AVAGO HSMX-A46X

HSMx-A46x-xxxxx
SMT LED Surface Mount LED Indicator
Data Sheet
Description
Features
The Power PLCC-4 SMT LED with Lens are high performance PLCC-4 package size SMT LEDs targeted mainly
in Automotive & Electronics Signs and Signals (ESS)
markets. These top-mount single-chip packages with
focused radiation offer high brightness in beam direction and are excellent for interior automotive, indoor
and outdoor sign and industrial applications. With additional lens in 50° variants, these products are especially fitting to applications for Mono-color Text Display,
CHMSL and displays.
• Industry standard PLCC-4
The PLCC-4 package family is able to dissipate heat better compared to the PLCC-2 packages. In proportion
to this increase in driving current, this family of LEDs is
able to produce higher light output compared to the
conventional PLCC-2 SMT LEDs.
As an extension of the standard flat top PLCC-4 SMT
LEDs, the Power PLCC-4 with Lens device is able to provide focused beams within narrow viewing angles (50°)
meeting the market’s requirements for focused radiation and high brightness in beam directions.
The Power PLCC-4 SMT LED with 50° is ideal for panel,
push button, general backlighting, automotive interior
& exterior (cluster backlighting, side repeaters, brake
lights), sign and symbol illumination, office equipment,
industrial equipment and home appliances applications. This package design coupled with careful selection of component materials allow the Power PLCC-4
SMT LED with Lens to perform with higher reliability
in a larger temperature range -40°C to 100°C. This high
reliability feature is crucial to allow the Power PLCC-4
SMT LED with Lens to do well in harsh environments
such as its target Automotive & ESS markets. The Power
PLCC4 SMT LED with Lens package is also designed to
be compatible with both IR-solder re-flow and throughthe-wave soldering.
• High reliability LED package
• High brightness using AlInGaP dice technologies
• High optical efficiency
• Narrow Viewing angle at 50°
• Available in 8mm carrier tape on 7-inch reel
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Side repeaters
• Office automation, home appliances, industrial
equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
Package Drawing
Note:
1. All Dimensions in millimeters.
2. Terminal Finish: Ag plating
3. Electrical connection between all cathode is recommended
Figure 1. Package Drawing
Pin
HSMx-A46x
Lead Configuration
1
Cathode
2
Anode
3
Cathode
4
Cathode
Table 1. Device Selection Guide
Luminous Intensity, FV [1] (mcd)
Color
Part Number
Min. Iv (mcd)
Typ. Iv (mcd)
Max. Iv (mcd)
Test Current (mA)
Dice Technology
Amber
HSMA-A460-W50M1
1125
2100
3550
50
AlInGaP
Amber
HSMA-A461-X83M1
2240
3300
5600
50
AlInGaP
Red
HSMC-A460-U30M1
450
580
900
50
AlInGaP
Red
HSMC-A461-V00M1
715
1750
-
50
AlInGaP
Orange
HSML-A461-W40M1
1125
1850
2850
50
AlInGaP
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not
be aligned with this axis.
2. Tolerance = ±12%
Part Numbering System
H S M x 1 − A x 2 x3 x4 − x5 x6 x7 x8 x9
Packaging Option
Color Bin Selection
Intensity Bin Selection
Device Specific Configuration
Package Type
LED Chip Color
Table 2. Absolute Maximum Ratings (TA = 25 °C)
Parameters
HSMA/C/L
DC Forward Current [1]
70 mA
Peak Forward Current [2]
200 mA
Power Dissipation
180 mW
Reverse Voltage
5V
Junction Temperature
110°C
Operating Temperature
-40 °C to +100 °C
Storage Temperature
-40 °C to +100 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TA = 25 °C)
Dice
Technology
Peak
Wavelength
lPEAK
(nm)
Dominant
Wavelength
lD [1]
(nm)
Viewing
Angle
2q½ [2]
(Degrees)
Luminous
Efficacy
hV [3]
(lm/W)
Luminous
Efficiency
he (lm/W)
Luminous
Intensity/ Total
Flux [4, 5]
IV (cd) / FV (lm)
Typ.
Typ.
Typ.
Typ.
Typ.
Typ.
Color
Part
Number
Amber
HSMA-A46x
AlInGaP
592
590
50
480
22
1.35
Red
HSMC-A46x
AlInGaP
635
626
50
150
19
1.15
Orange
HSML-A46x
AlInGaP
609
605
50
320
23
1.05
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device.
2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and
hV is the luminous efficacy in lumens / watt.
4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Table 4. Electrical Characteristics (TA = 25 °C)
Reverse Voltage
VR @ 100mA
Part Number
Typ.
Max.
Min.
Thermal
Resistance
RqJ-P (°C/W)
HSMA-A46x
2.20
2.50
5
110
HSMC-A46x
2.20
2.50
5
110
HSML-A46x
2.20
2.50
5
110
Forward Voltage VF (Volts) @ IF = 50 mA
1.0
0.9
AlInGaP Orange
RELATIVE INTENSITY
0.8
AlInGaP Amber
0.7
AlInGaP Red
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
680
730
780
WAVELENGTH - nm
80
1.6
70
1.4
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 50 mA)
FORWARD CURRENT - mA
Figure 2. Relative Intensity Vs. Wavelength
60
50
HSMA/C/L
40
30
20
0
0.5
1
1.5
2
2.5
Figure 3. Forward Current Vs. Forward Voltage.
