BB BUF20820AIDCPRE4

BUF20820
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
18-Channel GAMMA VOLTAGE GENERATOR
with Two Programmable VCOM Channels
FEATURES
APPLICATIONS
D REPLACES RESISTOR-BASED GAMMA
D 18-CHANNEL GAMMA CORRECTION
D 2-CHANNEL PROGRAMMABLE VCOM:
D
D
100mA IOUT
D
D
D
D
D
D
D
ON-CHIP OTP MEMORY
10-BIT RESOLUTION
DESCRIPTION
RAIL-TO-RAIL OUTPUT
The BUF20820 is a programmable voltage reference
generator designed for gamma correction in TFT-LCD
panels. It provides 18 programmable outputs for gamma
correction and two channels for VCOM adjustment, each
with 10-bit resolution. It offers on-chip One-Time
Programmable (OTP) memory that allows the user to store
the gamma voltages on-chip. This eliminates the need for
an external EEPROM.
LOW SUPPLY CURRENT: 900µA/ch
SUPPLY VOLTAGE: 7V to 18V
DIGITAL SUPPLY: 2.0V to 5.5V
INDUSTRY-STANDARD, TWO-WIRE
INTERFACE: 3.4MHz HIGH-SPEED MODE
D HIGH ESD RATING:
4kV HBM, 1kV CDM, 200V MM
This programmability replaces the traditional, timeconsuming process of changing resistor values to optimize
the various gamma voltages and allows designers to
determine the correct gamma voltages for a panel very
quickly. Required voltage changes can also be easily
implemented without hardware changes.
D DEMO BOARD AND SOFTWARE AVAILABLE
2V−5.5V
7V−18V
Digital
Analog
REFH
BUF20820
REFH OUT
OUT 1
…
DAC Registers 2
DAC Registers 1
…
…
OTP Memory
Program Command
The BUF20820 uses TI’s latest, small-geometry analog
CMOS process, which makes it a very competitive choice
for full production, not just evaluation.
Programming of each output occurs through an industrystandard, two-wire serial interface. Unlike existing
programmable buffers, the BUF20820 offers a high-speed
mode that allows clock speeds up to 3.4MHz.
OUT 2
18 Output Channels plus
Two VCOM Channels
For lower or higher channel count, please contact your
local sales or marketing representative.
OUT 17
The BUF20820 is available in an HTSSOP-38
PowerPAD package. It is specified from −40°C to +85°C.
OUT 18
BUF20820 RELATED PRODUCTS
VCOM OUT1
VCOM OUT2
REFL OUT
SDA
Control IF
SCL
LD
SOLUTIONS
TFT-LCD REFERENCE DRIVERS
DYNAMIC GAMMA CONTROL
AO
REFL
FEATURES
PRODUCT
18-Channel Programmable, Two VCOM
12-Channel Programmable Buffer, 10-Bit
Programmable VCOM with Memory
10-Channel Gamma Correction Buffer, Int VCOM,
18V Operating Supply Voltage
High-Speed VCOM, 1 and 2 Channels
Complete LCD DC/DC Solution
BUF20800
BUF12800
BUF01900
BUF11704
SN10501
TPS651xx
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners.
Copyright  2005−2006, Texas Instruments Incorporated
! ! www.ti.com
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +19V
Supply Voltage, VSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
Signal Input Terminals, SCL, SDA, AO, LD:
Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to +6V
Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10mA
Output Short Circuit(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to +95°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
ESD Rating:
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV
Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1kV
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is
not supported.
(2) Short-circuit to ground.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
BUF20820
HTSSOP-38
DCP
PACKAGE MARKING
BUF20820
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
2
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = −40°C to +85°C.
At TA = +25°C, VS = 18V, VSD = 5V, VREFH = 17V, VREFL = 1V, RL = 1.5kΩ connected to ground, and CL = 200pF, unless otherwise noted.
BUF20820
PARAMETER
ANALOG
Gamma Output Swing—High
Gamma Output Swing—Low
VCOM Buffer Output Swing—High
VCOM Buffer Output Swing—Low
Output Current
REFH Input Range(1)
REFL Input Range(1)
Integral Nonlinearity
Differential Nonlinearity
Gain Error
Program to Out Delay
Output Accuracy
over Temperature
Input Resistance at VREFH and VREFL
Load Regulation, All References
40mA, All Channels
ANALOG POWER SUPPLY
Operating Range(2)
Total Analog Supply Current
over Temperature
DIGITAL
Logic 1 Input Voltage
Logic 0 Input Voltage
Logic 0 Output Voltage
Input Leakage
Clock Frequency
DIGITAL POWER SUPPLY
Operating Voltage Range
Digital Supply Current(3)
over Temperature
TEMPERATURE
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Resistance, HTSSOP-38
Junction-to-Ambient
Junction-to-Case
INL
DNL
CONDITIONS
MIN
OUT1−9, REFH OUT, Sourcing 10mA, VREFH = 17.8V, Code 1023
OUT10−18, REFL OUT, Sourcing 10mA, VREFH = 17.8V, Code 1023
OUT1−9, REFH OUT, Sinking 10mA, VREFL = 0.2V, Code 00
OUT10−18, REFL OUT, Sinking 10mA, VREFL = 0.2V, Code 00
VCOM, Sourcing 100mA, VREFH = 17.8V
VCOM, Sinking 100mA, VREFL = 0.2V
17.7
17.0
No Load, VREFH = 17V, VREFL = 1V
No Load, VREFH = 17V, VREFL = 1V
tD
No Load, VREFH = 17V, VREFL = 1V
RINH
REG
VS
IS
VIH
VIL
VOL
fCLK
VSD
ISD
VOUT = VS/2, IOUT = +5mA to −5mA Step
VOUT = VS/2, ISINKING = 40mA, ISOURCING = 40mA
TYP
MAX
17.8
V
17.2
V
0.6
1.0
V
0.2
0.3
V
13
15.5
V
1
2.0
V
See Typical Characteristics Curve
4
VS
V
GND
VS − 4
V
0.3
1.5
Bits
0.3
1
Bits
0.12
%
5
µs
±20
±50
mV
±25
mV
100
MΩ
0.5
1.5
mV/mA
0.5
1.5
mV/mA
7
No Load
18
18
28
28
V
mA
mA
0.15
±0.01
0.3 × VSD
0.4
±10
400
3.4
V
V
V
µA
kHz
MHz
0.7 × VSD
ISINK = 3mA
Standard/Fast Mode
High-Speed Mode
2.0
No-Load, Two-Wire Bus Inactive
Junction Temperature < 125°C
qJA
qJC
UNIT
25
100
−40
−40
−65
30
15
5.5
50
V
µA
µA
+85
+95
+150
°C
°C
°C
°C/W
°C/W
(1) See Applications Information section REFH and REFL Input Range.
