HSMF-C118 TriColor ChipLED Data Sheet Description Features The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. • Common anode The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with IR soldering and binned by both color and intensity. • Small 3.2 x 2.7 x 1.1 mm package • Diffused optics • Red/Green/Blue color combination • Available in 8 mm tape on 7 inch (178 mm) diameter reels • High brightness using AlInGaP and InGaN die technology • Compatible with reflow soldering Applications • Backlighting • Status indicator • Front panel indicator • Office automation, home appliances, industrial equipment CAUTION: HSMF-C118 is Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions LED DIE 3 2 1.5 (0.059) 4 1 COMMON ANODE 3.2 (0.126 ) 0.6 (0.024) 2.7 (0.106) 2.0 (0.079) 1 DIFFUSED EPOXY 1.1 (0.043) PC BOARD 2 RED 0.5 (0.020) 3 GREEN POLARITY ANODE MARK 0.4 (0.016) 0.7 (0.028) SOLDERING TERMINAL 1.1 (0.043) 4 – 0.05 (0.002) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED. 4 BLUE Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP Red InGaN Green InGaN Blue DC Forward Current[1, 3, 4] 20 20 20 Power Dissipation[1] 48 78 78 [2] DC Forward Current 15 15 15 [2] Power Dissipation 36 59 59 Reverse Voltage (IR = 100 µA) 5 5 5 LED Junction Temperature 95 95 95 Operating Temperature Range –30 to +85 Storage Temperature Range –40 to +85 Soldering Temperature See reflow soldering profile (Figures 6 & 7) Units mA mW mA mW V °C °C °C Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) @ IF = 20 mA Color Typ. Max. AlInGaP Red 1.9 2.4 InGaN Green 3.5 3.9 InGaN Blue 3.5 3.9 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 17 110 110 Thermal Resistance RθJ-PIN (°C/W) Typ. 400 450 450 Optical Characteristics at TA = 25°C Peak Luminous Intensity Wavelength Iv (mcd) @ IF = 20 mA[1] λpeak (nm) Color Min. Typ. Typ. AlInGaP Red 28.5 90 637 InGaN Green 45.0 120 523 InGaN Blue 11.2 40 468 Color, Dominant Wavelength Viewing Angle λd[2] (nm) 2 θ1/2 Degrees[3] Typ. Typ. 626 135 525 130 470 125 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Luminous Efficacy ηv (lm/W) Typ. 155 490 80 Intensity (Iv) Bin Limits[1] CAUTION: Bin ID L M N P Q R S 1. The above optical performance specifications are valid in the case when single LED is lit up. Intensity (mcd) Min. Max. 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 Tolerance: ± 15%. Color Bin Limits [1] Blue Color Bins Bin ID A B C D Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Tolerance: ± 1 nm Red Color Bins Bin ID – Dom. Wavelength (nm) Min. Max. 620.0 635.0 Tolerance: ± 1 nm Green Color Bins Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0 Tolerance: ± 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on currently available bins. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consis-tency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Application Brief AB D-007 for additional details/explanation on driving the part in parallel circuit. 100 InGaN GREEN AS RED 70 60 50 40 30 20 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 IF – FORWARD CURRENT – mA InGaN BLUE 80 RELATIVE INTENSITY 1.4 100 90 RED 10 GREEN & BLUE 1 1.0 0.8 0.4 450 500 550 600 650 0.1 700 0 1.5 2.0 2.5 3.0 3.5 4.0 0 Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. 25 5 10 15 0.9 15 GREEN, BLUE 10 5 0 RELATIVE INTENSITY – % AS RED 0.8 0.7 0.6 0.5 0.4 RED BLUE GREEN 0.3 0.2 0.1 0 10 20 30 40 50 60 70 80 90 TA – AMBIENT TEMPERATURE – C Figure 4. Maximum forward current vs. ambient temperature (1 chip lit up). 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. 10 - 30 SEC. TEMPERATURE TEMPERATURE 10 SEC. MAX. 230˚C MAX. 4˚C/SEC. MAX. 140-160˚C -3˚C/SEC. MAX. 4˚C/SEC. MAX. TIME 3 °C/SEC. MAX. 100 SEC. MAX. 0.4 (0.016) 1.0 (0.039) 1.5 (0.059) Figure 8. Recommended soldering pattern. (Acc. to J-STD-020C) Figure 7. Recommended Pb-Free reflow soldering profile. 1.0 (0.039) 6 °C/SEC. MAX. 150 °C TIME Figure 6. Recommended Pb-Free reflow soldering profile. 2.0 (0.079) 255 - 260 °C 3 °C/SEC. MAX. 60 - 120 SEC. OVER 2 MIN. 1.5 (0.059) 217 °C 200 °C 25 Figure 3. Luminous intensity vs. forward current. 1.0 20 20 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V WAVELENGTH – nm IF MAX. – MAXIMUM FORWARD CURRENT – mA RED 0.2 10 0 400 GREEN, BLUE 0.6 30 USER FEED DIRECTION CATHODE SIDE xxxxx xxxxx xxx xxxxxxx xxxxx PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 10. Reel dimensions. 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION COVER TAPE 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C118 DIM. A ± 0.10 (± 0.004) DIM. B ± 0.10 (± 0.004) DIM. C ± 0.10 (± 0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 11. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS. Figure 12. Tape leader and trailer dimensions. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-4811EN AV02-0610EN - July 25, 2006