AZM AZ100ELT20

ARIZONA MICROTEK, INC.
AZ10ELT20
AZ100ELT20
CMOS/TTL to Differential PECL Translator
PACKAGE AVAILABILITY
FEATURES
•
•
•
•
•
•
•
PACKAGE
0.5ns Typical Propagation Delay
Differential PECL Outputs
Flow Through Pinouts
Operating Range of +3.0V to +5.5V
Direct Replacement for ON Semi
MC10ELT20, MC100ELT20,
MC100LVELT20 & Micrel
SY89329V
Available in 2x2 and 3x3 mm MLP
Packages
IBIS Model Files Available on
Arizona Microtek Website
MLP 8 (2x2x0.75)
MLP 8 (2x2x0.75)
Green / RoHS
Compliant / Lead
(Pb) Free
MLP 16 (3x3)
Green / RoHS
Compliant / Lead
(Pb) Free
MARKING
NOTES
AZ100ELT20N
TC
<Date Code>
1,2
AZ100ELT20NG
TCG
<Date Code>
1,2
AZ10/100ELT20LG
AZMG
T20
<Date Code>
1,2
SOIC 8
AZ10ELT20D
SOIC 8
AZ100ELT20D
SOIC 8 Green /
RoHS Compliant /
Lead (Pb) Free
TSSOP 8 Green /
RoHS Compliant /
Lead (Pb) Free
DIE
DESCRIPTION
PART NUMBER
1
2
AZM10
ELT20
AZM100
ELT20
1,2,3
1,2,3
AZ100ELT20DG
AZM100G
ELT20
1,2,3
AZ100ELT20TG
AZHG
LT20
1,2,3
AZ10/100ELT20XP
N/A
4
Add R1 at end of part number for 7 inch (1K parts), R2 for 13 inch (2.5K
parts) Tape & Reel.
Date code format: “Y” or “YY” for year followed by “WW” for week.
Date code “YWW” or “YYWW” on underside of part.
Waffle Pack.
3
The
AZ10/100ELT20
is
a
4
CMOS/TTL to differential PECL
translator. It operates with a single power
supply of +3.0 to +5.5 volts, making it ideal for both LVCMOS/LVTTL and CMOS/TTL applications. The
extremely small MLP 8 2x2 mm package makes it ideal for those applications where space, performance and low
power are at a premium.
When the D input is left floating, the Q output is forced HIGH, and the Q
¯ output is forced LOW.
The ELT20 is available in both PECL standards: the AZ10ELT20 is compatible with PECL 10K logic levels
while the AZ100ELT20 is compatible with PECL 100K logic levels.
NOTE: Specifications in the PECL tables are valid when thermal equilibrium is established.
BLOCK DIAGRAM
Q
D
Q
1630 S. STAPLEY DR., SUITE 127 • MESA, ARIZONA 85204 • USA • (480) 962-5881 • FAX (480) 890-2541
www.azmicrotek.com
AZ10ELT20
AZ100ELT20
Absolute Maximum Ratings are those values beyond which device life may be impaired.
Symbol
VCC
VIN
IOUT
TA
TSTG
Characteristic
DC Supply Voltage (Referenced to GND)
Input Voltage
Current Applied to Output in Low Output State
Value
0 to +8.0
0 to +6.0
50
100
-40 to +85
-65 to +150
— Continuous
— Surge
Operating Temperature Range (In Free-Air)
Storage Temperature Range
Unit
V
V
mA
°C
°C
TTL/CMOS INPUT DC CHARACTERISTICS (GND = 0.0V, VCC = +3.0V to +5.5V)
Symbol
IIH
IIHH
IIL
VIK
VIH
VIL
Characteristic
Input HIGH Current
Input HIGH Current
Input LOW Current
Input Clamp Diode Voltage
Input HIGH Voltage
Input LOW Voltage
Min
Typ
Max
15
20
-0.1
-1.2
Unit
μA
μA
mA
V
V
V
2.0
0.8
Condition
VIN = 2.7V
VIN = VCC
VIN = 0.5V
IIN = -18mA
10K LVPECL DC Characteristics (GND = 0.0V, VCC = +3.3V)
Symbol
Characteristic
1,2
Min
2220
1350
-40°C
Typ
Max
2410
1650
16
VOH
Output HIGH Voltage
VOL
Output LOW Voltage1,2
ICC
Power Supply Current3
1.
Output parameters vary 1:1 with VCC.
2.
Each output is terminated through a 50Ω resistor to VCC – 2V.
3.
ICC measurements must be done with outputs open.
Min
2280
1350
0°C
Typ
Max
2460
1670
16
Min
2320
1350
Max
4160
3370
16
Min
4020
3050
Max
2420
1680
16
Min
2275
1400
Max
4120
3380
16
Min
3975
3100
25°C
Typ
Max
2490
1670
16
Min
2390
1350
Max
4190
3370
16
Min
4090
3050
Max
2420
1680
16
Min
2275
1400
Max
4120
3380
16
Min
3975
3100
85°C
Typ
Max
2580
1705
16
Unit
mV
mV
mA
10K PECL DC Characteristics (GND = 0.0V, VCC = +5.0V)
Symbol
Characteristic
1,2
Min
3920
3050
-40°C
Typ
Max
4110
3350
16
VOH
Output HIGH Voltage
VOL
Output LOW Voltage1,2
ICC
Power Supply Current3
1.
