AVAGO ASMT-QTC0

ASMT-QTC0-0xxxx
PLCC-4 Black Body Surface Mount Tricolor LED
Data Sheet
Description
Features
This family of SMT LEDs is packaged in the industry
standard PLCC-4 package with additional heat sinking
capability enabling it to be driven at even higher current.
These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range
of environmental conditions. This high reliability feature
makes them ideally suited to be used under indoor full
color signs application conditions.
• Industry Standard PLCC-4 package (Plastic Leaded Chip
Carrier) with additional heat sinking capability
To facilitate easy pick & place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin; except red color
to provide close uniformity.
• Compatible with reflow soldering process
These LEDs are compatible with reflow soldering process.
• Indoor full color display
• High reliability LED package with silicone encapsulation
• Full black LED body
• High brightness using AlInGaP and InGaN dice
technologies
• Wide viewing angle at 115º
• JEDEC MSL 2a
Applications
Its wide viewing angle at 115° together with the built
in reflector pushing up the intensity of the light output
makes these LED suitable to be used in the interior electronics signs. The full black body of the LED provides
extreme contrast enhancement for fine pitch and short
viewing distance full color display.
CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during
handling and processing. Please refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.00 ± 0.20
3.40 ± 0.20
2.50 ± 0.20
2.50 ± 0.20
0.15 ± 0.20
0.70 ± 0.20
0.97 ± 0.20
0.80 ± 0.10
1.34 ± 0.20
0.80 ± 0.20
Package
Marking
1.76 ± 0.20
3.60 ± 0.20
0.5 ± 0.1
3.20 ± 0.20
…2.90
Notes:
1. All Dimensions are in millimeters
2. Tolerance = ±0.2 mm unless otherwise specified
3. Terminal Finish: Ag plating
Lead Configuration
1
Cathode
Red
2
Common Anode
3
Cathode
Blue
4
Cathode
Green
Circuit Diagram
Figure 1. Package drawing
Table 1. Device Selection Guide
Part Number
ASMT-QTC0-0xxxx
Color 1
Color 2
Color 3
AlInGaP Red
InGaN Green
InGaN Blue
Color 1 - Red
Min. Iv @20mA
Part Number
ASMT-QTC0-0AA02
Color 2 - Green
Typ. Iv @20mA
Min. Iv @ 20mA
Color 3 - Blue
Typ. Iv @ 20mA
Min. Iv @ 20mA
Typ. Iv @ 20mA
Bin ID
(mcd)
(mcd)
Bin ID
(mcd)
(mcd)
Bin ID
(mcd)
(mcd)
S1
180
315
T1
285
470
R1
112.50
140
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. Tolerance = ± 12 %
Part Numbering System
A S M T –Q T C0– X1 X2 X3 X4 X5
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
Device Specification Configuration
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameter
Red
Green & Blue
Unit
DC forward current [1]
50
30
mA
Peak forward current [2]
100
100
mA
Power dissipation
120
117
mW
Reverse voltage
4V[3]
V
Maximum junction temperature Tj max
125
°C
- 40 to + 110[4]
°C
- 40 to + 110
°C
Operating temperature range
Storage temperature range
Note:
1. Derate linearly as shown in Figure 5a & 5b.
2 Duty Factor = 0.5%, Frequency = 500Hz
3. Driving the LED in reverse bias condition is suitable for short term only
4 Refer to Figure 5a and figure 5b for more information
Table 3. Optical Characteristics (TA = 25°C)
Dominant Wavelength,
λd (nm) [1]
Peak
Wavelength,
λp (nm)
Viewing Angle
2θ½[2] (Degrees)
Luminous
Efficacy ηV[3]
(lm/W)
Luminous
Efficiency ηe
(lm/W)
Total Flux /
Luminous
Intensity [4]
ΦV / IV (lm/cd)
Color
Min
Typ.
Max
Typ.
Typ.
Typ.
Typ.
Typ.
Red
618
621
628
629
115
200
22
2.60
Green
525
528
535
521
115
530
22
2.60
Blue
465
470
475
465
115
70
5
2.60
Notes:
1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. θ½ is the off axis angle where the luminous intensity is ½ the peak intensity
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / ηV, where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens / watt.
4. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse condition.
Table 4. Electrical Characteristics (TA = 25°C)
Forward Voltage,
VF (V) [1]
Reverse Voltage
VR @ 100µA
Reverse Voltage
VR @ 10µA
Thermal Resistance
RθJ-P (°C/W)
Color
Min
Typ.
Max.
Min.
Min.
Typ.
Red
1.80
2.10
2.40
4
-
95
Green
­2.80
3.20
3.90
-
4
70
Blue
2.80
3.20
3.90
-
4
60
RELATIVERELATIVE
INTENSITYINTENSITY
1.0
0.8
1.0
0.6
0.8
InGaN Blue
InGaN Green
AlInGaP Red
InGaN Blue
InGaN Green
AlInGaP Red
FORWARDFORWARD
CURRENTCURRENT
- mA
- mA
Note:
1. Tolerance ± 0.1V
0.4
0.6
0.2
0.4
0.0
0.2
380
430
530 580 630
WAVELENGTH - nm
680
730
780
380 430 480 530 580 630
Figure 2. Relative intensity vs. wavelength
WAVELENGTH - nm
680
730
780
RELATIVERELATIVE
LUMINOUSLUMINOUS
INTENSITYINTENSITY
(NORMALIZATION
(NORMALIZATION
AT 20 mA)AT 20 mA)
0.0
480
3.00
2.50
3.00
AlInGaP
2.00
2.50
AlInGaP
1.50
2.00
InGaN
1.00
1.50
InGaN
0.50
1.00
0.00
0.50 0
0.00
0
10
20
30
40
DC FORWARD CURRENT - mA
50
60
10
20
30
40
DC FORWARD CURRENT - mA
50
60
Figure 4. Relative Intensity vs. forward current
50
45
40
50
35
45
30
40
25
35
20
30
15
25
10
20
155
100
AlInGaP
AlInGaP
InGaN
0
1
InGaN
2
3
FORWARD VOLTAGE - V
5
0
0
1 forward voltage
2
3
Figure 3. Forward
current vs.
