ANAREN RFP-100200N4X50-2

30 Watts, 50 Ω
General Specifications
Resistive Element:
Substrate:
Terminals:
Thick film
Aluminum nitride ceramic
Tin/Lead, 90/10 over nickel
Electrical Specifications
Resistance Value:
Frequency Range:
Power:
V.S.W.R.:
Features
• DC – 3.0 GHz
• 30 Watts
• Aluminum Nitride (AlN) Ceramic
• Terminal for Lead Attachment
• Non-Nichrome Resistive
Element
Aluminum Nitride Chip Terminations
Model RFP-100200N4X50-2
Aluminum Nitride Terminations
50 ohms, ±2%
DC - 3.0 GHz
30 Watts
1.25:1
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
• Low VSWR
• 100% Tested
Outline Drawing
SIDE VIEW
TOP VIEW
.100
.040
.200
.030
HATCHED AREA INDICATES
PROTECTIVE COATING
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
1
Aluminum Nitride Chip Terminations
Model RFP-100200N4X50-2
Typical Performance
Suggested Mounting Procedures
Power Derating
% OF RATED POWER
.025 MIN.
(2 PLACES)
100
75
BOARD LOWER
THAN LEAD.
50
SUGGESTED STRESS RELIEF METHODS
25
SCALE: NONE
0
25
50
75
100
125
CASE TEMPERATURE — °C
150
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an SN96 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (700°F).
Available on Tape and Reel for Pick and Place Manufacturing.
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369