Output parameters vary 1:1 with VCC.
2.
Each output is terminated through a 50Ω resistor to VCC – 2V.
3.
ICC measurements must be done with outputs open.
Min
3980
3050
0°C
Typ
25°C
Typ
85°C
Typ
Max
4280
3405
16
Unit
mV
mV
mA
100K LVPECL DC Characteristics (GND = 0.0V, VCC = +3.3V)
Symbol
Characteristic
1,2
Min
2220
1400
-40°C
Typ
Max
2420
1750
16
VOH
Output HIGH Voltage
VOL
Output LOW Voltage1,2
ICC
Power Supply Current3
1.
Output parameters vary 1:1 with VCC.
2.
Each output is terminated through a 50Ω resistor to VCC – 2V.
3.
ICC measurements must be done with outputs open.
Min
2275
1400
0°C
Typ
25°C
Typ
85°C
Typ
Max
2420
1680
16
Unit
mV
mV
mA
100K PECL DC Characteristics (GND = 0.0V, VCC = +5.0V)
Symbol
Characteristic
1,2
Min
3920
3100
-40°C
Typ
Max
4120
3450
16
VOH
Output HIGH Voltage
VOL
Output LOW Voltage1,2
ICC
Power Supply Current3
1.
Output parameters vary 1:1 with VCC.
2.
Each output is terminated through a 50Ω resistor to VCC – 2V.
3.
ICC measurements must be done with outputs open.
April 2008 * REV - 19
Min
3975
3100
0°C
Typ
www.azmicrotek.com
2
25°C
Typ
85°C
Typ
Max
4120
3380
16
Unit
mV
mV
mA
AZ10ELT20
AZ100ELT20
AC CHARACTERISTICS (GND = 0.0V, VCC = +3.0V to +5.5V)
-400C
0°C
25°C
85°C
Unit
Min
Max
Min
Max
Min
Typ
Max
Min
Max
1
tPLH/tPHL
Propagation Delay
100
550
100
500
100
450
100
600
ps
tr/tf
Output Rise/Fall Time
80
250
80
250
80
250
80
250
ps
fMAX
Maximum Frequency2
800
800
800
800
MHz
1.
Propagation delay is measured from +1.5V on the input to 50% of the PECL output swing. Input rise/fall times are < 1ns/V.
2.
Output at –3 dB.
Symbol
Characteristic
850
Single ended Output (mV p-p)
750
650
Input: 150mV p-p Sine
Wave Single Ended
550
450
350
250
150
1
10
100
Frequency (MHz)
Large Signal Bandwidth
April 2008 * REV - 19
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3
1000
10000
Condition
20-80%
AZ10ELT20
AZ100ELT20
PIN DESCRIPTION
PIN
FUNCTION
Differential PECL Outputs
TTL/CMOS Input
Ground
Positive Supply
No Connect, Leave Open
Except as Noted
10K/100K Mode Select
Q, Q
¯
D
GND
VCC
NC
10K
AZ100ELT20N
MLP 8, 2x2mm
NC 1
8
VCC
Q
2
7
D
Q
3
6
NC
NC 4
TOP VIEW
MLP 16 (L) Package and DIE:
10K/100K Selection
Connect pin/pad 10K to GND to select
10K operation. Float (NC) pin/pad 10K
to select 100K operation. GND
connection must be less than 1Ω.
Pin 8 of the MLP 16 package may be
connected to pin 7 (GND) with no effect
on the circuit.
5 GND
Leave Center Bottom Pad open or connect to GND.
AZ10ELT20D
AZ100ELT20D
AZ100ELT20T
AZ10/100ELT20L
NC
1
8
V CC
Q
1
Q
2
7
D
NC
2
NC
3
Q
4
Q
NC
3
SOIC 8
TSSOP 8
4
6
5
NC
NC
VCC
16
15
14
NC
13
MLP 16
3x3mm
12
NC
11
D
10
NC
9
NC
Top View
NC
GND
5
6
NC
10K
7
GND
8
NC
Leave Center Bottom Pad open or connect to GND.
April 2008 * REV - 19
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4
AZ10ELT20
AZ100ELT20
DIE PAD COORDINATES
AZ10/100ELT20 DIE:
ELT20 22
A
B
C
D
L
M
K
J
DIE SIZE: 950u X 940u
DIE THICKNESS: 14 mils
I
BOND PAD: 85u X 85u
H
E
F
G
Note: Other die thicknesses available. Contact factory for further information.
The die backside may be left open or connected to GND.
PAD CENTER COORDINATES
NAME
A
B
C
D
E
F
G
H
I
J
K
L
M
PAD DESIGNATION
NC
NC
D
NC
VCC
VCC
Q
Q
¯
NC
NC
NC
10K
GND
NC = No connect, leave open.
