AMI AMIS

AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
1.0 General Description
The new AMIS-41682 and AMIS-41683 are interfaces between the protocol controller and the physical wires of the bus lines in a
control area network (CAN). AMIS-41683 is identical to the AMIS-41682 but has a true 3.3V digital interface to the CAN controller.
The device provides differential transmit capability but will switch in error conditions to a single-wire transmitter and/or receiver.
Initially it will be used for low speed applications, up to 125kBaud, in passenger cars.
Both AMIS-41682 and AMIS-41683 are implemented in I2T100 technology enabling both high-voltage analog circuitry and digital
functionality to co-exist on the same chip.
These products consolidate the expertise of AMIS for in-car multiplex transceivers and support together with AMIS-30522 (VAN),
AMIS-30660 and AMIS-30663 (CAN High Speed) and AMIS-30600 (LIN) another widely used physical layer.
2.0 Key Features
• Fully compatible with ISO11898-3 standard
• Optimized for in-car low-speed communication
o Baud rate up to 125kBaud
o Up to 32 nodes can be connected
o Due to built-in slope control function and a very good matching of the CANL and CANH bus outputs, this device realizes a
very low electromagnetic emission (EME)
o Fully integrated receiver filters
o Permanent dominant monitoring of transmit data input
o Differential receiver with wide common-mode range for high electromagnetic susceptibility (EMS) in normal- and low-power
modes
o True 3.3V digital I/O interface to CAN controller for AMIS-41683 only
• Management in case of bus failure
o In the event of bus failures, automatic switching to single-wire mode, even when the CANH bus wire is short circuited to
VCC
o The device will automatically reset to differential mode if the bus failure is removed
o During failure modes there is full wake-up capability.
o Un-powered nodes do not disturb bus lines
o Bus errors and thermal shutdown activation is flagged on ERRB pin
• Protection issues
o Short circuit proof to battery and ground
o Thermal protection
o The bus lines are protected against transients in an automotive environment
o An un-powered node does not disturb the bus lines
• Support for low power modes
o Low current sleep and standby mode with wake-up via the bus lines
o Power-on flag on the output
o Two-edge sensitive wake-up input signal via pin WAKEB
• IOs
o The un-powered chip cannot be parasitically supplied either from digital inputs nor from digital outputs.
3.0 Technical Characteristics
Table 1: Technical Characteristics
Symbol
Parameter
VCANH
DC voltage at pin CANH, CANL
Vbat
Voltage at pin Vbat
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Conditions
0 < VCC < 5.25V; no time limit
Load-dump
1
Min
-40
Max
+40
+40
Unit
V
V
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
4.0 Ordering Information
Table 2: Ordering information
Marketing Name
AMIS41682NGA
AMIS41683NGA
Package
SOIC-14 GREEN
SOIC-14 GREEN
Temp.Range
-40°C…125°C
-40°C…125°C
5.0 Block Diagram
VBAT
INH
VCC
14
1
10
Vcc (*)
POR
STB
EN
WAKE
Mode &
wake-up
control
5
6
9
7
Vcc (*)
TxD
GND
ERR
11
Thermal
shutdown
Driver
control
8
2
Timer
13
4
Failure
handling
Receiver
RxD
12
Filter
3
AMIS-4168x
(*) For AMIS-41682 pull up to Vcc.