(2) Minimum analog supply voltage is 8.5V when programming OTP memory.
(3) See typical characteristic curve, Digital Supply Current vs Two-Wire Bus Activity.
3
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
PIN CONFIGURATIONS
Top View
HTSSOP
VCOM OUT 2
1
38
VCOM OUT 1
REFH
2
37
REFL
NC(1)
3
36
NC (1)
NC(1)
4
35
NC (1)
OUT1
5
34
REFL OUT
OUT2
6
33
OUT18
OUT3
7
32
OUT17
OUT4
8
31
OUT16
30
OUT15
29
OUT14
28
GNDA(2)
PowerPAD
Lead−Frame
Die Pad
Exposed on
Underside
OUT5
9
OUT6
10
(2)
11
VS
12
27
VS
OUT7
13
26
OUT13
OUT8
14
25
OUT12
OUT9
15
24
OUT11
REFH OUT
16
23
OUT10
VSD
17
22
GNDD(2)
SCL
18
21
LD
SDA
19
20
AO
GNDA
(1) NC denotes no connection.
(2) GNDD and GNDA are internally connected and must be at the same voltage potential.
4
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = 18V, VSD = 5V, VREFH = 17V, VREFL = 1V, RL = 1.5kΩ connected to ground, and CL = 200pF, unless otherwise noted.
ANALOG SUPPLY CURRENT vs TEMPERATURE
DIGITAL SUPPLY CURRENT vs TEMPERATURE
30
10
VS = 10V
Digital Supply Current (µA)
Analog Supply Current (mA)
VS = 18V
8
VS = 10V
6
4
2
25
VSD = 5V
20
15
VSD = 3.3V
10
5
0
0
−40
−20
0
20
40
60
80
−40
100
−20
0
Temperature (_ C)
20
40
60
80
100
Temperature (_ C)
Figure 1
Figure 2
OUTPUT VOLTAGE vs OUTPUT CURRENT
FULL−SCALE OUTPUT SWING
18
17
Output Voltage (V)
Output Voltage (5V/div)
REFH = 17V
REFL = 1V
Code 3FF →000
Code 000 →3FF
16
OUT10−18 (sourcing), Code = 3FFh
15
VREFL = 0.2V, VREFH = 17V
RLOAD Connected to GND
OUT1−9, VCOM1−2 (sourcing)
Code = 3FFh
VREFL = 1V, VREFH = 17.8V
3
OUT1−9, VCOM1−2 (sinking)
2
Code = 000h
VREFL = 1V, VREFH = 17.8V
RLOAD Connected to GND
OUT10−18 (sinking), Code = 000h
VREFL = 0.2V, VREFH = 17V
RLOAD Connected to 18V
RLOAD Connected to 18V
1
0
Time (1µs/div)
0
10
20
30
40
50
60
70
80
90
100
Output Current (mA)
Figure 3
Figure 4
DIFFERENTIAL NONLINEARITY ERROR vs INPUT CODE
0.6
0.4
0.4
DNL Error (LSB)
INL Error (LSB)
INTEGRAL NONLINEARITY ERROR vs INPUT CODE
0.6
0.2
0
−0.2
0.2
0
−0.2
−0.4
−0.4
−0.6
−0.6
0
200
400
600
Input Code
Figure 5
800
1000
0
200
400
600
800
1000
Input Code
Figure 6
5
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
APPLICATIONS INFORMATION
The BUF20820 programmable voltage reference allows
fast and easy adjustment of 18 programmable reference
outputs and two channels for VCOM adjustment, each with
10-bit resolution. It allows very simple, time-efficient
adjustment of the gamma reference and VCOM voltages.
The BUF20820 is programmed through a high-speed,
standard, two-wire interface. The BUF20820 features a
double-register structure for each DAC channel to simplify
the implementation of dynamic gamma control. This
design allows pre-loading of register data and rapid
updating of all channels simultaneously.
Buffers 1−9 are able to swing to within 200mV of the
positive supply rail, and to within 0.6V of the negative
supply rail. Buffers 10−18 are able to swing to within 0.8V
of the positive supply rail and to within 200mV of the
negative supply rail.
The BUF20820 can be powered using an analog supply
voltage from 7V to 18V, and a digital supply from 2V to
5.5V. The digital supply must be applied prior to or
simultaneously with the analog supply to avoid excessive
current and power consumption; damage to the device
may occur if it is left connected only to the analog supply
for extended periods of time. Figure 7 shows the power
supply timing requirements.
GND D
VS
Analog Supply:
Data transfer is then initiated and eight bits of data are sent
followed by an Acknowledge Bit. During data transfer,
SDA must remain stable while SCL is HIGH. Any change
in SDA while SCL is HIGH will be interpreted as a START
or STOP condition.
Once all data has been transferred, the master generates
a STOP condition indicated by pulling SDA from LOW to
HIGH while SCL is HIGH.
The BUF20820 can act only as a slave device; therefore,
it never drives SCL. SCL is only an input for the BUF20820.
Table 1 and Table 2 summarize the address and
command codes, respectively, for the BUF20820.
ADDRESSING THE BUF20820
The address of the BUF20820 is 111010x, where x is the
state of the A0 pin. When the A0 pin is LOW, the device will
acknowledge on address 74h (1110100). If the A0 pin is
HIGH, the device will acknowledge on address 75h
(1110101).
VSD
Digital Supply:
To address a specific device, the master initiates a START
condition by pulling the data signal line (SDA) from a HIGH
to a LOW logic level while SCL is HIGH. All slaves on the
bus shift in the slave address byte, with the last bit
indicating whether a read or write operation is intended.
During the 9th clock pulse, the slave being addressed
responds to the master by generating an Acknowledge
and pulling SDA LOW.
GND
t1
Other valid addresses are possible through a simple mask
change. Contact your TI representative for information.
t1: 0s minimum delay between Digital Supply and Analog Supply.
Figure 7. Power Supply Timing Requirements
Figure 8 shows the BUF20820 in a typical configuration.
In this configuration, the BUF20820 device address is 74h.
The output of each digital-to-analog converter (DAC) is
immediately updated as soon as data is received in the
corresponding register (LD = 0). For maximum dynamic
range, set VREFH = VS − 0.2V and VREFL = GND + 0.2V.
TWO-WIRE BUS OVERVIEW
The BUF20820 communicates through an industrystandard, two-wire interface to receive data in slave mode.
This standard uses a two-wire, open-drain interface that
supports multiple devices on a single bus. Bus lines are
driven to a logic low level only. The device that initiates the
communication is called a master, and the devices
controlled by the master are slaves. The master generates
the serial clock on the clock signal line (SCL), controls the
bus access, and generates the START and STOP
conditions.
