APDS-9006-020 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description Features The APDS-9006 is a low cost analog-output ambient light photo sensor in a Reverse Mount, 4 pin miniature chipLED lead free surface mount package, with temperature and voltage compensation features. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as shown in figure 2. • Excellent responsivity which peaks in the human luminosity curve, close responsivity to the human eye • ChipLED surface-mount package – Reverse Mounting Height – 1.10mm Width – 3.20mm Depth – 1.60mm • Good output linearity across wide illumination range • Low sensitivity variation across various light sources • Stable performance over temperature and voltage • Operating temperature, -40°C to 85°C • Vcc supply 2.4 to 5.5V • Lead-free package The APDS-9006 is ideal for applications in which the measurement of ambient light is used to control display backlighting such as in Note-book, mobile phone, PDA applications that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. Other applications include ESS, Automatic Residential and Commercial Lighting Management. Applications • Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Cameras • Automatic Residential and Commercial Lighting Management • Electronic Signs and Signals Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS9006 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. I/O Pins Configuration Table Pin Symbol Description 1 OUT OUT 2 VCC VCC 3 VCC VCC 4 NC No Connect Ordering Information Part Number Packaging Type Package APDS-9006-020 Tape and Reel Quantity 4-pins Chipled package 2500 Relative Spectral Response Vs. Wavelength Typical Application Circuit Pin 3:V CC APDS-9006 Eye Response 0.9 Pin 2:V CC 0.8 Response (a.u.) APDS-9006 Normalized sensor spectral response 1 Pin 1:OUT 0.7 0.6 0.5 0.4 0.3 0.2 0.1 R LOAD Pin 4:NC 0 300 400 500 600 700 800 wavelength (nm) Figure 2. Relative Spectral Response Vs. Wavelength Figure 1. Typical application circuit for APDS-9006 Notes : PIN 2 and PIN 3 Vcc need to be externally shorted. Figure 1 Table Component Recommended Application Circuit Component RLOAD 5k ohm Note 1 : Refer to fig. 11 Vout vs Lux graph 900 1000 1100 Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA -40 85 °C Storage Temperature TS -40 85 °C Supply Voltage VCC 2.4 5.5 V Conditions Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max. Units Conditions Photo Current (I) I_PH1 28 40 52 uA Vcc =3V, Lux = 100 [1] Photo Current (II) I_PH2 - 44 - uA Vcc =3V, Lux = 100 [2] Dark Current I_DARK - 300 - nA Vcc = 3V, Lux = 0 Light Current Ratio I_PH2 / I_PH1 - 1.1 - - Rise Time Tr - 5 - ms Rl = 1Kohm, Lux = 100 Fall Time - 5 - ms R1 = 1Kohm, Lux=100 Peak sensitivity wavelength Tf l - 500 - nm Settling Time pulsed at Vcc Tset - 10 - ms Vcc pulsed = 0V to 3V; Rload = 2.4K ohms; Lux = 100 [1] Propagation delay Td - 5 - ms Rl = 1Kohm, Lux = 100 Storage delay Ts - 5 - ms R1 = 1Kohm, Lux=100 Note : 1. Fluorescence light is used as light source, however, white LED is substituted in a mass production process 2. Illuminance by CIE standard light source (Incandescent lamp 450.0E-6 1.2 400.0E-6 1.0 350.0E-6 0.8 250.0E-6 REL I-OUT I-Out 300.0E-6 200.0E-6 150.0E-6 0.6 0.4 100.0E-6 0.2 50.0E-6 000.0E+0 0 100 200 300 400 500 600 700 800 900 1000 1100 LUX Figure 3. Average Iout Vs Lux (Vcc = 3V, T=25°C, White LED source) 0 -40 -20 0 20 40 60 80 TEMPERATURE [˚C] Figure 4. Average relative Iout Vs Temp (Vcc = 3V, T=25°C, 320 Lux) 100 1.5 1.2 1.4 1 1.3 0.8 1.1 Rel I-Out REL I-OUT 1.2 1 0.9 0.6 0.4 0.8 0.7 0.2 0.6 0.5 0 1 2 3 VCC 4 5 6 Figure 5. Relative Output Current Vs Vcc (Ta = 25°C, 100Lux) Figure 6. Relative Iout Vs Angle (Vcc = 3V, Ta = 25°C) 12 16.0E-3 T-r 10 Settling Time [mSec] 14.0E-3 12.0E-3 Time [Secs] 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angle in Degrees T-f 10.0E-3 8.0E-3 6.0E-3 4.0E-3 2.0E-3 000.0E+0 6 4 2 0 0 2000 4000 6000 8000 Load Resistance [Ohms] 10000 0 12000 Figure 8. Average Rise Time , Fall Time Vs Load Resistance at Vcc = 3V 100 200 300 400 500 600 700 800 900 1000 LUX Figure 9. Average Settling Time vs Lux at Vcc=3V 1.00E-06 2.5 9.00E-07 12kΩ 7.5kΩ 8.00E-07 2.0 Average Vout (V) 7.00E-07 I-Dark [A] 8 6.00E-07 5.00E-07 4.00E-07 3.00E-07 5kΩ 4.3kΩ 1.5 3.3kΩ 2.7kΩ 1.0 2.2kΩ 1.8kΩ 0.5 2.00E-07 1kΩ 1.00E-07 0.00E+00 -40 0.0 -20 0 20 40 TEMP [˚C] Figure 10. Dark current Vs temperature 60 80 100 0 100 200 300 400 500 600 700 Lux Figure 11. General Luminance vs Typical Output Voltage (Vcc = 3V, T = 25°C, Light Source = White LED) 800 900 