For AMIS-41683 pull up to Vcc/2
AMIS-41683
AMIS-41682
VCC
ERR
4
Failure
handling
VCC
RxD
3
ERR
RxD
4
Failure
handling
3
PC20050610.3
Figure 1: Block Diagram
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2
RTL
CANH
CANL
RTH
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
6.0 Typical Application Schematic
6.1. Application Schematic
OUT
5V-reg
IN
VBAT
*
VCC INH
VCC
VBAT
1
10
WAKE
14
EN 6
ERR 4
CAN
controller
STB
RxD
7
9
12
AMIS-41682
5
11
3
TxD 2
8
13
GND
RTL
CANL
CANH
RTH
GND
* optional
CAN BUS LINE
PC20050610.1
Figure 2: Application Diagram AMIS-41682
OUT
OUT
3.3Vreg
IN
5V-reg
IN
VBAT
*
4.7 kΩ
4.7 kΩ
VCC
VCC INH
10
VBAT
1
14
EN 6
ERR 4
3.3V CAN
controller
STB
RxD
AMIS-41683
5
11
3
13
CANL
CANH
8 RTH
CAN BUS LINE
PC20050610.2
Figure 3: Application Diagram AMIS-41683
AMI Semiconductor – Rev. 2.0 – Feb. 07
RTL
GND
GND
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9
12
TxD 2
* optional
WAKE
7
3
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
6.2. Pin Description
6.2.1. Pin Out (top view)
1
TxD
2
RxD
3
ERR
4
STB
5
EN
6
WAKE
7
AMIS-4168x
INH
14
VBAT
13
GND
12
CANL
11
CANH
10
VCC
9
RTL
8
RTH
PC20041029.1
Figure 4: Pin Configuration
6.2.2. Pin Description
Table 3: Pin Description
Pin
Name
Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
INH
TxD
RxD
ERR-B
STB-B
EN
WAKEB
RTH
RTL
Vcc
CANH
CANL
GND
BAT
Inhibit output for external voltage regulator
Transmit data input; internal pull-up current
Receive data output
Error; wake-up and power-on flag; active low
Standby digital control input; active low; pull-down resistor
Standby digital control input; active high; pull-down resistor
Enable digital control input; falling and rising edges are both detected
Pin for external termination resistor at CANH
Pin for external termination resistor at CANL
5V supply input
Bus line; high in dominant state
Bus line; low in dominant state
Ground
Battery supply
Functional description and characteristics are made for AMIS-41682 but are also valid for AMIS-41683.
between the two devices will be explicitly mentioned in text.
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4
Differences
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
7.0 Functional Description
7.1. Description
AMIS-41682 is a fault tolerant CAN transceiver which works as an interface between the CAN protocol controller and the physical
wires of the CAN bus (see Figure 2). It is primarily intended for low speed applications, up to 125kBaud, in passenger cars. The
device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller.
The AMIS-41683 has open-drain outputs (RXD and ERR-B pins) that allow the user to use external pull-up resistors to the required
supply voltage; this can be 5V or 3.3V.
To reduce EME, the rise and fall slope are limited. Together with matched CANL and CANH output stages, this allows the use of
an unshielded twisted pair or a parallel pair of wires for the bus lines.
The failure detection logic automatically selects a suitable transmission mode, differential or single-wire transmission. Together
with the transmission mode, the failure detector will configure the output stages in such a way that excessive currents are avoided
and that the circuit returns to normal operation when the error is removed.
A high common-mode range for the differential receiver guarantees reception under worst case conditions and together with the
integrated filter the circuit realizes an excellent immunity against EMS. The receivers connected to pins CANH and CANL have
threshold voltages that ensure a maximum noise margin in single-wire mode.
A timer has been integrated at pin TXD. This timer prevents the AMIS-41682 from driving the bus lines to a permanent dominant
state.
7.2. Failure Detector
The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to
the appropriate mode. The different wiring failures are depicted in Figure 5. The figure also indicates the effect of the different
wiring failures on the transmitter and the receiver. The detection circuit itself is not depicted.
The differential receiver threshold voltage is typically set at 3V (VCC = 5V). This ensures correct reception with a noise margin as
high as possible in the normal operating mode and in the event of failures 1, 2, 4, and 6a. These failures, or recovery from them,
do not destroy ongoing transmissions. During the failure, reception is still done by the differential receiver and the transmitter stays
fully active.
