HLMP-HD57 5 mm Standard Oval Precision Optical Performance Red LED Data Sheet Description Features This Precision Optical Performance Oval LED is specifically designed for Full Color/Video and Passenger Information Signs. The Oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Aluminium Indium Gallium Phosphide (AlInGaP) for Red Color. The higher performance AlInGaP II is used. • Well defined spatial radiation pattern The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. • Full color signs • High brightness material • Red AlInGaP 630 nm • Tinted and diffused • Typical viewing angle 40°x100° Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments Applications • Commercial outdoor advertising Package Dimensions 1.0 MAX. (0.039) 10.85 ± 0.50 (0.427 ± 0.019) NOTE: MEASURED AT BASE OF LENS. 1.50 ± 0.15 (0.059 ± 0.006) 0.70 MAX. (0.028) 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 3.80 (0.150) 2.54 (0.10) 5.20 (0.204) 7.00 (0.275) 24.00 MIN. (0.945) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED. 1.00 MIN. (0.039) Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Tinting Type HLMP-HD57-NR0xx Red 630 680 1900 Red Notes: 1.The luminous intensity is measured on the mechanical axis of the lamp package. 2.The optical axis is closely aligned with the package mechanical axis. 3.The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. 4.Tolerance for luminous intensity is ± 15%. Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging zz: Flexi-bin; Ammo Packs Color Bin Selections 0: No Color Bin Limitation Maximum Intensity Bin 0: No Iv Bin Limitation Minimum Intensity Bin Refer to Device Selection Guide Color D: 630 nm Red Package H: 5 mm Oval 40º x 100º Note: Please refer to AB 5337 for complete information about part numbering system. Absolute Maximum Ratings at TA = 25˚C Parameter Value DC Forward Current[1] 50 mA Peak Pulsed Forward Current [2] 100 mA Average Forward Current 30 mA Power Dissipation 120 mW Reverse Voltage 5 V (IR = 100 µA) LED Junction Temperature 130˚C Operating Temperature Range –40˚C to +100˚C Storage Temperature Range –40˚C to +120˚C Notes: 1.Derate linearly as shown in Figure 3. 2.Duty Factor 30%, Frequency 1 KHz. Electrical/Optical Characteristics TA = 25˚C Parameter Symbol Min. Typ. Max. Units Forward Voltage VF2.22.4 V Reverse Voltage VR 5 Capacitance C 40 pF Thermal Resistance RθJ-PIN240 ˚C/W Dominant Wavelength [1] λd 622 630 634 nm Peak Wavelength λp 639 nm Spectral Halfwidth ∆λ1/2 17 nm Luminous Efficacy [2] ηv 155 lm/W Luminous Flux jV 1300 mlm Luminous Efficiency [3] he 30 lm/W Test Conditions IF = 20 mA IR = 100 µA VF = 0, f = 1 MHz LED Junction-to-Cathode Lead IF = 20 mA Peak of Wavelength of Spectral Distribution at IF = 20 mA Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA Emitted luminous power/ Emitted radiant power IF = 20 mA Luminous Flux/Electrical Power IF = 20 mA 0 550 600 650 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength. HLMP-HD57 fig 1 700 1.5 1.0 0.5 0 0 10 20 30 40 FORWARD CURRENT – mA Figure 2. Relative luminous intensity vs. forward current. HLMP-HD57 fig 2 50 MAX. - 0.5 2.0 IF 2.5 RELATIVE INTENSITY (NORMALIZED AT 20 mA) RELATIVE INTENSITY 1.0 MAXIMUM FORWARD CURRENT - mA Notes: 1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 3. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 60 50 40 30 20 10 0 0 20 40 60 80 100 TA- AMBIENT TEMPERATURE - o C Figure 3. Forward current vs. ambient temperature. 1.0 40 RELATIVE INTENSITY IF – FORWARD CURRENT – mA 50 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 0.5 0 -90 3.0 -70 -50 -30 VF – FORWARD VOLTAGE – V 50 70 Intensity Bin Limits (mcd at 20 mA) Bin Name N P Q R 0.5 0 -90 -70 -50 -30 -10 10 30 50 70 90 ANGLE – DEGREES Figure 6. Spatial radiation pattern-major axis. HLMP-HD57 fig 6 10 1 0.1 -40 -20 0 90 HLMP-HD57 fig 5 1.0 RELATIVE INTENSITY 30 Figure 5. Spatial radiation pattern-minor axis. HLMP-HD57 fig 4 RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C 10 ANGLE – DEGREES Figure 4. Forward current vs. forward voltage. 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C Figure 7. Relative Light Output vs Junction Temperature -10 100 120 Min. 680 880 1150 1500 Max. 880 1150 1500 1900 Tolerance will be ± 15% of these limits. Note: 1.Bin categories are established for classification of products. Products may not be available in all bin categories. Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE Note: Electrical connection AllnGaP Devicebetween bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.5 ± 1.00 (0.8071 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.025) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A � 4.00 ± 0.20 TYP. (0.1575 ± 0.0079) VIEW A-A ALL DIMENSIONS IN MILLIMETERS (INCHES). Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff. Packaging Box for Ammo Packs Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity LPN CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: REV: (V) Vendor ID DeptID: (1P) Item: Part Number Made In: Country of Origin (ii)Avago Baby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii)Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii)Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4176EN AV02-0387EN - July 3, 2007