6
Table 1. Quick-Reference Table of BUF20820
Addresses
DEVICE/COMPONENT
ADDRESS
BUF20820 Address:
A0 pin is LOW
(device will acknowledge on address 74h)
1110100
A0 pin is HIGH
(device will acknowledge on address 75h)
1110101
Table 2. Quick-Reference Table of Command
Codes
COMMAND
CODE
General Call Reset
Address byte of 00h followed by a data byte
of 06h.
High-Speed Mode
00001xxx, with SCL ≤ 400kHz; where xxx
are bits unique to the Hs-capable master.
This byte is called the Hs master code.
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
BUF20820
(1)
VCOM 1
1
VC OM OUT2
VS
2
REFH
3
(1)
VCOM OU T1
38
V CO M2
REFL
37
VS
NC
NC
36
4
NC
NC
35
5
OUT1
REFL OUT
34
6
OUT2
OUT18
33
7
OUT3
OUT17
32
8
OUT4
OUT16
31
9
OUT5
OUT15
30
10
OUT6
OUT14
29
11
GNDA (2)
GNDA (2)
28
12
VS
VS
27
(1)
(1)
(1)
(1)
Source
Driver
(1)
(1)
(1)
VS
100nF
10µF
(1)
(1)
(1)
(1)
VS
100nF
(1)
Source
Driver
Source
Driver
10µF
(1)
13
OUT7
OUT13
26
14
OUT8
OUT12
25
(1)
(1)
Source
Driver
(1)
(1)
15
OUT9
OUT11
24
16
REFH OUT
OUT10
23
17
VSD
GND D(2)
22
18
SCL
LD
21
19
SDA
AO
20
(1)
3.3V
100nF
1µF
Timing
Controller
Figure 8. Typical Application Configuration
7
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
DATA RATES
OUTPUT VOLTAGE
The two-wire bus operates in one of three speed modes:
Buffer output values are determined by the reference
voltages (VREFH and VREFL) and the decimal value of the
binary input code used to program that buffer. The value is
calculated using Equation 1:
D
D
D
Standard: allows a clock frequency of up to 100kHz;
Fast: allows a clock frequency of up to 400kHz; and
High-speed mode (or Hs mode): allows a clock
frequency of up to 3.4MHz.
The BUF20820 is fully compatible with all three modes. No
special action is required to use the device in Standard or
Fast modes, but High-speed mode must be activated. To
activate High-speed mode, send a special address byte of
00001xxx, with SCL = 400kHz, following the START
condition; xxx are bits unique to the Hs-capable master,
which can be any value. This byte is called the Hs master
code. (Note that this is different from normal address
bytes—the low bit does not indicate read/write status.) The
BUF20820 will respond to the High-speed command
regardless of the value of these last three bits. The
BUF20820 will not acknowledge this byte; the
communication protocol prohibits acknowledgement of
the Hs master code. On receiving a master code, the
BUF20820 will switch on its Hs mode filters, and
communicate at up to 3.4MHz. Additional high-speed
transfers may be initiated without resending the Hs mode
byte by generating a repeat START without a STOP. The
BUF20820 will switch out of Hs mode with the next STOP
condition.
GENERAL CALL RESET AND POWER-UP
The BUF20820 responds to a General Call Reset, which
is an address byte of 00h (0000 0000) followed by a data
byte of 06h (0000 0110). The BUF20820 acknowledges
both bytes. Upon receiving a General Call Reset, the
BUF20820 performs a full internal reset, as though it had
been powered off and then on. It always acknowledges the
General Call address byte of 00h (0000 0000), but does
not acknowledge any General Call data bytes other than
06h (0000 0110).
VOUT +
ƪ
VREFH * VREFL
1024
ƫ
Decimal Value of Code ) VREFL
(1)
The valid voltage ranges for the reference voltages are:
4V v V REFH v VS * 0.2V and 0.2V v VREFL v VS * 4V
(2)
The BUF20820 outputs are capable of a full-scale voltage
output change in typically 5µs—no intermediate steps are
required.
OUTPUT LATCH
Updating the DAC register is not the same as updating the
DAC output voltage, because the BUF20820 features a
double-buffered register structure. There are three
methods for latching transferred data from the storage
registers into the DACs to update the DAC output
voltages.
Method 1 requires externally setting the latch pin (LD)
LOW, LD = LOW, which will update each DAC output
voltage whenever its corresponding register is updated.
Method 2 externally sets LD = HIGH to allow all DAC
output voltages to retain their values during data transfer
and until LD = LOW, which will then simultaneously update
the output voltages of all DACs to the new register values.
Use this method to transfer a future data set in advance to
prepare for a very fast output voltage update.
The BUF20820 automatically performs a reset upon
power-up. As part of the reset, the BUF20820 is configured
for all outputs to change to the programmed OTP memory
values, or (VREFH − VREFL)/2 if the OTP values have not
been programmed.
Method 3 uses software control. LD is maintained HIGH,
and all DACs are updated when the master writes a 1 in bit
15 and a 0 in bit 14 of any DAC register. The update will
occur after receiving the 16-bit data for the
currently-written register.
The BUF20820 resets all outputs to the OTP memory
values (or to (VREFH − VREFL)/2 if the OTP values have not
been programmed) when the device address is sent,
followed by a valid DAC address with bits D7 to D5 set to
‘100’. If these bits are set to ‘010’, only the DAC being
addressed will be reset.
The General Call Reset and the power-up reset will update
the DAC regardless of the state of the latch pin.
8
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
ACQUIRE OF OTP MEMORY
A general acquire command will update all registers and
DAC outputs to the values stored in OTP memory.
DAC addresses 00000 to 10100 are valid and will be
acknowledged. Table 3 shows the valid addresses.
4.
Send a STOP condition on the bus.
A single channel acquire command will update only the
register and DAC output of the DAC corresponding to the
DAC address used in the command.
See Figure 9 for the timing diagrams for the acquire
commands.
General Acquire Command
READ/WRITE OPERATIONS
1. Send a START condition on the bus.
Single or multiple read and write operations can be done
in a single communication transaction. Writing to a DAC
register differs from writing to the OTP memory. Bits
D15−D14 of the most significant byte of data will determine
if data will be written to the DAC register or the OTP
memory. See Figure 10 through Figure 12 for the timing
diagrams and timing requirements for the read/write
commands.
2. Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3. Send a DAC address byte. Bits D7−D5 must be set
to 100. Bits D4−D0 are any valid DAC address.
Only addresses 00000 to 10100 are valid and will
be acknowledged. Table 3 shows the valid
addresses.
4. Send a STOP condition on the bus.
Following this command, all DAC registers and DAC
outputs will change to the OTP memory values.