To avoid false triggering by external RF influences the single-wire modes are activated after a certain delay time. When the bus
failure disappears for another time delay, the transceiver switches back to differential mode. When one of the bus failures 3, 5, 6,
6a, and 7 is detected, the defective bus wire is disabled by switching off the affected bus termination and the respective output
stage. A wake-up from sleep mode via the bus is possible either via a dominant CANH or CANL line. This ensures that a wake-up
is possible even if one of the failures 1 to 7 occurs. If any of the wiring failure occurs, the output signal on pin ERRB will become
low. On error recovery, the output signal on pin ERRB will become high again.
During all single-wire transmissions, the EMC performance (both immunity and emission) is worse than in the differential mode.
The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a
compromise between propagation delay and HF suppression. In the single-wire mode, LF noise cannot be distinguished from the
required signal.
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5
AMIS-4168x Fault Tolerant CAN Transceiver
Failure 1 : CANH wire interrupted
Failure 4 : CANL shorted to Gnd
Vbat Vcc
Vbat Vcc
RTL
RTL
RTL
0.6Vcc
RxD
CANL
CANL
CANH
CANH
ERR
CD
RxD
RxD
CH
ERR
CANL
CANL
CANH
CANH
ERR
0.6Vcc
CD
RxD
RxD
CH
ERR
CANH
CANH
RTL
CANL
CANL
CANH
CANH
ERR
CD
RxD
ERR
CANL
CANL
CANH
CANH
ERR
0.4Vcc
RTH
RTH
Vbat Vcc
RTL
CANL
CANL
CANH
CANH
0.6Vcc
CD
TxD
RxD
RxD
CH
ERR
RTH
CANL
CANH
CANH
Vbat Vcc
RTL
TxD
CL
CANL
CANH
CANH
ERR
CD
RxD
CH
RxD
CH
RTH
Error-detection: dominant longer then Tnd_f7
Failure 5 : CANH shorted to Gnd
0.6Vcc
CD
0.4Vcc
RTH
Error-detection: CANH >2V longer then Tnd_f3
TxD
CL
CANL
ERR
0.4Vcc
CANL
RTL
TxD
CL
ERR
0.4Vcc
RTH
Error-detection: CL = CH more then 4 pulses
Figure 5: Different Types of Wiring Failure
AMI Semiconductor – Rev. 2.0 – Feb. 07
ERR
Failure 7 : CANH shorted to CANL
ERR
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RxD
CH
Error-detection: CL = CH more then 4 pulses
RTL
GND
TxD
CD
0.4Vcc
RTH
0.6Vcc
RTH
RTL
CL
RxD
CH
Failure 3a : CANH shorted to Vcc
Vcc
Vbat Vcc
RxD
Vcc
0.6Vcc
TxD
Error-detection: CANH > 2V longer then Tnd_f3
TxD
ERR
RTH
TxD
CL
RTL
CH
Failure 6a : CANL shorted to Vcc
RTL
Vcc
RxD
0.4Vcc
Vbat Vcc
RTH
TxD
CD
Error-detection: CANL>7V
0.6Vcc
RxD
CANL
RTH
Vbat Vcc
TxD
CANL
ERR
Failure 3 : CANH shorted to Vbat
RTL
ERR
CL
TxD
RTH
Vbat
CH
RTL
RTL
Error-detection: CL = CH more then 4 pulses
RTH
RxD
RTH
TxD
0.4Vcc
RTL
CD
Failure 6 : CANL wire shorted to Vbat
Vbat Vcc
Vbat
CL
RxD
CANH
Error-detection: dominant longer then Tnd_f4
0.6Vcc
TxD
CANH
RTH
RTL
RTH
CANL
0.4Vcc
RTH
Vbat Vcc
RxD
CANL
ERR
Failure 2 : CANL wire interrupted
TxD
TxD
CL
Error-detection: CL = CH more then 4 pulses
RTL
RTL
0.6Vcc
TxD
0.4Vcc
RTH
GND
TxD
CL
TxD
Data Sheet
6
ERR
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
7.3. Low Power Modes
The transceiver provides three low power modes that can be entered and exited via pins STBB and EN (see Figure 6). (Go-tosleep mode is only a transition mode.)
