CM1412 2 Channel Headset Microphone EMI Filter with ESD Protection Features Product Description • The CM1412 is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a microphone element. They also support AC signals, enabling audio signals to pass through without distortion. • • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI202A OptiGuard™ coated for improved reliability at assembly Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports AC signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • In addition, the CM1412 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1412 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1412 incorporates OptiGuard™ coating which results in improved reliability at assembly and is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. EMI filtering and ESD protection for headset microphone ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Electrical Schematic MIC_IN1 68Ω A1 47pF MIC_IN2 MIC_OUT1 47pF 68Ω A3 47pF GND C1 C3 MIC_OUT2 47pF B2 © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 1 CM1412 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 A MIC_OUT2 C1 C3 GND CB B MIC_OUT1 B2 Orientation Marking C MIC_IN1 MIC_IN2 A1 A3 A1 CM1412 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME A1 MIC_IN1 Microphone Input 1 (from microphone) DESCRIPTION A3 MIC_IN2 Microphone Input 2 (from microphone) B2 GND C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C3 MIC_OUT2 Microphone Output 2 (to audio circuitry) Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 5 CSP CM1412-03CS CB CM1412-03CP CB Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05 CM1412 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 200 mW RATING UNITS -40 to +85 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance 61 68 75 Ω C1 Capacitance 38 47 56 pF 1.0 μA 15 -5 V V ILEAK Diode Leakage Current VIN=5.0V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 68Ω, C = 47pF VCL fC 5 -15 7 -10 ±15 kV ±8 kV +15 -19 V V 60 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Note 5: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 3 CM1412 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05 CM1412 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste 240°C Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. 11/03/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 5 CM1412 Mechanical Details CSP Mechanical Specifications Mechanical Package Diagrams CM1412 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW Bumps 5 Millimeters Min Nom Max C B A Inches Min Nom Max 1 2 3 0.885 0.930 0.975 0.0348 0.0366 0.0384 A2 1.365 1.410 1.455 0.0537 0.0555 0.0573 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.165 0.215 0.265 0.0065 0.0085 0.0104 C2 0.220 0.270 0.320 0.0087 0.0106 0.0126 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 C2 A1 # per tape and reel A2 Dim B4 B3 Custom CSP C1 B2 B1 PACKAGE DIMENSIONS Package OptiGuardTM Coating A1 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CM1412 Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1412 1.41 X 0.95 X 0.644 1.52 X 1.07 X 0.720 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Po Top Cover Tape Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 11/03/05