Table 3. DAC Addresses
DAC
ADDRESS
DAC_1
DAC_2
DAC_3
DAC_4
DAC_5
DAC_6
DAC_7
DAC_8
DAC_9
DAC_10
DAC_11
DAC_12
DAC_13
DAC_14
DAC_15
DAC_16
DAC_17
DAC_18
0 0000
0 0001
0 0010
0 0011
0 0100
0 0101
0 0110
0 0111
0 1000
0 1001
0 1010
0 1011
0 1100
0 1101
0 1110
0 1111
1 0000
1 0001
1 0010
1 0011
1 0100
VCOM OUT1
VCOM OUT2
Write Disable Bit
Single Channel Acquire Command
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send a DAC address byte using the DAC address
corresponding to the DAC output and register to
update with the OTP memory value. Bits D7−D5 must
be set to 010. Bits D4−D0 are the DAC address. Only
Read/Write: DAC register
The BUF20820 is able to read from a single DAC, or
multiple DACs, or write to the register of a single DAC, or
multiple DACs in a single communication transaction.
DAC addresses begin with 00000, which corresponds to
DAC_1, through 10011, which corresponds to VCOM OUT2.
Write commands are performed by setting the read/write
bit LOW. Setting the read/write bit HIGH will perform a read
transaction.
Writing:
To write to a single DAC register:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send a DAC or write disable bit address byte. Bits
D7−D5 must be set to 0. Bits D4−D0 are the DAC
address. Only addresses 00000 to 10100 are valid
and will be acknowledged. Table 3 shows valid
addresses.
4.
Send two bytes of data for the specified DAC register.
Begin by sending the most significant byte first (bits
D15−D8, of which only bits D9 and D8 are used, and
bits D15−D14 must not be 01), followed by the least
significant byte (bits D7−D0). For address 10100, only
D0 has meaning. This bit is the write disable bit. The
register is updated after receiving the second byte.
5.
Send a STOP condition on the bus.
The BUF20820 will acknowledge each data byte. If the
master terminates communication early by sending a
STOP or START condition on the bus, the specified
register will not be updated. Updating the DAC register is
not the same as updating the DAC output voltage. See the
Output Latch section.
The process of updating multiple DAC registers begins the
same as when updating a single register. However,
instead of sending a STOP condition after writing the
9
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
addressed register, the master continues to send data for
the next register. The BUF20820 automatically and
sequentially steps through subsequent registers as
additional data is sent. The process continues until all
desired registers have been updated or a STOP condition
is sent.
5.
Send correct device address and read/write
bit = HIGH. The BUF20820 will acknowledge this
byte.
6.
Receive two bytes of data. They are for the specified
DAC. The first received byte is the most significant
byte (bits D15−D8, only bits D9 and D8 have
meaning), the next byte is the least significant byte
(bits D7−D0).
7.
Acknowledge after receiving the first byte.
8.
Do not acknowledge the second byte to end the read
transaction.
To write to multiple DAC registers:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send either the DAC_1 address byte to start at the first
DAC, or send the address byte for whichever DAC will
be the first in the sequence of DACs to be updated.
The BUF20820 will begin with this DAC and step
through subsequent DACs in sequential order.
4.
5.
Send the bytes of data; begin by sending the most
significant byte (bits D15−D8, of which only bits D9
and D8 have meaning, and bits D15−D14 must not be
01), followed by the least significant byte (bits D7−D0).
The first two bytes are for the DAC addressed in step
3 above. Its register is automatically updated after
receiving the second byte. The next two bytes are for
the following DAC. That DAC register is updated after
receiving the fourth byte. This process continues until
the registers of all following DACs have been updated.
The last address, 10100, is the address of the write
disable bit and cannot be accessed using this method.
It must be written using the write to a single DAC
register procedure.
Send a STOP condition on the bus.
The BUF20820 will acknowledge each byte. To terminate
communication, send a STOP or START condition on the
bus. Only DAC registers that have received both bytes of
data will be updated.
Reading:
Communication may be terminated by sending a
premature STOP or START condition on the bus, or by not
sending the acknowledge.
To Read Multiple DACs:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send either the DAC_1 address byte to start at the first
DAC, or send the address byte for whichever DAC will
be the first in the sequence of DACs to be read. The
BUF20820 will begin with this DAC and step through
subsequent DACs in sequential order.
4.
Send a START or STOP/START condition on the bus.
5.
Send correct device address and read/write
bit = HIGH. The BUF20820 will acknowledge this
byte.
6.
Receive two bytes of data. They are for the specified
DAC. The first received byte is the most significant
byte (bits D15−D8, only bits D9 and D8 have
meaning), the next byte is the least significant byte
(bits D7−D0).
7.
Acknowledge after receiving each byte of data except
for the last byte. The acknowledge bit of the last byte
should be HIGH to end the read operation.
8.
When all desired DACs have been read, send a STOP
or START condition on the bus.
Reading a DAC register will return the data stored in the
DAC. This data can differ from the data stored in the DAC
register. See the Output Latch section.
To read the DAC value:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send the DAC address byte. Bits D7−D5 must be set
to 0; Bits D4−D0 are the DAC address. Only DAC
addresses 00000 to 10100 are valid and will be
acknowledged. For address 10100, only D0 has
meaning. This bit is the write disable bit.
4.
10
Send a START or STOP/START condition on the bus.
Communication may be terminated by sending a
premature STOP or START condition on the bus, or by not
sending the acknowledge.
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
Write: OTP Memory for the DAC Register
The BUF20820 is able to write to the OTP memory of a
single DAC, or multiple DACs in a single communication
transaction. DAC addresses begin with 00000 (which
corresponds to DAC_1) through 10011 (which corresponds to VCOM OUT2).
To write to multiple OTP registers:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send either the DAC_1 address byte to start at the
OTP register of the first DAC, or send the address byte
for whichever DAC will be the first in the sequence to
be updated. The BUF20820 will begin with the OTP
register of this DAC and step through subsequent
registers in sequential order.
4.
Send the bytes of data; begin by sending the most
significant byte (bits D15−D8, of which only bits D9
and D8 have meaning, and bits D15−D14 must be 01),
followed by the least significant byte (bits D7−D0). The
first two bytes are for the OTP register of the DAC
addressed in step 3 above. This OTP register is
automatically updated after receiving the second byte.
The next two bytes are for the OTP register of the
following DAC (bits D15−D14 must again be 01). That
DAC OTP register is updated after receiving the fourth
byte. This process continues until the registers of all
following DAC OTP registers have been updated. The
last address, 10100, is the address of the write disable
bit and cannot be accessed using this method. It must
be written using the write to a single OTP register
procedure.
5.
Send a STOP condition on the bus.
When programming the OTP memory, the analog supply
voltage must be between 8.5V and 18V.
Write commands are performed by setting the read/write
bit LOW.
To write to a single OTP register:
1.
Send a START condition on the bus.
2.
Send the device address and read/write bit = LOW.
The BUF20820 will acknowledge this byte.
3.
Send a DAC address byte. Bits D7−D5 must be set to
0. Bits D4−D0 are the DAC address. Only DAC
addresses 00000 to 10100 are valid and will be
acknowledged. See Table 3 for DAC addresses.