The sleep mode is the mode with the lowest power consumption. Pin INH is switched to high-impedance for deactivation of the
external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided, pins RXD and
ERRB will signal the wake-up interrupt signal.
The standby mode will react the same as the sleep mode but with a high-level on pin INH.
The power-on standby mode is the same as the standby mode with the battery power-on flag instead of the wake-up interrupt
signal on pin ERRB. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag.
Wake-up request is detected by the following events:
o Local wake-up: Rising or falling edge on input WAKEB (Levels maintained for a certain period).
o Remote wake-up from CAN bus : A message with five consecutive dominant bits.
On a wake-up request the transceiver will set the output on pin INH high which can be used to activate the external supply voltage
regulator. Note: Pin INH is also set similar as an after wake up event by VBAT voltage being below the battery power on flag level.
See FLAG_VBAT in Table 6)
If VCC is provided, the wake-up request can be read on the ERR-B or RXD outputs so the external microcontroller can wake-up
the transceiver (switch to normal operating mode) via pins STB-B and EN.
In the low power modes the failure detection circuit remains partly active to prevent increased power consumption in the event of
failures 3, 3a, 4, and 7.
The go-to-sleep-mode is only a transition mode. The pin INH stays active for a limited time. During this time the circuit can still go
to another low-power mode. After this time the circuit goes to the sleep-mode. In case of a wake up request (from BUS or WAKEB
pin) during this transition time, the wake up request ha higher priority than go-to-sleep and INH will not be deactivated.
Once VCC is below the threshold level of LAG_Vcc , the signals on pins STB-B and EN will internally be set to low-level to provide
fail safe functionality.
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AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
Power-On Stand-by
STB
EN
High Low
EN change state
INH
ERR
RxD RTL
Act
PORflag
WUint
Vbat
EN, STB change state
STB change state
Normal Mode
STB
EN
High High
INH
ERR
Act
Errflag
GoTo Sleep Mode
STB change state
RxD RTL
Rec.
out
STB
Vcc
EN
Low High
EN, STB change state
INH
ERR
RxD RTL
Act
2)
WUint
WUint
Vbat
Time-out GoToSleep mode
EN change state
Sleep Mode
Standby Mode
STB
Low
EN
Low
INH
ERR
RxD RTL
Act
WUint
WUint
Vbat
STB
Local or Remote
Wake-up 3)
Power-On
1) Only when Vcc > POR_Vcc
2) INH active for a time = T_GoToSleep
3) Local Wake-up through pin Wake which change state
for a time > T_wake_min
Remote Wake-up through pin CANL or CANH when
dominant for a time >TCANH_min or TCANL_min
4) Mode Change through pins STB and EN is only
possible if Vcc > POR_Vcc
Low
EN
Low
INH
ERR
RxD RTL
Hz
WUint 1)
WUint 1)
Vbat
Mode Change 4)
Figure 6: Low Power Modes
7.4. Power-on
After power-on (VBAT switched on) the signal on pin INH will become high and an internal power-on flag will be set. This flag can
be read in the power-on standby mode via pin ERRB (STB-B = 1; EN = 0) and will be reset by entering the normal operating mode.
7.5. Protections
A current limiting circuit protects the transmitter output stages against short circuit to positive and negative battery voltage. If the
junction temperature exceeds a maximum value, the transmitter output stages are disabled and flagged on ERRB pin. Because the
transmitter is responsible for the major part of the power dissipation, this will result in reduced power dissipation and hence a lower
chip temperature. All other parts of the IC will remain operating.
The pins CANH and CANL are protected against electrical transients that may occur in an automotive environment.