FORWARD VOLTAGE - V
4
4
60
MAX. ALLOWABLE DC CURRENT (mA)
MAX. ALLOWABLE DC CURRENT (mA)
60
AlInGaP
50
40
30 InGaN
20
10
0
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
100
50
40
30 InGaN
20
10
0
120
DOMINANT WAVELENGTH SHIFT- nm
(NORMALIZED AT 20mA)
NORMALIZED INTENSITY
1
0.9
0.8
0.7
0.6
0.5
0.4
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
100
120
7
6
5
4
Green
Blue
Red
10
20
30
40
50
Figure 7. Dominant wavelength shift (normalized at 20mA) vs. forward
current
0.30
Red
Green
Blue
1
-25
0
25
50
75
TJ - JUNCTION TEMPERATURE - °C
Figure 8. Relative Intensity Shift vs Junction Temperature
100
Green
Red
Blue
0.20
FORWARD VOLTAGE SHIFT - V
NORMALIZED LUMINOUS INTENSITY
40
60
80
AMBIENT TEMPERATURE (°C)
FORWARD CURRENT - mA
10
20
3
2
1
0
-1 0
-2
-3
90
Figure 6. Radiation pattern.
0.1
-50
0
Figure 5b. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C. (single chip)
Figure 5a. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C.(3 chips)
0.3
0.2
0.1
0
AlInGaP
125
0.10
0.00
-0.10
-0.20
-0.30
-0.40
-50
-25
0
25
50
75
TJ - JUNCTION TEMPERATURE - °C
Figure 9. Forward Voltage Shift vs Junction Temperature
100
125
0.8
(2)
0.80 x 4
0.90 x 4
(3)
C
A
Package
Marking
1.1
(1)
A
A
C
C
7. 0
1.2 x 2
0. 4
3.8
0. 4
(4)
Solder Mask
A
C
Anode
1.2
Cathode
0.75 x 2
7. 0
Figure 10. Recommended soldering land pattern.
20 SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 11. Recommended leaded reflow soldering profile
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
217°C
200°C
255 - 260 °C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
TIME
Figure 12. Recommended Pb-free reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT
LED Indicator Components
1.75 ± 0.10
2.00 ± 0.05
8.00 ± 0.10
4.00 ± 0.10
1.50
5.50 ± 0.05
+ 0.10
- 0
12.00
C
- 0.10
0.279 ± 0.10
2.20 ± 0.10
Figure 13. Carrier Tape Dimension
1.4
∅ 180 ± 1
Figure 14. Reel Dimension
USER FEED DIRECTION
PIN 1
PRINTED LABEL
Figure 15. Reeling Orientation
C
+ 0.30
1.50 ± 0.25
Label Area
2.20 ± 0.10
∅ 60.0 ± 0.5
13.4 ± 0.5
16.2 ± 0.5
A
Intensity Bin Select (X2, X3)
Intensity Bin Limits
Individual reel will contain parts from 1 half bin only
Bin ID
Min (mcd)
Max (mcd)
R1
112.5
140.0
R2
140.0
180.0
Blue
S1
180.0
224.0
Min Iv Bin (Minimum Intensity Bin)
X2
Red
Green
0
0
0
0
S2
224.0
285.0
A
SI
T1
R1
T1
285.0
355.0
T2
355.0
450.0
U1
450.0
560.0
U2
560.0
715.0
Number of Half bin from X2
X3
Red
Green
Blue
0
0
0
0
A
4
4
4
Note: 0 represents no maximum bin limit
Tolerance of each bin limit ± 12%
Color Bin Limits
Red
Color Bin Select (X4)
Individual Reel will contain part from 1 full bin only
Full
distribution
Green
Color Bin Combinations
Min (nm)
Max (nm)
618.0
628.0
Min (nm)
Max (nm)
X4
Red
Green
Blue
C
525.0
530.0
0
Full
distribution
C&D
B&C
D
530.0
535.0
Min (nm)
Max (nm)
B
465.0
470.0
C
470.0
475.0
Blue
Tolerance of each bin limit is ± 1 nm
Packaging Option (X5)
Option
Test Current
Package Type
Reel Size
2
20mA
Top mount
7 inch
CIE 1931 - Chromaticity Diagram
0.90
0.80
C D
0.70
Green
Y - COORDINATE
0.60
0.50
0.40
Red
0.30
0.20
Blue
0.10
0.00
C
0.00
0.10
B
0.20
0.30
0.40
0.50
X-COORDINATE
0.60
0.70
0.80
Handling Precaution
B. Control after opening the MBB
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail information.
• The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
Moisture Sensitivity
• For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
• Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reflow the LEDs per the
original MSL rating.
• It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
For product information and a complete list of distributors, please go to our web site:
• The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
D. Control of assembled boards
• If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their floor
life of 672 hours
E. Baking is required if:
• “10%” or “15%” HIC indicator turns pink
• The LEDs are exposed to condition of >30°C / 60% RH
at any time.
• The Led floor life exceeded 672hrs.
Recommended baking condition: 60±5ºC for 20hrs
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Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved.
AV02 -1038EN - March 4, 2008