4.
Send two bytes of data for the OTP register of the
specified DAC. Begin by sending the most significant
byte first (bits D15−D8, of which only bits D9 and D8
are data bits, and bits D15−D14 must be 01), followed
by the least significant byte (bits D7−D0). For address
10100, only D0 has meaning. This bit is the write
disable bit. The register is updated after receiving the
second byte.
5.
Send a STOP condition on the bus.
The BUF20820 will acknowledge each data byte. If the
master terminates communication early by sending a
STOP or START condition on the bus, the specified OTP
register will not be updated. Writing an OTP register will
also update the DAC register and output voltage.
The BUF20820 will acknowledge each byte. To terminate
communication, send a STOP or START condition on the
bus. Only DAC registers that have received both bytes of
data will be programmed.
OTP WRITE DISABLE
Writing a ‘1’ in bit D0 of register 10100 disables all future
writes. The state of this bit can be accessed the same as
any other data bit. It is important to set this bit to 1 after the
OTP registers have been programmed to prevent
accidental changes to the OTP registers. Until bit D0 of
register 10100 is set to 1, any OTP register bit can be
changed from 0 to 1; however, once a bit is set to a 1, it
cannot be set back to 0.
11
12
A3
A3
A2
A2
A1
A1
A0
A0
W
W
Ackn
Ackn
D7
D7
A6
A6
Device_out
A5
A5
A4
A4
A3
A3
Device Address
A2
A2
A1
A1
A0
A0
W
W
Write
Ackn
Ackn
D7
D7
Ackn
SDA_in
SCL
A4
A4
Write Operation
A5
A5
Start
A6
Device_out
a) General Acquire
Single channel acquire command. P4−P0 must specify any valid DAC addess.
A6
Ackn
SDA_in
SCL
Write Operation
Write
Start
Device Address
General acquire command. P4−P0 must specify any valid DAC addess.
D5
D5
P4
P4
P3
P3
P2
P2
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
DAC address pointer. D7−D5 must be 010.
D6
D6
DAC address pointer. D7−D5 must be 100.
P1
P1
P1
P1
P0
P0
P0
P0
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
Stop
Stop
"#$%&$%
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
www.ti.com
b) Single-Channel Acquire
Figure 9. Timing Diagram for Acquire Operation
A3
A3
A2
A2
A0
A1
A1
Write
A0
A0
W
W
A ck n
A ck n
Ackn
A6
A6
Device_out
A5
A5
A4
A4
A3
A3
Device Address
A2
A2
A1
A1
A0
W
W
Ackn
Ackn
D7
D7
D6
D6
D5
D5
P4
P4
P3
P3
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
P1
P1
P2
P2
P0
P0
DAC address pointer. D7−D5 must be 000.
Start DAC address pointer. D7−D5 must be 000.
D7
D7
Write Operation
Ackn
SDA_in
SCL
A4
A4
Write
Write Operation
A5
A5
Device Address
Start
A6
Device_out
a. Write Single DAC
Write multiple DAC registers. P4−P0 specify start DAC address.
A6
SDA_in
SCL
Start
Write single DAC register. P4−P0 specify DAC address.
Ackn
Ackn
Ackn
P1
P1
D15
D15
P0
P0
D14
D14
D13
D13
D12
D12
D10
D10
D9
D9
D13
D13
D12
D12
D11
D11
D10
D10
D9
D9
D8
D8
Ackn
Ackn
Ackn
D7
D7
D8
D8
A ck n
A ck n
D7
D7
D14
D15
D13
D13
D12
D12
D11
D11
D10
D10
D9
D9
D6
D6
D8
D8
D4
D4
Ackn
Ackn
Ackn
D5
D5
D7
D7
D3
D3
D6
D1
D1
D4
D4
D0
D0
D3
D3
DAC LSbyte
D5
D5
D4
D0
D0
A c kn
A c kn
Stop
Ackn
Ackn
D3
D3
D1
D1
D0
D0
D14
D14
Ackn
Ackn
Ackn
D13
D13
The whole DAC register D9−D0
is updated in this moment.
D2
D2
D15
D15
Stop
Ackn DAC (pointer + 1) MSbyte. D14 must be 0.
DAC 20 LSbyte
D4
D1
D1
Ackn
The whole DAC register D9−D0
is updated in this moment.
D2
D2
The whole DAC register D9−D0
is updated in this moment.
D2
D2
D5
D5
D6
DAC (pointer) LSbyte
D6
D6
If D15 = 0, the DACs are uploaded on the Latch pin.
If D15 = 1, all the DACs are updated when the current DAC register is updated.
D14
D15
DAC 20 (VCOM OUT2) MSbyte. D14 must be 0.
If D15 = 0, the DACs are updated on the Latch pin.
If D15 = 1, all DACs are updated when the current DAC register is updated.
D14
D11
D11
Ackn
If D15 = 0, the DACs are updated on the Latch pin.
If D15 = 1, all DACs are updated when the current DAC register is updated.
D15
D15
DAC MSbyte. D14 must be 0.
DAC (pointer) MSbyte. D14 must be 0.
D14
A ck n
A ck n
Ackn
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
b. Write Multiple DACs
Figure 10. Timing Diagram for Write DAC Register
13
14
Device_out
A2
A2
A1
A1
A0
A0
W
W
Ackn
Ackn
Write
D7
D7
D6
D6
D5
D5
P4
P4
A5
A5
A6
A6
A4
A4
A3
A3
Device Address
A2
A2
A1
A1
A0
A0
W
W
Ackn
Ackn
D7
D7
Ackn
A3
A3
P2
P2
P1
P1
P0
P0
Ackn
Ackn
Ackn
Start
D6
D6
D5
D5
P4
P4
P3
P3
P2
P2
P1
P1
Start DAC address pointer. D7−D5 must be 000.
P3
P3
DAC address pointer. D7−D5 must be 000.
Read Operation
A4
A4
Read Operation
Ackn
Start
A5
A6
Write
Read multiple DAC registers. P4−P0 specify start DAC address.
A5
A6
Read single DAC register. P4−P0 specify DAC address.
Start
Device Address
a. Read Single DAC
SDA_in
SCL
Device_out
SDA_in
SCL
A6
A6
P0
P0
A5
A5
Ackn
Ackn
Ackn
A4
A4
A3
A3
Device Address
Start
A2
A2
A5
A5
A0
A0
Ackn
Ackn
D15
D15
A4
A4
A3
A3
Device Address
R
R
Ackn
A2
A2
D14
D14
A1
A1
D13
D13
A0
A0
D12
D12
Figure 11. Timing Diagram for Read DAC Register
D14
D14
D15
D15
D13
D13
D12
D12
D11
D11
D10
D10
D9
D9
D8
D8
R
R
Read
D11
D11
D9
D9
Ac kn
Ac kn
Ackn
Ackn
Ackn
Ackn
D10
D10
DACMSbyte. D15−D10 have no meaning.