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AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
8.0 Electrical Characteristics
8.1. Definitions
All voltages are referenced to GND (pin 13). Positive currents flow into the IC. Sinking current means that the current is flowing into
the pin. Sourcing current means that the current is flowing out of the pin.
8.2. Absolute Maximum Ratings
Stresses above those listed in this clause may cause permanent device failure. Exposure to absolute maximum ratings for
extended periods may effect device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
VCC
Supply voltage on pin VCC
-0.3
+6
V
VBAT
Battery voltage on pin BAT
-0.3
+40
V
Vdig
DC voltage on pins EN, STB-B, ERR-B, TxD, RxD
-0.3
VCC + 0.3
V
VCANH-L
DC voltage on pin CANH, CANL
-40
+40
V
Vtran-CAN
Transient voltage on pins CANH and CANL (Figure 11) note 1
-350
+350
V
VWAKE
DC input voltage on pin WAKE
-40
+40
V
VINH
DC output voltage on pin INH
-0.3
VBAT + 0.3
V
VRTH-L
DC voltage on pin RTH , RTL
-40
40
V
RRTH
Termination resistance on pin RTH
500
16000
Ω
RRTL
Termination resistance on pin RTL
500
16000
Ω
Tjunc
Maximum junction temperature
-40
+150
ºC
Electrostatic discharge voltage (CANH- and CANL pin) HBM; note 2
-6
+6
kV
Electrostatic discharge voltage (other pins) HBM; note 2
-3.0
+3.0
kV
Electrostatic discharge voltage; machine model; note 3
-500
+500
V
Vesd
Notes:
1.
The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. Class C operation
2.
Equivalent to discharging a 100pF capacitor through a 1.5kOhm resistor.
3.
Equivalent to discharging a 200pF capacitor through a 10Ohm resistor and a 0.75µH coil.
8.3. Thermal Characteristics
Table 5: Thermal Characteristics
Symbol
Parameter
Conditions
Value
Unit
Rth(vj-a)
Thermal resistance from junction to ambient in SSOP14 package (2 layer PCB)
In free air
140
K/W
Rth(vj-s)
Thermal resistance from junction to substrate of bare die
In free air
30
K/W
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AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
8.4. Characteristics
VCC = 4.75V to 5.25V; VBAT = 5V to 36V; Tjunc = −40°C to +150°C; unless otherwise specified.
Table 6: Characteristics AMIS-4168x
Symbol
Parameter
Supplies Vcc Vbat
ICC
Supply current
LAG_Vcc
Forced low power mode
IBAT
Battery current on pin BAT
ICC+ IBAT
Supply current plus battery current
ICC+ IBAT
Supply current plus battery current
FLAG_VBAT
Power-on flag-level for pin Vbat
Pins STB-B, EN and TXD
R-PD
Pull-down resistor at pin EN and STB-B
T_Dis_TxD
Dominant time-out for TxD
T_GoToSleep
Minimum hold-time for Go-To-Sleep mode
Pin WAKE-B
IIL
Low-level input current
Vth(WAKE)
Wake-up threshold voltage
T_Wake_Min
Minimum time on pin wake (debounce time)
Pin INH
Delta_VH
I_leak
High-level voltage drop
Leakage current
Table 7: Characteristics AMIS-41682 (5V version)
Symbol
Parameter
Pins STB-B, EN and TXD
VIH
High-level input voltage
VIL
Low-level input voltage
I-PU-H
High-level input current pin TXD
I-PU-L
Low-level input current pin TXD
Pins RXD and ERR-B
VOH
High-level output voltage
VOL
Low-level output voltage
Table 8: Characteristics AMIS-41683 (3.3V version)
Symbol
Parameter
Pins STB-B, EN and TXD
VIH
High-level input voltage
VIL
Low-level input voltage
I-PU-H
High-level input current pin TXD
Pins RXD and ERR-B
VOL
Low-level output voltage open drain
I_leak
Leakage when driver is off
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Conditions
Min.