April 2008 * REV - 19
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5
X(Microns)
-342.5
-342.5
-342.5
-342.5
-33.5
126.5
312.5
312.5
312.5
312.5
302.5
142.5
-140.5
Y(Microns)
312.5
144.5
-87.0
-255.0
-312.5
-312.5
-248.5
-98.5
51.5
201.5
342.5
342.5
342.5
AZ10ELT20
AZ100ELT20
PACKAGE DIAGRAM
MLP 8 2x2mm
Pin 1 Dot
By Marking
2.000±0.050
MLP 8
(2x2mm)
2.000±0.050
TOP VIEW
Pin 1 Identification
R0.100 TYP
0.350±0.050
0.250±0.050
0.500 bsc
8
1
7
6
2 1.200±0.050
exp. pad
3
5
4
0.600±0.050
exp. pad
BOTTOM VIEW
0.750±0.050
0.000-0.050
1
2
SIDE VIEW
Note: All dimensions are in mm
April 2008 * REV - 19
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6
3 4
0.203±0.025
1.750
Ref.
AZ10ELT20
AZ100ELT20
PACKAGE DIAGRAM
SOIC 8
NOTES:
1.
DIMENSIONS D AND E DO NOT
INCLUDE MOLD PROTRUSION.
2.
MAXIMUM MOLD PROTRUSION
FOR D IS 0.15mm.
3.
MAXIMUM MOLD PROTRUSION
FOR E IS 0.25mm.
April 2008 * REV - 19
DIM
A
A1
A2
A3
bp
c
D
E
e
HE
L
Lp
Q
v
w
y
Z
θ
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7
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
1.28
1.57
0.25
0.36
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27
5.80
6.20
1.05
0.40
1.27
0.60
0.70
0.25
0.25
0.10
0.30
0.70
8O
0O
INCHES
MIN
MAX
.053
0.069
0.004
0.010
0.050
0.062
0.01
0.014
0.019
0.0075
0.0100
0.19
0.20
0.15
0.16
0.050
0.228
0.244
0.041
0.016
0.050
0.024
0.028
0.01
0.01
0.004
0.012
0.028
0O
8O
AZ10ELT20
AZ100ELT20
PACKAGE DIAGRAM
TSSOP 8
DIM
A
A1
A2
A3
bp
c
D
E
e
HE
L
Lp
v
w
y
Z
θ
NOTES:
1.
DIMENSIONS D AND E DO NOT
INCLUDE MOLD PROTRUSION.
2.
MAXIMUM MOLD PROTRUSION
FOR D IS 0.15mm.
3.
MAXIMUM MOLD PROTRUSION
FOR E IS 0.25mm.
April 2008 * REV - 19
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8
MILLIMETERS
MIN
MAX
1.10
0.05
0.15
0.75
0.95
0.25
0.22
0.40
0.13
0.23
2.90
3.10
2.90
3.10
0.65
4.75
5.05
0.95
0.40
0.70
0.10
0.08
0.10
0.38
0.64
6O
0O
AZ10ELT20
AZ100ELT20
PACKAGE DIAGRAM
MLP 16 3x3mm
A
D
D
2
2.
INDEX AREA
(D/2 x E/2)
D2
D2/2
B
E2/2
E2
E
2
3x
E
e
2
e
2x
1
aaa C
2x
aaa C
TOP VIEW
bbb M C A B
5.
16 x b
L
3.
3x e
BOTTOM VIEW
ccc C
A3
A
4.
0.08 C
A1
SIDE
VIEW
C
SEATING
PLANE
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING
CONFORM TO ASME T14-1994.
2. THE TERMINAL #1 AND PAD
NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012.
3. DIMENSION b APPLIES TO METALLIZED
PAD AND IS MEASURED BETWEEN 0.25
AND 0.30 mm FROM PAD TIP.
4. COPLANARITY APPLIES TO THE
EXPOSED PADS AS WELL AS THE
TERMINALS.
5. INSIDE CORNERS OF METALLIZED PAD
MAY BE SQUARE OR ROUNDED
April 2008 * REV - 19
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9
DIM
A
A1
A3
b
D
D2
E
E2
e
L
aaa
bbb
ccc
MIN
MAX
0.80
1.00
0.05
0.00
0.25 REF
0.18
0.30
3.10
2.90
1.95
0.25
3.10
2.90
1.95
0.25
0.50 BSC
0.50
0.30
0.25
0.10
0.10
AZ10ELT20
AZ100ELT20
Arizona Microtek, Inc. reserves the right to change circuitry and specifications at any time without prior notice. Arizona Microtek, Inc.
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Arizona
Microtek, Inc. assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Arizona Microtek, Inc. does not convey any license
rights nor the rights of others. Arizona Microtek, Inc. products are not designed, intended or authorized for use as components in systems
intended to support or sustain life, or for any other application in which the failure of the Arizona Microtek, Inc. product could create a
situation where personal injury or death may occur. Should Buyer purchase or use Arizona Microtek, Inc. products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Arizona Microtek, Inc. and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly
or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Arizona Microtek, Inc. was negligent regarding the design or manufacture of the part.
April 2008 * REV - 19
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10