HLMP-FW00 5mm Flat Top InGaN White LED Lamp Data Sheet Description Features This wide viewing angle white LED lamp is based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. Wide viewing angle: 90° Benefit • Electronic Signs and Signals • Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light Sources • Small Area Illumination • Flat top • High intensity InGaN technology Applications • Legend Backlighting • General Purpose Indicators Package Dimensions Notes : 1. All dimensions are in milimetres /inches. 2. Epoxy meniscus may extend about 1mm (0.040”) down the leads. CAUTION : These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Device Selection Guide Part Number Min Luminous Intensity Iv (mcd) @ 20mA Max Luminous Intensity Iv (mcd) @ 20mA HLMP-FW00-JM0xx 240 680 Tolerance for intensity bin limit is +/-15% Absolute Maximum Ratings (TA = 25°C) Parameter Value Units DC Forward Current [1] 30 mA Peak Forward Current [2] 100 mA Power Dissipation 111 mW Reverse Voltage (IR = 10mA) 5 V LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, 1 KHz. Electrical Characteristics (TA = 25°C) Forward Voltage VF (V) @ IF = 20 mA Reverse Breakdown VR (V) @ IR = 10mA Capacitance C (pF), VF = 0,f = 1 MHz Thermal Resistance RqJ-PIN (°C/W) Typ. Max. Min. Typ. Typ. 3.2 3.7 5 70 240 Optical Characteristics (TA = 25°C) Typical Chromaticity Coordinates [1] x y 0.32 0.32 Viewing Angle 2q1/2 Degrees [2] Typ. 90° Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 35 30 0.8 FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY 1.0 0.6 0.4 0.2 0 380 480 580 680 25 20 15 10 5 0 780 0 1 Figure 1. Relative Intensity vs Wavelength 3 0.025 0.020 1.2 1 mA Y-COORDINATES 0.015 0.9 0.6 0.3 0 4 Figure 2. Forward Current vs Forward Voltage 1.5 RELATIVE LUMINOUS INTENSITY 2 FORWARD VOLTAGE - V WAVELENGTH – nm 5 mA 0.010 10 mA 0.005 15 mA 20 mA 0 25 mA -0.005 30 mA 0 10 20 30 -0.010 -0.004 -0.002 0 FORWARD CURRENT - mA 0.002 0.004 X-COORDINATES (X,Y) VALUES @ 20 mA REFERENCE TO (0,0) Figure 4. Chromaticity shift vs. current 35 1.0 30 RELATIVE LUMINOUS INTENSITY I F MAX. - MAXIMUM FORWARD CURRENT - mA Figure 3. Relative Iv vs. Forward Current 25 20 15 10 5 0 0 20 40 60 T A - AMBIENT TEMPERATURE - C Figure 5. Maximum Fwd. Current vs Temperature 80 100 0.5 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - Degree Figure 6. Spatial Radiation Pattern 60 90 Intensity Bin Limits (mcd at 20 mA) Color Bin Limit Tables Bin Min. Max. Rank 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 2 x y 0.287 0. 295 0.296 0.276 0.330 0.318 0.330 0.339 3 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 4 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 J 240 310 K 310 400 L 400 520 M 520 680 Tolerance for each bin limit is ±15% Limits (Chromaticity Coordinates) Tolerance for each bin limit is ±0.01 Relative Light Output vs. Junction Temperature Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 1.2 1.0 0.35 0.8 0.6 Y-coordinate RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25 C) 1.4 0.4 0.2 0 -40 -20 0 20 40 60 80 100 120 4 2 0.30 1 Black Body Curve 3 0.25 TJ - JUNCTION TEMPERATURE - C 0.20 0.26 0.3 0.34 0.38 X-coordinate Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for information on currently available Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25ûC before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes • Recommended soldering condition: Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max LED component ead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. Recommended Wave Soldering Profile LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 200 TEMPERATURE - °C BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 TIME - SECONDS 60 70 80 90 100 DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4143EN AV02-0425EN - May 15, 2007