DAC 20 (VCOM OUT2) MSbyte. D15−D10 have no meaning.
A6
A6
A1
A1
Read
D15
D7
D7
Ackn
Ackn
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
DACLSbyte.
D2
D2
D6
D6
D14
D14
D5
D5
D13
D13
D11
D11
D4
D4
D3
D3
DAC 20 LSbyte.
D12
D12
D2
D2
D10
D10
D1
D1
D9
D9
DAC (pointer) MSbyte. D15−D10 have no meaning.
D15
D8
D8
Ackn
D1
D1
D0
D0
D8
D8
A c kn
No A ck n
Ackn
Ackn
Ackn
D0
D0
No Ackn
Stop
Stop
"#$%&$%
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
www.ti.com
b. Read Multiple DACs
Device_out
SDA_in
SCL
Device_out
SDA_in
SCL
a) Write Single OTP Register
A2
A1
A1
A0
A0
A0
Write
W
W
Ackn
Ackn
D7
D7
A5
A5
A6
A6
A4
A4
A3
A3
Device Address
A2
A2
A1
A1
A0
W
W
Ackn
Ackn
D7
D7
Ackn
A3
A2
Start
A4
A3
Write Operation
A5
A6
A4
Write multiple OTP registers. P4−P0 specify start DAC address.
A5
A6
Ackn
Write
Start
Device Address
Write Operation
Write single OTP register. P4−P0 specify DAC address.
D5
D5
P4
P4
P3
P3
P2
P2
D0
D0
D5
D5
P4
P4
P3
P3
P2
P2
Start DAC address pointer. D7−D5 must be 000.
D0
D0
DAC address pointer. D7−D5 must be 000.
P1
P1
P1
P1
P0
P0
P0
P0
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
D15
D15
D15
D15
D13
D13
D12
D12
D11
D11
D10
D10
D14
D14
D13
D13
D12
D12
D10
D10
D9
D9
D9
D9
D8
D8
D8
D8
Ackn
Ackn
Ackn
Ackn
Ackn
Ackn
D7
D7
D7
D7
D14
D14
D15
D15
D13
D13
D12
D12
D11
D11
D10
D10
D9
D9
DAC20 (VCOMOUT2) MSbyte. D14−D10 have no meaning.
D11
D11
DAC(pointer) MSByte. D15−D14 must be 01.
D14
D14
DAC(pointer) MSByte. D15−D14 must be 01.
D6
D6
D6
D6
D8
D8
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
t1
Ackn
Ackn
Ackn
t2
Stop
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
Ackn
Ackn
D15
D15
D14
D14
Ackn
Ackn
Ackn
D7
D7
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
Ackn
Ackn
D0
Ackn
t2
D0
t1
Stop
Thewhole DACregister D9−D0 is updated at this moment.
t1: > 20µs beforefalling edge of clock.
t2: minimum100µs, maximum2ms.
D6
D6
DAC (pointer) LSbyte
Write SupplyActive
Write Signal Active
D13
D13
Ackn DAC (pointer +1) MSbyte. D15−D14 must be 01.
t2
The OTPregister D9−D0 is updated at this moment.
D5
D5
DAC (pointer) LSbyte
Write SupplyActive
Write Signal Active
t1
The OTPregister D9−D0 is updated at this moment.
t1: > 20µs before falling edge of clock.
t2: minimum100µs, maximum2ms.
D5
D5
DAC (pointer) LSbyte
Write SupplyActive
Write Signal Active
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
b) Write Multiple OTP Registers
Figure 12. Timing Diagram for Write OTP Register
15
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
REPLACEMENT OF TRADITIONAL GAMMA
BUFFER
Traditional gamma buffers rely on a resistor string (often
using expensive 0.1% resistors) to set the gamma
voltages. During development, the optimization of these
gamma voltages can be time consuming. Programming
these gamma voltages with the BUF20820 can
significantly reduce the time required for gamma voltage
optimization. The final gamma values can be written into
the internal OTP memory to replace a traditional gamma
buffer solution. Figure 13a shows the traditional resistor
string; Figure 13b shows the more efficient alternative
method using the BUF20820.
The BUF20820 uses the most advanced high-voltage
CMOS process available today, which allows it to be
competitive with traditional gamma buffers.
Programmability offers the following advantages:
D
D
D
D
D
D
a) Traditional
It shortens development time significantly.
It eliminates manufacturing variance between panels.
It allows a single panel to be built for multiple
customers, with loading of customer-dependent
gamma curves during final production. This
significantly lowers inventory cost and risk and
simplifies inventory management.
It allows demonstration of various gamma curves to
LCD monitor makers by simply uploading a different
set of gamma values.
It provides a simple means of adjusting gamma curves
during final production improve picture quality and
accommodate changes in the panel manufacturing
process or end-customer requirements.
It decreases cost and space.
b) BUF20820 Solution
BUFxx704
BUF20820
VCOM OUT1
VCOM
VCOM OUT2
Timing
Controller
OUT1
PC
Register
SDA
SCL
OUT2
Gamma
References
OUT17
OUT18
SDA
Control Interface
SCL
LCD Panel Electronics
Figure 13. Replacement of the Traditional Gamma Buffer
16
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
PROGRAMMABLE VCOM
The VCOM channels of the BUF20820 can swing to 2.5V
from the positive supply rail while sourcing 100mA, and to
1V above the negative rail while sinking 100mA (see
Figure 4, typical characteristic Output Voltage vs Output
Current). The gamma and the VCOM values can be
permanently stored in the internal OTP memory. The VCOM
channels can be programmed independently from the
gamma channels. Figure 14 shows the BUF20820 being
used for VCOM voltages.
BUF20820
VCOM OUT1
VCOM
VCOM OUT2
Register
OUT1
OUT2
VS and the REFL internal buffer to GND. However, there
is a finite limit on how close they can swing before
saturating. To avoid saturation of the internal REFH and
REFL buffers, the REFH voltage should not be greater
than VS −100mV and REFL voltage should not be lower
than GND + 100mV. Figure 15 shows the swing capability
of the REFH and REFL buffers.
The other consideration when trying to maximize the
output swing capability of the gamma buffers is the
limitation in the swing range of output buffers (OUT1−18,
VCOM1, and VCOM2), which depends on the load current. A
typical load in the LCD application is 5−10mA. For
example, if OUT1 is sourcing 10mA, the swing is typically
limited to about VS − 200mV. The same applies to OUT18,
which typically limits at GND + 200mV when sinking
10mA. An increase in output swing can only be achieved
for much lighter loads. For example, a 3mA load typically
allows the swing to be increased to approximately
VS − 100mV and GND + 100mV.
