = 100 pF R = 1.5 kΩ. 4. Machine model; C = 200 pF R = 25 Ω. THERMAL CHARACTERISTICS According to IEC 747-1. SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient; TJA1050T(SO8) CONDITIONS in free air QUALITY SPECIFICATION Quality specification “SNW-FQ-611 part D” is applicable. 1999 Sep 27 5 VALUE UNIT 160 K/W Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 CHARACTERISTICS VCC = 4.75 to 5.25 V; Tamb = −40 to +125 °C; RL = 60 Ω unless specified otherwise; all voltages are referenced to GND (pin 2); positive currents flow into the IC; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at Tamb = 25 °C unless specified otherwise. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (VCC) ICC supply current dominant; VTXD = 0 V tbf − 75 mA recessive; VTXD = VCC tbf − 13 mA Transmitter data input (TXD) VIH HIGH-level input voltage output recessive 2.0 − VCC + 0.3 V VIL LOW-level input voltage output dominant −0.3 − +0.8 V IIH HIGH-level input current VTXD = VCC −30 0 +30 µA IIL LOW-level input current VTXD = 0 V −100 −200 −300 µA Ci(TXD) TXD input capacitance not tested − − tbf pF Mode select input (S) VIH HIGH-level input voltage silent mode 2.0 − VCC + 0.3 V VIL LOW-level input voltage high speed mode −0.3 − +0.8 V IIH HIGH-level input current VS = VCC 30 60 100 µA IIL LOW-level input current VS = 0 V −30 0 +30 µA Receiver data output (RXD) IOH HIGH-level output current VRXD = 0.7 VCC tbf tbf tbf mA IOL LOW-level output current VRXD = 0.45 V 2 8.5 20 mA reference output voltage −50 µA < IVref < 50 µA 0.45VCC 0.5VCC 0.55VCC V VTXD = VCC; no load 2.0 − 3.0 V Io(CANH)(reces); recessive output current Io(CANL)(reces) −27 V < VCANH, VCANL < 32 V; 0 V < VCC < 5.25 V −2.5 − +2.5 mA Vo(CANH) CANH dominant output voltage VTXD = 0 V 2.8 − 4.5 V Vo(CANL) CANL dominant output voltage 0.5 − 2.0 V Vi(dif)(bus) differential bus input voltage (VCANH − VCANL) VTXD = 0 V; 42.5 < RL < 60 Ω (dominant) 1.5 − 3.0 V VTXD = VCC; no load (recessive) −500 − +50 mV Vref Vref Bus lines (CANH; CANL) VCANH(reces); VCANL(reces) recessive bus voltage Io(sc)(CANH) CANH short-circuit output current VCANH = 0 V; VTXD = 0 V −35 − −95 mA Io(sc)(CANL) CANL short-circuit output current VCANL = 36 V; VTXD = 0 V 35 − 150 mA 1999 Sep 27 6 Philips Semiconductors Preliminary specification High speed CAN transceiver SYMBOL PARAMETER TJA1050 CONDITIONS MIN. TYP. MAX. UNIT Vdif(th) differential receiver threshold −12 V < VCANH, 0.5 voltage VCANL < 12 V; see Fig.5 0.7 0.9 V Vi(dif)(hys) differential receiver input voltage hysteresis 100 − 200 mV Ri(cm)(CANH); Ri(cm)(CANL) CANH; CANL common mode input resistance 10 25 50 kΩ Ri(cm)(m) matching between CANH and CANL common mode input resistance VCANH = VCANL −3 − +3 % 20 50 100 kΩ VTXD = VCC; not tested − − 20 pF − − 10 pF − − 500 µA 155 165 180 °C tbf tbf 150 ns tbf tbf 100 ns Ri(dif) differential input resistance Ci(CANH); Ci(CANL) CANH; CANL input capacitance Ci(dif) differential input capacitance ILI(CANH); ILI(CANL) CANH; CANL input leakage current see Fig.5 VCC = 0 V; VCANH = VCANL = 5 V Thermal shutdown Tj(sd) shutdown junction temperature Timing characteristics (see Figs 3 and 4) td(TXD-BUSon) delay TXD to bus active td(TXD-BUSoff) delay TXD to bus inactive td(BUSon-RXD) delay bus active to RXD td(BUSoff-RXD) delay bus inactive to RXD 1999 Sep 27 VS = 0 V 7 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 TEST AND APPLICATION INFORMATION + 5 V halfpage handbook, 47 µF 100 nF VCC TXD Vref RXD 3 1 5 7 RL 60 Ω TJA1050 6 4 2 15 pF CANH CL 100 pF CANL 8 GND S MGS376 Fig.3 Test circuit for timing characteristics. handbook, full pagewidth HIGH TXD LOW CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD 0.3VCC t d(TXD-BUSon) 0.7VCC LOW t d(TXD-BUSoff) t d(BUSon − RXD) (1) Vi(dif)(bus) = VCANH − VCANL t d(BUSoff − RXD) t PD(TXD − RXD) t PD(TXD − RXD) Fig.4 Timing diagram for AC characteristics. 1999 Sep 27 8 MGS377 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 MGS378 handbook, full pagewidth VRXD HIGH LOW hysteresis 0.5 0.9 Vi(dif)(bus) Fig.5 Hysteresis of the receiver. handbook, full pagewidth +5 V 47 µF 100 nF VCC TXD Vref RXD 3 1 5 7 1 nF TRANSIENT GENERATOR TJA1050 6 4 2 15 pF CANH CANL 1 nF 8 GND MGS379 S The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b. Fig.6 Test circuit for automotive transients. 1999 Sep 27 9 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 +5 V handbook, full pagewidth 47 µF 120 Ω 100 nF VCC TXD TX0 3 1 7 SJA1000 Vref CAN CONTROLLER RXD RX0 5 CANH CAN BUS LINE TJA1050 6 CANL 4 2 8 GND S 120 Ω MGS380 Fig.7 Application information. BONDING PAD LOCATIONS FOR TJA1050U Table 2 Bonding pad locations All x/y coordinates represent the position of the centre of each pad (in µm) with respect to x/y = 0 of the die (see Fig.8). COORDINATES SYMBOL 8 handbook, halfpage 7 6 5 TJA1050U test pad x 0 1 0 y 2 3 4 MGS381 Fig.8 Bonding pad locations. 1999 Sep 27 10 PAD x y TXD 1 103 103 GND 2 740.5 85 VCC 3 886.5 111 RXD 4 1371.5 111 Vref 5 1394 1094 CANL 6 1006 1111 CANH 7 542.5 1111 S 8 103 1097 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1999 Sep 27 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 11 o 8 0o Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 1999 Sep 27 12 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Sep 27 13 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 1999 Sep 27 14 Philips Semiconductors Preliminary specification High speed CAN transceiver TJA1050 NOTES 1999 Sep 27 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 285002/01/pp16 Date of release: 1999 Sep 27 Document order number: 9397 750 05732