Typ.
Max.
Unit
1
3.7
6.3
mA
1
8
12
mA
4.5
V
V
110
230
µA
30
60
µA
80
µA
2.1
2.4
1
V
V
360
600
4
50
KΩ
ms
µs
-1
3.9
µA
V
38
µs
0.8
1
V
µA
Max.
Unit
TXD = 0.7 * Vcc
TXD = 0.3 * Vcc
0.7 x Vcc
-0.3
-10
-80
6.0
0.3 x Vcc
-200
-800
V
V
µA
µA
lsource = -1mA
Isink = 1.6mA
Isink = 7.5mA
VCC - 0.9
0
0
VCC
0.4
1.5
V
V
V
Max.
Unit
6.0
0.8
V
V
µA
0.4
1
V
µA
Normal operating mode;
VTXD = VCC (recessive)
Normal operating mode;
VTXD = 0V (dominant); no load
VCC rising
VCC falling
In all modes of operation;
500Ω between RTL - CANL
500Ω between RTH - CANH
VBAT = WAKE = INH = 5 to 36V
Low power modes; Vcc = 5V;
Tamb = -40°C to 100°C
VBAT = WAKE = INH = 5 to 36V
Low power modes; Vcc = 5V;
Tamb = 100°C to 150°C
VBAT = WAKE = INH = 5 to 36V
For setting power-on flag
For not setting power-on flag
2.45
10
3.5
1V
Normal mode; VtxD = 0V
190
0.75
5
VWAKE = 0V; VBAT = 27V
VSTB-B = 0V
VBAT = 12V; low power mode; for
rising and falling edge
-10
2.5
3.2
7
IINH = 0.18mA
Sleep mode; VINH = 0V
Conditions
Conditions
Min.
Min.
Typ.
Typ.
2
-0.3
TXD = 2V
lsink = 3.2mA
VERR-B = VRXD = 5V
10
-10
AMIS-4168x Fault Tolerant CAN Transceiver
Table 9: Characteristics AMIS-4168x continued
Symbol
Parameter
Conditions
Pins CANH and CANL (Receiver)
Vdiff
Differential receiver
No failures and bus failures 1, 2, 4, and 6a;
threshold voltage
see Figure 5
VCC = 5V
VCC = 4.75V to 5.25V
VseCANH
Single-ended receiver
Normal operating mode and failures 4, 6 and 7
threshold voltage on pin
VCC = 5V
CANH
VCC = 4.75 to 5.25V
VseCANL
Single-ended receiver
Normal operating mode and failures 3 and 3a
threshold voltage on pin
VCC = 5V
CANL
VCC = 4.75 to 5.25V
Detection threshold voltage
Vdet(CANL)
Normal operating mode
for short circuit to battery
voltage on pin CANL
Wake-up threshold voltage
Vth(wake)
On pin CANL
Low power modes
On pin CANH
Low power modes
Difference of wake-up
DVth(wake)
Low power modes
Threshold voltages
Pins CANH and CANL (Transmitter)
VO(reces)
Recessive output voltage
VTXD = VCC
On pin CANH
RRTH < 4kΩ
On pin CANL
RRTL < 4kΩ
VO(dom)
Dominant output voltage
VTXD = 0V; VEN = VCC
On pin CANH
ICANH = -40mA
On pin CANL
ICANL = 40mA
Normal operating mode;
VCANH = 0V; VTXD = 0V
IO(CANH)
Output current on pin CANH
Low power modes;
VCANH = 0V; VCC = 5V
Normal operating mode;
IO(CANL)
Output current on pin CANL VCANL = 14V; VTXD = 0V
Low power modes; VCANL = 12V; VBAT = 12V
Pins RTH and RTL
Switch-on resistance
Rsw(RTL)
Normal operating mode; I(RTL)> -10mA
between pin RTL and VCC
Switch-on resistance
Rsw(RTH)
between pin RTH and
Normal operating mode; I(RTH)< 10mA
ground
VO(RTH)
Output voltage on pin RTH
Low power modes; IO = 1mA
IO(RTL)
Output current on pin RTL
Low power modes; VRTL = 0V
Normal operating mode and failures 4, 6 and 7;
Ipu(RTL)
Pull-up current on pin RTL
VRTL= 0V
Pull-down current on pin
Normal operating mode and failures 3 and 3a
Ipd(RTH)
RTH
Thermal Shutdown
Tj
Junction temperature
For shutdown
AMI Semiconductor – Rev. 2.0 – Feb. 07
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11
Data Sheet
Min.