1000 APDS-9006 Light Measurement Circuit and Waveforms I_pulse VOUT 90% 10% GND tf tr td ts APDS-9006 Package Outline APDS-9006 Tape and Reel Dimensions Moisture Proof Packaging Chart All APDS-9006 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking conditions Recommended Storage Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In Reels 60°C 48 hours In Bulk 100°C 4 hours Baking should only be done once. Storage Temperature 10°C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. If times longer than seven days are needed, the parts must be stored in a dry box. Recommended Reflow Profile MAX 260C T - TEMPERATURE (˚C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217 C 150 R5 R1 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 250 P4 COOL DOWN 300 t-TIME (SECONDS) Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 200°C to 255°C 3°C/s P3, R4 255°C to 200°C -6°C/s P4, R5 200°C to 25°C -6°C/s Time maintained above 217°C > 217°C 60s to 90s Peak Temperature 260°C Time within 5°C of actual Peak Temperature > 255°C 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins Cool Down The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9006 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9006 pins. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The 200 P3 SOLDER REFLOW dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9006 pins to change dimensions evenly, putting minimal stresses on the APDS-9006. It is recommended to perform reflow soldering no more than twice. 1.2 Recommended Metal Solder Stencil Aperture Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Metal Stencil For Solder Paste Printing Stencil Aperture It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6mm x 0.71mm. This is to ensure adequate printed solder paste volume and no shorting. Aperture Opening 0.11 Land Pattern Solder Mask 1.7 PCBA Aperture Opening 3.31 Unit: mm Figure A3. Solder stencil aperture 1.3 Adjacent Land Keep-out and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. Figure A1. Stencil and PCBA 1.1 Recommended Land Pattern CL The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Soldering Terminal Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. 1.00 2.7 0.71 0.945 1.89 Aperture Opening Mounting Center 4.31 0.71 0.60 0.50 0.60 2.00 Unit: mm Unit: mm Tolerance: +/- 0.2 0.2 MIN. Figure A2. Recommended Land Pattern 10 Figure A4. Adjacent land keepout and solder mask areas. Appendix B: Optical Window Design for APDS-9006 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9006 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9006. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585. Top View D2 If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. D1 The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure B1 and B2 illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. D1 T WD L Z APDS-9006 Light Receving Area Figure B3. Recommended Window Dimensions Figure B1. Window Size Determination for Flat Window WD: D1: T: L: D2: Z: Working Distance between window front panel & APDS-9006 Window Diameter Thickness Length of Light Pipe Light Pipe Diameter Distance between window rear panel and APDS-9006 Table 1. Recommended minimum dimension for optical window WD (T+L+Z) Flat Window (L=0.0) Flat window with Light Pipe Z D1 D1/D2 T/L/Z 1.5 0.5 2.35 - - 2.0 1.0 3.05 - - 2.5 1.5 3.75 - - 3.0 2.0 4.45 2.25/1.5 1.0/1.5/0.5 All dimensions are in mm Figure B2. Window Design of Flat Window with Light Guide 11 The window should be placed directly on top of the light receiving area (active area) of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9006. The recommended minimum window dimension is based on the assumption that the center of the window and the center of the light receiving of the photo sensor are the same. It is recommended that the tolerance for assembly be considered as well. The recommended minimum window size which will take into account of the assembly tolerance is defined as: D1 (min + assembly tolerance) = D1min + 2*(assembly tolerance) (Dimensions are in mm) D2 (min + assembly tolerance) = D2min + 2*(assembly tolerance) (Dimensions are in mm) For product information and a complete list of distributors, please go to our web site: 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2. Recommended Plastic Materials Material number Visible light transmission Refractive index Makrolon LQ2647 87% 1.587 Makrolon LQ3147 87% 1.587 Makrolon LQ3187 85% 1.587 www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0053EN - January 16, 2007