Connecting REFH directly to VS and REFL directly to GND
does not damage the BUF20820. As discussed above
however, the output stages of the REFH and REFL buffers
will saturate. This condition is not desirable and can result
in a small error in the measured output voltages of
OUT1−18, VCOM OUT1, and VCOM OUT2. As described above,
this method of connecting REFH and REFL does not help
to maximize the output swing capability.
Gamma
References
18
17
OUT18
SDA
Control Interface
Output Voltage (V)
OUT17
16
REFH OUT (sourcing), Code = 3FFh
15
VREFL = 1V, VREFH = 17.8V
RLOAD Connected to GND
3
REFL OUT (sinking), Code = 000h
VREFL = 0.2V, VREFH = 17V
2
R LOAD Connected to 18V
SCL
1
0
0
10
20
30
40
50
60
70
80
90
100
Output Current (mA)
Figure 15. Reference Buffer Output Voltage vs
Output Current
Figure 14. BUF20820 Used for Programmable
VCOM
REFH AND REFL INPUT RANGE
Best performance and output swing range of the
BUF20820 are achieved by applying REFH and REFL
voltages that are slightly below the power-supply voltages.
Most
specifications
have
been
tested
at
REFH = VS − 200mV and REFL = GND + 200mV. The
REFH internal buffer is designed to swing very closely to
CONFIGURATION FOR 20 GAMMA CHANNELS
The VCOM outputs can be used as additional gamma
references in order to achieve two additional gamma
channels (20 total). The VCOM outputs will behave the
same as the OUT1−9 outputs when sourcing or sinking
smaller currents (see the Typical Characteristics,
Figure 4). The VCOM outputs are better able to swing to the
positive rail than to the negative rail. Therefore, it is better
to use the VCOM outputs for higher reference voltages; see
Figure 16.
17
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
CONFIGURATION FOR 22 GAMMA CHANNELS
In addition to the VCOM outputs, the REFH and REFL OUT
outputs can also be used as fixed gamma references. The
output voltage will be set by the REFH and REFL input
voltages, respectively. Therefore, REFH OUT should be
used for the highest voltage gamma reference, and REFL
OUT for the lowest voltage gamma reference. A
22-channel solution can be created by using all 18 outputs,
the two VCOM outputs, and both REFH/L OUT outputs for
gamma references—see Figure 17. However, the REFH
and REFL OUT buffers were designed to only drive light
loads on the order of 5−10mA. Driving capacitive loads is
not recommended with these buffers. In addition, the
REFH and REFL buffers must not be allowed to saturate
from sourcing/sinking too much current from REFH OUT
or REFL OUT. Saturation of the REFH and REFL buffers
results in errors in the voltages of OUT1−18 and VCOM
OUT1−2. The BUF01900, which is anticipated to be
released in Q1 ‘06, can be used to provide a
programmable VCOM output.
15V
14.8V
2V−5.5V
Digital
Analog
REFH
BUF20820
REFH OUT
14.8V
Source
Driver
VCOM OUT1
GMA 1
VCOM OUT2
GMA 2
DAC Registers 2
DAC Registers 1
Program Command
OTP Memory
OUT1
OUT2
GMA 3
GMA 4
2 VCOM Channels plus
18 Gamma Channels
OUT17
GMA 19
OUT18
GMA 20
REFL OUT
0.2V
SDA
Control IF
SCL
LD
A0
REFL
15V
0.2V
Figure 16. 20-Gamma Channel Solution—2 VCOM Channels Used as Additional Gamma Channels
18
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
15V
2V−5.5V
Reference buffer
and VCOM OUT
outputs can be used
for extra gamma channels.
14.8V
Digital
Analog
(REFH OUT
will be a fixed
voltage.)
REFH
BUF20820
Source
Driver
REFH OUT
17V
GMA 1
VCOM OUT1
GMA 2
VCOM OUT2
GMA 3
DAC Registers 2
Program Command
OTP Memory
DAC Registers 1
OUT 1
GMA 4
OUT 2
GMA 5
2 VCOM Channels plus
18 Output Channels
OUT 17
GMA 20
OUT 18
GMA 21
REFL OUT
0.2V
SDA
GMA 22
Control IF
SCL
Panel
LD
A0
REFL
Output of reference
buffer can be used
for an extra fixed
gamma channel.
15V
0.2V
VCOM
8V−18V
2V−5.5V
Digital
Analog
BIAS
BUF01900
Program Command
Voltage Regulator
4 x OTP
ROM
Switch
Control
10−Bit
DAC
VCOM
Buffer
VCOM OUT
SDA
SCL
Control IF
A0
Figure 17. 22-Gamma Channel Solution
19
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
DYNAMIC GAMMA CONTROL
Dynamic gamma control is a technique used to improve
the picture quality in LCD TV applications. The brightness
in each picture frame is analyzed and the gamma curves
are adjusted on a frame-by-frame basis. The gamma
curves are typically updated during the short vertical
blanking period in the video signal. Figure 18 shows a
block diagram using the BUF20820 for dynamic gamma
control and VCOM output.
while a picture is still being displayed. Because the data is
only stored into the first register bank, the DAC output
values remain unchanged—the display is unaffected.
During the vertical sync period, the DAC outputs (and
therefore, the gamma voltages) can be quickly updated
either by using an additional control line connected to the
LD pin, or through software—writing a ‘1’ in bit 15 of any
DAC register. For the details on the operation of the double
register input structure, see the Output Latch section.
The BUF20820 is ideally suited for rapidly changing the
gamma curves because of its unique topology:
Example: Update all 18 gamma registers simultaneously
via software.
D
D
D
double register input structure to the DAC;
fast serial interface;
Step 1: Check if LD pin is placed in HIGH state.
simultaneous updating of all DACs by software. See
the Read/Write Operations to write to all registers and
the Output Latch sections.
Step 2: Write DAC Registers 1−18 with bit 15 always ‘0’.
The double register input structure saves programming
time by allowing updated DAC values to be pre-loaded
into the first register bank. Storage of this data can occur
Step 3: Write any DAC register a second time with identical data. Make sure that bit 15 is ‘1’. All DAC channels will
be updated simultaneously after receiving the last bit of
data. (Note: this step may be eliminated by setting bit 15
of DAC 18 to ‘1’ in the previous step.)
Histogram
Gamma
Adjustment
Algorithm
Digital
Picture
Data
Black
White
SDA
SCL
BUF20820
Gamma References
1 through 18
Timing Controller/µController
Source Driver
Figure 18. Dynamic Gamma Control
20
Source Driver
VCOM
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
TOTAL TI PANEL SOLUTION
outputs, and other functions. The BUF20820, with its 20
total programmable DAC channels, provides great
flexibility to the entire system by allowing the designer to
change all these parameters via software.