Typ.
Max.
Unit
-3.25
0.65 x Vcc
-3
0.6 x Vcc
-2.75
0.55 x Vcc
V
V
1.6
0.32 x Vcc
1.775
0.355 x Vcc
1.95
0.39 x Vcc
V
V
3
0.61 x Vcc
3.2
0.645 x Vcc
3.4
0.68 x Vcc
V
V
6.5
7.3
8
V
2.5
1.1
3.2
1.8
3. 9
2.25
V
V
0.8
1.4
V
0.2
Vcc - 0.2
Vcc - 1.4
V
V
1.4
V
V
-110
-80
-45
mA
-1.6
0.5
1.6
µA
45
80
110
mA
-1
0.5
1
µA
100
Ω
100
Ω
1.0
-0.3
V
mA
-1.25
150
-75
µA
-75
µA
180
°C
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
8.5. Timing Characteristics
VCC = 4.75V to 5.25V; VBAT = 5V to 27V; VSTB-B = VCC; Tjunc = −40°C to +150°C; unless otherwise specified.
Table 10: Timing Characteristics AMIS-4168x
Symbol
Parameter
CANL and CANH output
tt(r-d)
transition time for recessiveto-dominant
CANL and CANH output
tt(d-r)
transition time for dominant-torecessive
tPD(L)
tPD(H)
tCANH(min)
tCANL(min)
tdet
trec
Dpc
Propagation delay TXD to
RXD (LOW)
Propagation delay TXD to
RXD (HIGH)
Minimum dominant time for
wake-up on pin CANH
Minimum dominant time for
wake-up on pin CANL
Failure detection time
Failure recovery time
Pulse-count difference
between CANH and CANL
AMI Semiconductor – Rev. 2.0 – Feb. 07
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Conditions
10 to 90%;
C1 = 10nF; C2 = 0; R1 = 125Ω; see Figure 7
Min
Typ
Max
Unit
0.35
0.60
1.4
µs
10 to 90%;
C1 = 1nF; C2 = 0; R1 = 125Ω; see Figure 7
0.2
0.3
0.7
µs
0.75
1.4
1.5
2.1
µs
µs
1.2
1.4
1.9
2.1
µs
µs
1.2
1.5
1.9
2.2
µs
µs
0.75
2.5
1.5
3.0
µs
µs
1.2
2.5
1.9
3.0
µs
µs
1.2
1.5
1.9
2.2
µs
µs
No failures
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
Failures 1, 2, 5, and 6a; see Figure 5, 7
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
Failures 3, 3a, 4, 6, and 7; see Figure 5, 7
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
No failures
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
Failures 1, 2, 5, and 6a; see Figure 5, 7
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
Failures 3, 3a, 4, 6, and 7; see Figure 5, 7
C1 = 1nF; C2 = 0; R1 = 125Ω
C1 = C2 = 3.3nF; R1 = 125Ω
Low power modes; VBAT = 12V
7
38
µs
Low power modes; VBAT = 12V
7
38
µs
1.6
0.3
8.0
1.6
ms
ms
1.6
0.1
8.0
1.6
ms
ms
0.3
7
125
1.6
38
750
ms
µs
µs
0.3
1. 6
ms
Normal mode
Failure 3 and 3a
Failure 4, 6 and 7
Low power modes; VBAT = 12V
Failure 3 and 3a
Failure 4 and 7
Normal mode
Failure 3 and 3a
Failure 4 and 7
Failure 6
Low power modes; VBAT = 12V
Failures 3, 3a, 4, and 7
Normal mode and failures 1, 2, 4, and 6a
Failure detection (pin ERR-B becomes LOW)
Failure recovery (pin ERR-B becomes HIGH)
12
4
4
-
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
BATTERY
+5V
WAKE
14
7
9
EN 6
ERR 4
STB
RxD
12
AMIS-4168x
5
11
3
TxD 2
20 pF
8
13
RTL
CANL
R1
C1
500
VBAT
1
C3
CANH
RTH
10 kΩ
10 kΩ
C2
500
VCC INH
10
Common
Mode
voltage
R2
GND
V
PC20050511.1
Figure 7: Test Circuit for Dynamic
dominant
recessive
recessive
TxD
50%
50%
tt(r-d)
VCANL
tt(d-r)
3.6V
90%
90%
10%
10%
1.4V
VCANH
5V
0V
RxD
0.7Vcc
0.3Vcc
tPD(L)
tPD(H)
PC20050511.3
Figure 8: Timing Diagram for AC Characteristics
AMI Semiconductor – Rev. 2.0 – Feb. 07
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13
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
BATTERY
100 nF
10 kΩ
+5V
33 kΩ
1
14
EN 6
ERR 4
STB
TxD
Generator
RxD
5
WAKE
7
9
12
AMIS-4168x
11
2
RTL
CANL
20 pF
120 Ω
4.7 nF
Active Probe
CANH
3
13
560 Ω
VBAT
VCC INH
10
8
RTH
560 Ω
100 nF
120 Ω
4.7 nF
GND
PC20050511.5
Figure 9: Test Setup EME Measurements
Figure 10: EME Measurements (See Measurement Setup Figure 9)
AMI Semiconductor – Rev. 2.0 – Feb. 07
www.amis.com
14
Spectrum Anayzer
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
BATTERY
+5V
14
EN 6
ERR 4
STB
RxD
5
WAKE
7
9
12
AMIS-4168x
11
3
TxD 2
20 pF
8
13
1 nF
RTL
CANL
511 Ω
VBAT
1
CANH
RTH
125 Ω
GND
PC20041029.5
Figure 11: Test Circuit for Schaffner Tests (ISO 7637 part
AMI Semiconductor – Rev. 2.0 – Feb. 07
www.amis.com
15
1 nF
Transient
Generator
511 Ω
VCC INH
10
1 nF
1 nF
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
9.0 Package Outline
SOIC-14: Plastic small outline; 14 leads; body width 150 mil; JEDEC: MS-012
AMI Semiconductor – Rev. 2.0 – Feb. 07
www.amis.com
16
AMIS reference: SOIC150 14 150 G
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS
“Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that
is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printedcircuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for
reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250°C.
The top-surface temperature of the packages should preferably be kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
component density, as solder bridging and non-wetting can present major problems. To overcome these problems the doublewave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
• For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction
of the printed-circuit board;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by
screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is
four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to
the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 11: Soldering Process
Package
BGA, SQFP
Soldering Method
Wave
Re-flow(1)
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
Not suitable (2)
Suitable
PLCC (3) , SO, SOJ
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
Notes:
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
2.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
5.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
AMI Semiconductor – Rev. 2.0 – Feb. 07
www.amis.com
17
AMIS-4168x Fault Tolerant CAN Transceiver
Data Sheet
11.0 Company or Product Inquiries
For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com.
North America
Tel: +1.208.233.4690
Fax: +1.208.234.6795
Europe
Tel: +32 (0) 55.33.22.11
Fax: +32 (0) 55.31.81.12
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes
no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and
without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual
environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without
additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.
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18