CM1220 4 and 8-Channel ESD Protection Arrays in CSP Features Product Description • • • California Micro Devices' CM1220 ESD protection arrays are available in four and eight channel configurations. Each ESD channel features a nominal capacitance of 14pF making these devices ideal for protecting high speed I/O ports and LCD and camera data lines without significantly affecting signal integrity. The CM1220 integrates avalanche-type ESD diodes on every channel, providing a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protect for contact discharges at greater than ±30kV. • • • • • 4 and 8 channels of ESD protection OptiGuard™ coated for improved reliability ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5 bump, 0.960mm X 1.330mm CSP footprint for CM1220-04 10 bump, 1.960mm X 1.330mm CSP footprint for CM1220-08 Lead-free version available Applications • • • • • • LCD and camera datalines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. Keypads and buttons Wireless handsets Handheld PCs/PDAs LCD and camera modules These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1220 is ideal for protecting high speed I/O ports and data and control lines for the LCD display and camera interface in mobile handsets. These devices incorporate CMD’s OptiGuard™ coating for improved reliability at assembly. The CM1220 is available in a space-saving, low-profile Chip Scale Packages with optional lead-free finishing. Electrical Schematic ESD_1 ESD_2 ESD_3 ESD_4 ESD_5 ESD_6 ESD_7 ESD_8 ESD_1 ESD_2 ESD_3 ESD_4 C1 C3 A1 A3 A1 A3 A5 A7 C1 C3 C5 C7 B2, B6 B2 GND GND CM1220-08 CM1220-04 © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1220 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 A J B C1 B2 C Orientation Marking(see note 2) Orientation Marking CM1220-04 1 2 3 5 6 7 A1 A3 C3 C5 A1 5 Bump CSP Package with OptiGuard™ A C1 L208 B C3 B2 CM1220-08 C Orientation Marking A1 C7 B6 A3 A5 A7 A1 10 Bump CSP Package with OptiGuard™ Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS CM1220-08 CM1220-04 CM1220-08 PINS NAME PINS NAME A1 ESD1 A1 ESD1 A3 ESD2 A3 A5 ESD3 A7 B2 DESCRIPTION CM1220-04 PINS NAME PINS NAME DESCRIPTION ESD Channel C1 ESD5 C1 ESD3 ESD Channel ESD2 ESD Channel C3 ESD6 C3 ESD4 ESD Channel − − ESD Channel C5 ESD7 − − ESD Channel ESD4 − − ESD Channel C7 ESD8 − − ESD Channel GND B2 GND Device Ground B6 GND − − Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 5 CSP CM1220-04CS J CM1220-04CP J 10 CSP CM1220-08CS L208 CM1220-08CP L208 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06 CM1220 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 11 14 17 pF CDIODE Diode (Channel) Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC VDIODE Diode Standoff Voltage IDIODE = 10μA 6.0 ILEAK Diode Leakage Current VIN = +3.3V (reverse bias voltage) 0.1 1 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp IDIODE = 10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Note 2 RDYN Dynamic Resistance Positive Negative 5.6 -1.5 V ±30 ±15 kV kV Ω Ω 2.3 0.9 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Unused pins are left open. These parameters are guaranteed by design and characterization. Performance Information Capacitance (Normalized) Diode Characteristics (nominal conditions unless specified otherwise) DC Voltage Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC) © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1220 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 2. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 3. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 4. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06 CM1220 Mechanical Details The CM1220 is supplied in custom Chip Scale Packages (CSP) depending on the channel count. Dimensions for these packages are presented in the following pages. Mechanical Package Diagrams OptiGuard™ Coated CSP CM1220-04CS/CP Mechanical Specifications BOTTOM VIEW Mechanical dimensions for the CM1220-04CS/CP are presented below. C1 B4 B3 B2 B1 PACKAGE DIMENSIONS Custom CSP C Bumps 5 B Millimeters Min Nom Max Inches Min Nom A Max 1 2 3 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 C2 A1 # per tape and reel A2 Package Dim OptiGuardTM Coating A1 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions for CM1220-04CS/CP Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1220-04 1.33 X 0.96 X 0.644 1.42 X 1.07 X 0.740 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 5. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 02/03/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1220 Mechanical Details (cont’d) CM1220-08CS/CP Mechanical Specifications Mechanical dimensions for the CM1220-08CS/CP are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS OptiGuard™ Coated CSP Package Custom CSP BOTTOM VIEW Bumps 10 A1 Millimeters Min Nom Inches Max Min Nom C1 B2 B1 Max B4 B3 Dim C A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 A B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel A2 1.915 1.960 2.005 0.0754 0.0772 0.0789 123 56 7 C2 A1 0.091 OptiGuardTM Coating D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 0.0110 SIDE VIEW DIMENSIONS IN MILLIMETERS 3500 pieces Package dimensions for CM1220-08CS/CP Chip Scale Package Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1220-08 1.96 X 1.33 X 0.644 2.08 X 1.45 X 0.740 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 02/03/06