0.8
0.6
0.4
NORMALIZED LUMINOUS INTENSITY
2
AlInGaP Amber
AlInGaP Orange
1.5
AlInGaP Red
1
0.5
-25
0
0
25
50
75
AMBIENT TEMPERATURE - °C
Figure 5. Relative Intensity Vs. Temperature
0
10
20
30
40
100
125
50
60
DC FORWARD CURRENT - mA
Figure 4. Relative Intensity Vs. Forward Current
2.5
1
0
FORWARD VOLTAGE - V
-50
HSMA
1.2
0.2
10
0
HSMC/L
70
80
80
MAXIMUM FORWARD CURRENT - mA
MAXIMUM FORWARD CURRENT - mA
80
Rθ JA = 300°C/W
60
Rθ JA= 350°C/W
40
Rθ JA= 470°C/W
20
0
0
20
40
60
80
AMBIENT TEMPERATURE - °C
100
40
20
0
120
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on TJMAX = 110°C, RqJ-A= 300°C/W, 350°C/W and 470°C/W.
60
0
20
0.15
DOMINANT WAVELENGTH - nm
FORWARD VOLTAGE SHIFT - V
AlInGaP Red
625
620
615
610
AlInGaP Orange
605
600
595
AlInGaP Amber
590
0
10
20
30
40
50
FORWARD CURRENT - mA
60
70
80
Figure 7. Dominant Wavelength Vs. Forward Current.
1
NORMALIZED INTENSITY
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 9. Radiation Pattern
0.1
0.05
-50
-25
0
0
25
90
50
-0.05
-0.1
-0.15
JUNCTION TEMPERATURE - °C
Figure 8. Forward Voltage Shift Vs. Temperature.
0.9
0
120
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 110°C, RqJ-P = 110°C/W.
630
585
40
60
80
100
SOLDER POINT TEMPERATURE (°C)
75
100
TEMPERATURE
10 to 20 SEC.
255 ˚C +5˚C
-0˚C
217˚C
-6˚C/SEC MAX.
3˚C/SEC MAX.
125˚C +/- 25˚C
60-150 SEC.
MAX. 120 SEC.
TIME
Figure 10. Recommended Pb-free Reflow Soldering Profile.
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
X
2.60
(0.103)
X
0.40 (0.016)
1.10
(0.043)
0.50
(0.020)
Y
4.50 (0.178)
1.50 (0.059)
Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Thermal
Resistance
Solder pad
area (xy)
300°C/W
>16mm2
350°C/W
>12mm2
470°C/W
>8mm2
Figure 11a. Recommended Soldering Pad Patter
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
DIMENSIONS IN mm (INCHES).
Figure 11b. Recommended Soldering Pad Patter (TTW)
1.0 (0.039)
2.0 (0.079)
Y
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
Figure 12. Soft Tip Vacuum Pick-up Tool for extracting SMT LED Components from Carrier Tape.
TRAILER
200 mm MIN. FOR ∅ 180 REEL.
200 mm MIN. FOR ∅ 330 REEL.
COMPONENT
LEADER
480 mm MIN. FOR ∅ 180 REEL.
960 mm MIN. FOR ∅ 330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Tape Leader and Trailer Dimensions.
Figure 14. Tape Dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 15. Reeling Orientation.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level xx per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the
original MSL rating.
- It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering,
curing or rework need to be completed within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be
stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of
672 hours.
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C / 60% RH at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
Intensity Bin Select (X5X6)
Color Bin Select (X7)
Individual reel will contain parts from one half bin only
Individual reel will contain parts from one full bin only.
X5
X7
Min IV Bin
X6
0
Full Distribution
0
Full Distribution
Z
A and B only
2
2 half bins starting from X51
Y
B and C only
3
3 half bins starting from X51
W
C and D only
4
4 half bins starting from X51
V
D and E only
5
5 half bins starting from X51
U
E and F only
6
2 half bins starting from X52
Q
A, B and C only
7
3 half bins starting from X52
P
B, C and D only
8
4 half bins starting from X52
N
C, D and E only
9
5 half bins starting from X52
M
D, E and F only
1
A, B, C and D only
3
B, C, D and E only
C, D, E and F only
Intensity Bin Limits
Bin ID
Min. (mcd)
Max. (mcd)
4
U1
450.00
560.00
5
A, B, C, D and E only
U2
560.00
715.00
6
B, C, D, E, and F only
V1
715.00
900.00
V2
900.00
1125.00
W1
1125.00
1400.00
Amber
Min. (nm)
Max. (nm)
W2
1400.00
1800.00
A
582.0
584.5
X1
1800.00
2240.00
B
584.5
587.0
X2
2240.00
2850.00
C
587.0
589.5
Y1
2850.00
3550.00
D
589.5
592.0
Y2
3550.00
4500.00
E
592.0
594.5
Z1
4500.00
5600.00
F
594.5
597.0
Z2
5600.00
7150.00
11
7150.00
9000.00
Orange
Min. (nm)
Max. (nm)
12
9000.00
11250.00
A
597.0
600.0
21
11250.00
14000.00
B
600.0
603.0
22
14000.00
18000.00
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
Red
Min. (nm)
Max. (nm)
Full Distribution
620.0
635.0
Tolerance of each bin limit = ± 12%
Color Bin Limits
Tolerance of each bin limit = ±1nm
Packaging Option (X8 X9)
Option
Test Current
Package Type
Reel Size
M1
50mA
Top Mount
7
VF Bin Limits
Bin ID
Min.
Max.
VA
1.9
2.2
VB
2.2
2.5
VC
2.5
2.8
VD
2.8
3.1
VE
3.1
3.4
Tolerance of each bin limit = ±0.1V
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0529EN - June 26, 2007