ASDL-4360 High Power and High Speed Infrared Emitter (885nm) in PLCC-2 Package Data Sheet Description Features ASDL-4360 Infrared emitter is encapsulated in the Industry Standard PLCC-2 SMT package that is designed for application that requires high radiant intensity and fast switching at wide viewing angle. This device optimizes at emissive wavelength of 885nm. • 885nm Wavelength • Industry Standard Footprint: PLCC-2 SMT Package • High Speed • High Power • Low Forward Voltage • High Pulse Rate Applications • High-Speed Machine Automated System • Medical Applications • Non-Contact Position Sensing • Optical Sensing • Security Applications Ordering Information Part Number Packaging Shipping Option ASDL-4360-C22 Tape & Reel 2000pcs • Lead Free and ROHS Compliant • Tape & Reel for automation placement Package Outline All Dimensions are in Millimeters Tape and Reel Dimension All Dimensions are in Millimeters Absolute Maximum Ratings at 25°C Parameter Symbol Peak Forward Current Min. Max Unit Reference IFPK 500 mA Tp=500ns Tw = 100ns Duty Cycle = 20% Continuous Forward Current IFDC 100 mA Power Dissipation PDISS 200 mW Reverse Voltage Vr 11 Operating Temperature TO -40 85 °C Storage Temperature TS -40 100 °C LED Junction Temperature TJ 110 °C 260 for 5 sec °C Typ. Max. Unit Condition 1.4 1.6 1.7 2.0 V V IF=20mA IF=100mA V IR=10uA V Lead Soldering Temperature Ir=100uA Electrical Characteristics at 25°C Parameter Symbol Forward Voltage VF Reverse Voltage Vr Min. 11 Thermal Resistance Diode Capacitance CO 250 °C/W 90 pF Vr=0V, f=1MHz Unit Condition IF = 20mA IF =100mA Optical Characteristics at 25°C Parameter Symbol Min. Typ. Max. Radiant On-Axis Intensity IE 1.0 5.1 2.0 10.0 mW/Sr Viewing Angle 2θ1/2 120 deg Peak wavelength λPK 885 nm IF = 20mA Spectral Width Δλ 55 nm IF = 20mA Optical Rise Time tr 20 ns IFPK=500mA Duty Factor=20% Pulse Width=100ns Optical Fall Time tf 17 ns IFPK=500mA Duty Factor=20% Pulse Width=100ns 1.2 0.12 1 0.10 If Forward Current (A) Relative Radiant Intensity Typical Electrical / Optical Characteristics Curve (TA = 25°C Unless Otherwise Stated) 0.8 0.6 0.4 0.08 0.06 0.04 0.02 0.2 0 700 800 900 0.00 1000 0 0.5 Peak Wavelength (nm) Figure 1. Peak Wavelength Vs Relative Radiant Intensity 1 Vf Forward Voltage (V) 0.8 Ie - Relative Radiant Intensity 10 Radiant Intensity (mW/Sr) 1 8 6 4 2 0 20 40 60 80 100 120 -0.8 0.6 0.4 0.2 -0.6 -0.4 -0.2 0 0.0 0.2 0.4 Forward Current (mA) IDC MAX - MAXIMUM DC CURRENT PER SEGMENT - mA Figure 3. Forward Current Vs Radiant Intensity 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 0 20 40 60 Figure 4. Angular Displacement Vs Relative Radiant Intensity o 80 100 TA - AMBIENT TEMPERATURE - C Figure 5. Forward Current Vs Ambient Temperature derated based on Tj – 110 °C and thermal resistance at 250 °C/W 2 Figure 2. Forward Current Vs Forward Voltage 12 0 1.5 0.6 0.8 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217 C 150 R5 R1 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 300 t-TIME (SECONDS) P4 COOL DOWN Symbol DT Maximum DT/Dtime or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s > 217°C 60s to 90s Process Zone Time maintained above liquidus point , 217°C Peak Temperature 260°C - - 20s to 40s 25°C to 260°C 8mins Time within 5°C of actual Peak Temperature Time 25°C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. Recommended Land Pattern All Dimensions are in Millimeters For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0274EN - April 27, 2007