In addition to the BUF20820 programmable voltage
reference, TI offers a complete set of ICs for the LCD panel
market, including gamma correction buffers, various
power-supply solutions, and audio power solutions. See
Figure 19 for the total IC solution from TI.
Figure 20 provides various ideas on how the BUF20820
can be used in applications. A micro-controller with
two-wire serial interface controls the various DACs of the
BUF20820. The BUF20820 can be used for:
THE BUF20820 IN INDUSTRIAL
APPLICATIONS
D
D
D
D
D
D
The wide supply range, high output current, and very low
cost make the BUF20820 attractive for a range of medium
accuracy industrial applications such as programmable
power supplies, multi-channel data acquisition systems,
data-loggers, sensor excitation and linearization,
power-supply generation, and others. Each DAC channel
features 1LSB DNL and INL.
sensor excitation
programmable bias/reference voltages
variable power-supplies
high-current voltage output
4-20mA output
set-point generators for control loops.
NOTE: At power-up, the output voltages of the BUF20820
DACs are configured to the programmed OTP memory
values, or (VREFH − VREFL)/2 if the OTP values have not been
programmed.
Many systems require different levels of biasing and power
supply for various components as well as sensor
excitation, control-loop set-points, voltage outputs, current
VCOM
Gamma Correction
BUF20820
2.7 V−5 V
TPS651xx
LCD
Supply
15 V
26 V
−14 V
3.3 V
TPA3005D2
TPA3008D2
Audio
Speaker
Driver
n
n
Logic and
Timing
Controller
Gate Driver
Source Driver
High−Resolution
TFT−LCS Panel
Figure 19. TI LCD Solution
21
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
+18V
Voltage
Output
High Current
Voltage Output
0.3V to 17V
+5V
BUF2 0 8 2 0
+5V
2V to 16V, 100mA
Sensor Excitation/Linearization
Control Loop
Set Point
4−20mA
+5V
Bias Voltage
Generator
4−20mA
Generator
+2.5V Bias
LED Driver
Offset
Adjustment
INA
Ref
+4V
+4.3V
Comparator
Threshold
Supply Voltage
Generator
Ref
Reference
for MDAC
+7.5V
SDA SCL
MDAC
µC
Figure 20. Industrial Applications for the BUF20820
22
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
EVALUATION BOARD AND SOFTWARE
An evaluation board is available for the BUF20820, as
shown in Figure 21. The evaluation board features
easy-to-use software that allows individual channel
voltages to be set. Configurations can be quickly
evaluated to determine optimal codes for a given
application. Contact your local TI representative for more
information regarding the evaluation board.
Figure 21. BUF208x0 Evaluation Board
23
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
GENERAL POWERPAD DESIGN
CONSIDERATIONS
The BUF20820 is available in a thermally-enhanced
PowerPAD package. This package is constructed using a
downset leadframe upon which the die is mounted, as
shown in Figure 22(a) and Figure 22(b). This arrangement
results in the lead frame being exposed as a thermal pad
on the underside of the package; see Figure 22(c). This
thermal pad has direct thermal contact with the die; thus,
excellent thermal performance is achieved by providing a
good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad must be
soldered to a copper area underneath the package.
Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either
a ground plane or other heat-dissipating device.
Soldering the PowerPAD to the printed circuit board
(PCB) is always required, even with applications that
have low power dissipation. This provides the
necessary thermal and mechanical connection between
the lead frame die pad and the PCB.
3.
Additional vias may be placed anywhere along the
thermal plane outside of the thermal pad area. This
helps dissipate the heat generated by the BUF20820
IC. These additional vias may be larger than the 13-mil
diameter vias directly under the thermal pad. They can
be larger because they are not in the thermal pad area
to be soldered; thus, wicking is not a problem.
4.
Connect all holes to the internal plane that is at the
same voltage potential as the GND pins.
5.
When connecting these holes to the internal plane, do
not use the typical web or spoke via connection
methodology. Web connections have a high thermal
resistance connection that is useful for slowing the
heat transfer during soldering operations. This makes
the soldering of vias that have plane connections
easier. In this application, however, low thermal
resistance is desired for the most efficient heat
transfer. Therefore, the holes under the BUF20820
PowerPAD package should make their connection to
the internal plane with a complete connection around
the entire circumference of the plated-through hole.
6.
The top-side solder mask should leave the terminals
of the package and the thermal pad area with its eight
holes exposed. The bottom-side solder mask should
cover the holes of the thermal pad area. This masking
prevents solder from being pulled away from the
thermal pad area during the reflow process.
7.
Apply solder paste to the exposed thermal pad area
and all of the IC terminals.
8.
With these preparatory steps in place, the BUF20820
IC is simply placed in position and run through the
solder reflow operation as any standard surfacemount component. This preparation results in a
properly installed part.
The PowerPAD must be connected to the most negative
supply voltage on the device, GNDA and GNDD.
1.
2.
24
Prepare the PCB with a top-side etch pattern. There
should be etching for the leads as well as etch for the
thermal pad.
Place recommended holes in the area of the thermal
pad. Ideal thermal land size and thermal via patterns
(2x5) for the HTSSOP-38 DCP package can be seen
in the technical brief, PowerPAD Thermally-Enhanced Package (SLMA002), available for download
at www.ti.com. These holes should be 13 mils in diameter. Keep them small, so that solder wicking through
the holes is not a problem during reflow.
"#$%&$%
www.ti.com
SBOS330C − DECEMBER 2005 − REVISED OCTOBER 2006
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
The thermal pad is electrically isolated from all terminals in the package.
Figure 22. Views of Thermally-Enhanced DCP Package
ǒ
T MAX * T A
PD +
q JA
Ǔ
(3)
Where:
PD = maximum power dissipation (W)
TMAX = absolute maximum junction temperature (125°C)
TA = free-ambient air temperature (°C)
qJA = qJC + qCA
qJC = thermal coefficient from junction-to-case (°C/W)
qCA = thermal coefficient from case-to-ambient air (°C/W)
6
Maximum Power Dissipation (W)
For a given qJA, the maximum power dissipation is shown
in Figure 23, and is calculated by Equation 3:
5
4
3
2
1
0
−40
−20
0
20
40
60
80
100
TA, Free−Air Temperature (_C)
Figure 23. Maximum Power Dissipation vs
Free-Air Temperature
(with PowerPAD soldered down)
25
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
BUF20820AIDCPR
ACTIVE
HTSSOP
DCP
38
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR
BUF20820AIDCPRE4
ACTIVE
HTSSOP
DCP
38
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
BUF20820AIDCPR
17-May-2007
Package Pins
DCP
38
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
TAI
330
16
6.9
10.2
1.8
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
BUF20820AIDCPR
DCP
38
TAI
346.0
346.0
33.0
Pack Materials-Page 2
W
Pin1
(mm) Quadrant
16
PKGORN
T1TR-MS
P
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated