AMKOR PLCC

LEADFRAME
data sheet
PLCC
Features:
Plastic Leaded Chip
Carrier (PLCC)
Packages:
Amkor’s PLCC offerings cover the total
range offered by the industry. It includes all
square body packages from 20 lead through
84 lead. Also included is the rectangular
body format of the 32 lead. All PLCC
products are offered with and without
heatspreaders. The heatspreader versions
are identical in form factor to the standard
non-heatspreader versions. Both versions
are JEDEC compliant in all respects. The
heatspreader versions give the system
designer greater latitude in thermally
enhanced board level and/or system design.
All products utilize the most advanced
manufacturing equipment offered today.
Lead free and green material set are
qualified.
Thermal Resistance:
Applications:
Amkor’s PLCC product family was engineered to meet JEDEC requirements for “J”
leaded surface mount packages. As such,
they take up less board space than equivalent “gull” formed product in the same body
size. Due to the flexibility and performance
offered, most industry circuit types can be
designed into this product. This would
include memory, processors and controllers,
ASIC, DSP, PC chipset, to name a few.
Applications range from consumer through
automotive and aerospace.
Amkor’s PLCC IC package portfolio provides:
• .352” x .352” to 1.152” x 1.152” body size
• 20 to 84 lead counts
• JEDEC standard compliant
• Available with heatspreader option
• Fine pitch wire bond capability
Multi-Layer PCB
Theta JA (°C/W) by Velocity
Pkg
Body Size
(mm)
Pad Size
(mm)
0
200
500
44 ld
44 ld*
16.6 x 16.6
16.6 x 16.6
7.8 x 7.8
7.8 x 7.8
30.0
24.4
24.5
19.0
22.0
16.6
*With Drop-in heatspreader option
Tested @ 1W
Electrical:
Pkg
Body Size Pad Size
(mm)
(mm)
Self
Bulk
Self
Inductance Capacitance Resistance
(pF)
(mΩ)
Lead
(nH)
20 ld 8.9 x 8.9 220 x 220 Longest 2.110
Shortest 1.780
0.596
0.583
13.5
11.1
Simulated Results @ 100 MHz
Reliability:
Amkor’s PLCCs are reliability assured through optimized design,
material and process enabling high performance operation of your
IC chip.
• Moisture sensitivity
characterization
JEDEC Level 3
30 °C/60% - 192 hrs, SAT-192 hrs
•
•
•
•
121 °C, 2 atm, 100%RH, 504 hours
-65/150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
PCT
Temp cycle
Temp/Humidity
High temp storage
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION .
www.amkor.com
DS293D
Rev Date: 07’03
LEADFRAME
data sheet
PLCC
Process Highlights
Die thickness (max)
25 mils
Strip solder plating
85/15 Sn/Pb or
100% Sn
Strip marking
Laser/pad/offset
Lead inspection
Optical
Pack/ship options
Bar code
Cross-section PLCC
Test Services
• Program/generation/conversion
• Product engineering
• Wafer sort
• 256 pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
Clear antistatic tube 20 inches
Configuration Options:
PLCC NOMINAL PACKAGE DIMENSIONS
Lead Count
Square
20
28
44
52
68
84
Rectangular
32
Body Size
Body
Thickness
Lead Pitch
Lead Form
Amkor
Dwg No.
JEDEC
Dwg No.
Qty Per
Tube
.352 x .352
.452 x .452
.652 x .652
.752 x .752
.952 x .952
1.152 x 1.152
0.152
0.152
0.152
0.152
0.150
0.150
0.05
0.05
0.05
0.05
0.05
0.05
N/A
N/A
N/A
N/A
N/A
N/A
00060
00060
00060
00060
00060
00060
MS-018
MS-018
MS-018
MS-018
MS-018
MS-018
46
37
26
23
18
15
.452 x .552
0.109
0.05
N/A
00061
MS-016
30
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.