SG55327/SG75327 QUAD SOURCE MEMORY DRIVER DESCRIPTION FEATURES The SG55327/SG75327 is a monolithic quad source driver designed to meet the high current and fast switching speed requirements of magnetic memory systems. Each driver is independently controlled and capable of sinking up to 600mA. • • • • Paired with the SG55326 Quad Sink Driver, the SG55327/ SG75327 provides the current drive necessary for many sink/ source applications. • The SG55327/SG75327 has also been used in many non-memory applications: for example, as the driver for a clock circuit, relay, lamp, or small motor, or any application where a 600mA source driver is needed. • • • • Quad source memory drivers 600mA output current capability VCC2 drive voltage variable to 24V Output capable of swinging between VCC2 and ground High-repetition-rate driver compatible with high– speed magnetic memories Inputs compatible with TTL decoders Minimum time skew between strobe and output– current rise Pulse-transformer coupling eliminated Drive-line lengths reduced HIGH RELIABILITY FEATURES - SG55327 The SG55327 is characterized for use over the full military operating ambient temperature range of -55°C to 125°C while the SG75327 is characterized from 0°C to 70°C. ♦ Available to MIL-STD-883 ♦ Scheduled for MIL-M-38510 QPL listing ♦ LMI level “S” processing available These devices are available in 16-pin ceramic DIP, 16-pin plastic DIP and 16-pin flatpack. BLOCK DIAGRAM LINFINITY 4/90 Rev 1.2 7/96 Copyright 1994 1 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 SG55327/SG75327 ABSOLUTE MAXIMUM RATINGS (Note1) Supply Voltage (VCC1) (Note 2) ............................................ 7.0V Supply Voltage (VCC2) ......................................................... 25V Input Voltage (any address or strobe input) ...................... 5.5V Output Collector Voltage .................................................... 25V Output Collector Current ............................................. 750mA Operating Junction Temperature (TC) Hermetic (J, F-Packages) ......................................... 150°C Plastic (N-Package) .................................................. 150°C Storage Temperature Range .......................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) .................. 300°C Note 1. Values beyond which damage may occur. Note 2. Voltage values are with respect to network ground terminal. THERMAL DATA J Package: Thermal Resistance-Junction to Case, θJC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA ............... 80°C/W N Package: Thermal Resistance-Junction to Case, θJC .................. 40°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 65°C/W F Package: Thermal Resistance-Junction to Case, θJC ................... 70°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 115°C/W Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA). Note B. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θ JA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. RECOMMENDED OPERATING CONDITIONS (Note 3) Supply Voltage (VCC1) ............................................ 4.5V to 5.5V Supply Voltage (VCC2) ............................................. 4.5V to 24V Output Collector Voltage .................................................... 24V Output Collector Current ................................................. 600mA Operating Ambient Temperature Range: SG55327 ....................................................... -55°C to 125°C SG75327 ............................................................. 0°C to 70°C Note 3. Range over which the device is functional. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG55327 with -55°C ≤ TA ≤ 125°C, and SG75327 with 0°C ≤ TA ≤ 70°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Static Section High-Level Input Voltage (VIH ) Low-Level Input Voltage (VIL) Input Clamp Voltage (VIK) Collectors Terminal Off-State Current (IOFF) Saturation Voltage (VSAT) (Note 4) Input Current (IIN ) Address Strobe High-Level Input Current (IIH ) Address Strobe Low-Level Input Current (IIL) Address Strobe Test Conditions 2 VCC1 = 4.5V, IIN = -10mA, TA = 25°C VCC1 = 4.5V, VCOL = 24V VCC1 = 4.5V, VCOL = 24V, TA = 25°C VCC1 = 4.5V, VOUT = 0V, ISOURCE = –600mA TA = 25°C VIN = 5.5V Units -1.0 0.8 -1.7 V V V 0.43 200 200 0.90 0.75 µA µA V V 1 4 1 4 mA mA 40 160 40 160 µA µA -1.6 -6.4 mA mA 2 -1.0 0.8 -1.7 0.43 500 150 0.90 0.70 VIN = 2.4V VIN = 0.4V -1.0 -4.0 -1.6 -6.4 -1.0 -4.0 LINFINITY 4/90 Rev 1.2 7/96 Copyright 1994 SG55327 SG75327 Min. Typ. Max. Min. Typ. Max. 2 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 SG55327/SG75327 ELECTRICAL CHARACTERIZATICS (continued) Parameter Static Section (continued) Supply Current (ICC(OFF)) From VCC1 From VCC2 Supply Current (ICC(ON)) SG75327 SG55327 Min. Typ. Max. Min. Typ. Max. Test Conditions All outputs off, all inputs at 5V, TA = 25°C 7.0 13 10 20 7.0 13 8.0 36 12 55 8.0 36 One output on, ISOURCE = -50mA, VCOL = 6V, TA = 25°C From VCC1 From VCC2 Parameter To (output) Dynamic Section (Note 5) Propagation Delay, Low to High (TPLH) Propagation Delay, High to Low (TPHL) Transition Time, Low to High (TTLH) Transition Time, High to Low (TTHL) High-Level Output Voltage (VOH) Test Conditions Coll. W, Z or X, Y Coll. W, Z or X, Y W, X, Y, or Z W, X, Y, or Z Coll. W, Z or X, Y VS = VCC2 = 15V, RL = 24Ω VS = VCC2 = 15V, RL = 24Ω VCOL = VCC2 = 20V, RL = 100Ω VCOL = VCC2 = 20V, RL = 100Ω VS = VCC2 = 24V, RL = 47Ω, ISINK ≈ 500mA (Note 6) Units 10 20 mA mA 12 55 mA mA SG55327/75327 Min. Typ. Max. Units 35 30 30 10 ns ns ns ns 55 55 V S–25 mV Note 4. Under these conditions, not more than one output is to be on any one time. Note 5. Unless otherwise specified, V CC1 = 5V, C L = 25pF, and TA = 25°C. Note 6. Guaranteed but not tested. CONNECTION DIAGRAMS & ORDERING INFORMATION Package 16-PIN CERAMIC DIP J - PACKAGE 16-PIN PLASTIC DIP N - PACKAGE 16-PIN CERAMIC FLAT PACK F - PACKAGE Part No. SG55327J/883B SG55327J SG75327J SG75327N SG55327F/883B SG55327F (See Notes Below) Ambient Temperature Range Connection Diagram -55°C to 125°C -55°C to 125°C 0°C to 70°C VCC2 1 16 W A NODE R RINT 2 15 3 14 4 13 5 12 B X GND (Note 2) 6 11 7 10 8 9 0°C to 70°C -55°C to 125°C -55°C to 125°C COLLECTORS W, Z Z D S VCC1 C Y COLLECTORS X, Y VCC2 1 16 W A NODE R RINT B X GND 2 15 3 14 4 13 5 12 6 11 7 10 8 9 COLL. W, Z Z D S VCC1 C Y COLL. X, Y Note 1. All packages are viewed from the top. Note 2. Pin 8 is in electrical contact with the metal base. LINFINITY 4/90 Rev 1.2 7/96 Copyright 1994 3 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570