ASMT-CA00 AlInGaP Amber, 0.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description Features The ASMT-CA00 of amber color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint 1.6 mm x 1.0 mm and a height of only 0.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4000 units per reel. These part are compatible with IR soldering. • Small size right angle mount • 0603 industry standard footprint • 0.4 mm low profile type • Operating temperature range of -30°C to +85 °C • Compatible with IR reflow soldering process • Available in 8mm tape on 178mm (7’) diameter reels • Reel sealed in zip locked moisture barrier bags Applications • LCD Backlighting • Keypad Side / Backlighting • Pushbutton backlighting • Symbol Indicator Package Dimension 1.20 0.047 1.60 0.063 R0.60 0.024 0.20 0.20 0.008 0.008 0.50 0.020 0.40`0.05 0.016`0.002 1.00 0.039 TOP VIEW SIDE VIEW 0.20 0.009 0.30 0.012 CATHODE MARK 0.30 0.012 0.30 0.012 0.35 0.014 0.35 0.014 TERMINAL VIEW Notes: 1. All dimensions will be in millimeters (inches) 2. Tolerance is ±0.1mm (±0.004 in) unless otherwise stated CAUTION: ASMT-CA00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Package Dimension (mm) Parts per Reel Package Description 1.6 (L) x 1.0 (W) x 0.4 (H) 4000 Untinted, Non-diffused Parameter ASMT-CA00 Unit DC Forward Current [1] 25 mA Power Dissipation 60 mW Reverse Voltage (IR = 100μA) 5 V LED Junction Temperature 95 °C Operating Temperature Range -30 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Absolute Maximum Ratings at TA = 25°C Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) [1] @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100μA Thermal Resistance RθJ-PIN (°C/W) Part Number Typ. Max. Min. Typ. ASMT-CA00 1.9 2.4 5 400 Notes: 1. Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Peak Wavelength λpeak (nm) Dominant Wavelength λd [2] (nm) Viewing Angle 2 θ1/2 [3] (Degrees) Part Number Min. Typ. Typ. Typ. Typ. ASMT-CA00 28.5 90 595 592 150 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Light Intensity (IV) Bin Limits Color Bin Limits Intensity (mcd) Dominant Wavelength (nm) Bin ID Minimum Minimum Bin ID Minimum Maximum N 28.50 28.50 A 582.0 584.5 P 45.00 45.00 B 584.5 587.0 Q 71.50 71.50 C 587.0 589.5 R 112.50 112.50 D 589.5 592.0 E 592.0 594.5 Tolerance : ±15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Tolerance : ±1nm 1.0 100 FORWARD CURRENT - mA RELATIVE INTENSITY - % 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 10 1 0.1 0.0 500 550 600 650 0.1 700 1 1.5 2 FORWARD VOLTAGE - V WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength Figure 2. Forward current vs. forward voltage MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 DC FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current 2.5 30 30 25 20 15 10 5 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C Figure 4. Maximum forward current vs. ambient temperature 100 100 0.4 (0.016) RELATIVE INTENSITY 90 0.4 (0.016) 80 70 0.7 (0.028) 60 0.15 (0.006) 50 40 30 0.8 (0.031) 20 1.2 (0.047) 0.8 (0.031) CENTERING BOARD Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Radiation pattern Figure 6. Recommended soldering land pattern 10 to 30 SEC. 230°C MAX. TEMPERATURE TEMPERATURE 10 SEC. MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. 217 °C 200 °C 255 - 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150 °C 3°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 7. Recommended reflow soldering profile Figure 8. Recommended Pb-free reflow soldering profile USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) ∅13.1 ± 0.5 (∅0.516 ± 0.020) ∅20.20 MIN. ( ∅0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1.00 Æ 59.60 ± 1.00 PRINTED LABEL 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) ∅13.1 ± 0.5 (∅0.516 ± 0.020) ∅20.20 MIN. ( ∅0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) Æ 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 10. Reel dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. 4.00 ± 0.10 1.50 0.059 0.157 ± 0.004 DIM. C SEE TABLE 1 1.75 0.069 0.20 ± 0.02 0.008 ± 0.001 8.00 ± 0.30 0.315 ± 0.012 DIM. A SEE TABLE 1 DIM. B R 0.40 [ SEE TABLE 1 ] USER FEED DIRECTION CARRIER TAPE 2.00 ± 0.05 0.079 ± 0.002 4.00 0.157 Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 11. Tape dimensions COVER TAPE Table1. PART NUMBER DIM.A ± 0.10 (0.004) DIM.B ± 0.10 (0.004) DIM.C ± 0.10 (0.004) ASMT-CA00 1.75 (0.069) 1.10 (0.043) 0.60 (0.024) Dimensions In Millimeters (Inches) END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape leader and trailer dimensions Reflow Soldering For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition 5 to 30°C @ 60%RH max.Baking is required before mounting, if 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0586EN - July 28, 2007