CM1430 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1430 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor TDFN 0.40mm pitch packages. The CM1430 has component values of 8.5pF-100Ω-8.5pF per channel. The CM1430 has a cut-off frequency of 200MHz and can be used in applications with data rates up to 80Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • Four, six and eight channels of EMI filtering with integrated ESD protection Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 20dB attenuation (typical) at 1 GHz TDFN package with 0.40mm lead pitch: • 4-ch. = 8-lead TDFN • 6-ch. = 12-lead TDFN • 8-ch. = 16-lead TDFN Tiny TDFN package size: • 8-lead: 1.7mm x 1.35mm • 12-lead: 2.5mm x 1.35mm • 16-lead: 3.3mm x 1.35mm Increased robustness against vertical impacts during manufacturing process Lead-free version available These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easyto-use pin assignments. In particular, the CM1430 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules The CM1430 is housed in space-saving, low-profile 8-, 12- and 16-lead TDFN packages with a 0.4mm pitch and is available with lead-free finishing. This new small TDFN package provides up to 42% board space savings vs. the 0.50mm pitch TDFN packages. Electrical Schematic 100Ω FILTER+ESDn* FILTER+ESDn* 8.5pF 8.5pF GND * See Package/Pinout Diagram for expanded pin information. 1 of 4, 6 or 8 EMI/RFI Filter Channels with Integrated ESD Protection © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1430 PACKAGE / PINOUT DIAGRAMS TOP VIEW BOTTOM VIEW (Pins Down View) 8 7 6 5 BOTTOM VIEW 12 11 10 9 8 7 1 2 3 4 5 6 XXXX GND PAD GND XX Pin 1 Marking TOP VIEW (Pins Down View) (Pins Up View) 1 2 3 4 PAD Pin 1 Marking 8 7 6 5 1 2 3 4 1 2 3 4 5 CM1430-04DF/DE 8 Lead TDFN Package TOP VIEW (Pins Down View) (Pins Up View) 1 2 3 4 5 6 7 1 2 3 4 5 8 GND PAD XXXXX Notes: 1) These drawings are not to scale. 12 11 10 9 8 7 6 CM1430-06DF/DE 12 Lead TDFN Package BOTTOM VIEW 16 15 14 13 12 11 10 9 Pin 1 Marking (Pins Up View) 6 7 8 16 15 14 13 12 11 10 9 CM1430-08DF/DE 16 Lead TDFN Package PIN DESCRIPTIONS DEVICE PIN(s) DEVICE PIN(s) -04 -06 -08 NAME 1 1 1 FILTER1 2 2 2 FILTER2 3 3 3 4 4 4 5 6 GND PAD -04 -06 -08 NAME Filter + ESD Channel 1 8 12 16 FILTER1 Filter + ESD Channel 1 Filter + ESD Channel 2 7 11 15 FILTER2 Filter + ESD Channel 2 FILTER3 Filter + ESD Channel 3 6 10 14 FILTER3 Filter + ESD Channel 3 FILTER4 Filter + ESD Channel 4 5 9 13 FILTER4 Filter + ESD Channel 4 5 FILTER5 Filter + ESD Channel 5 8 12 FILTER5 Filter + ESD Channel 5 6 FILTER6 Filter + ESD Channel 6 7 11 FILTER6 Filter + ESD Channel 6 7 FILTER7 Filter + ESD Channel 7 10 FILTER7 Filter + ESD Channel 7 8 FILTER8 Filter + ESD Channel 8 9 FILTER8 Filter + ESD Channel 8 GND DESCRIPTION DESCRIPTION Device Ground Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish Pins Package Ordering Part Number1 Ordering Part Number1 8 TDFN-8 CM1430-04DF VF CM1430-04DE VE 12 TDFN-12 CM1430-06DF N30F CM1430-06DE N30E 16 TDFN-16 CM1430-08DF N308F CM1430-08DE N308E Part Marking Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R PARAMETER CONDITIONS Resistance MIN TYP MAX UNITS 80 100 120 Ω Total Channel Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 14 17 22 pF C Capacitance C1 At 2.5VDC Reverse Bias, 1MHz, 30mVAC 7 8.5 11 pF VDIODE Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V 0.1 1.0 μA VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 RDYN Dynamic Resistance Positive Negative CTOTAL fC Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V Notes 2 and 3 ±30 kV ±15 kV Channel R = 100Ω, Channel C = 8.5pF 2.3 0.9 Ω Ω 200 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1430 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (FILTER1 Input to GND) Figure 2. Insertion Loss vs. Frequency (FILTER2 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (FILTER3 Input to GND) Figure 4. Insertion Loss vs. Frequency (FILTER4 Input to GND) © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1430 Performance Information (cont’d) Capacitance (Normalized) Typical Diode Capacitance vs. Input Voltage DC Voltage Figure 5. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Mechanical Details CM1430-04DF/DE Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1430-04DF/DE suplied in a 8lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information document. D 8 7 6 5 E Pin 1 Marking PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C✝ Leads 8 Dim. 1 2 3 4 TOP VIEW Millimeters Inches 0.10 C Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 A3 0.20 REF b 0.15 0.20 0.25 0.006 0.008 0.010 1.60 1.70 1.80 0.063 0.067 0.071 D2 1.10 1.20 1.30 0.043 0.047 0.051 E 1.25 1.35 1.45 0.049 0.053 0.057 E2 0.30 0.40 0.50 0.012 0.016 0.020 0.40 BSC K 0.20 L 0.15 # per tape and reel A1 0.008 REF D e 0.08 C A 8X 0.10 M CAB Pin 1 Locator 1 0.016 BSC 0.35 0.006 0.010 b e 2 3 C0.2 GND PAD 7 6 0.008 0.25 A3 SIDE VIEW 0.014 K 3000 pieces 8 E2 4 5 D2 L BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 8-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1430 Mechanical Details (cont’d) CM1430-06DF/DE Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1430-06DF/DE suplied in a 12lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-12, see the California Micro Devices TDFN Package Information document. D 12 11 10 9 8 7 E Pin 1 Marking PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C✝ Leads 12 1 2 3 4 5 6 TOP VIEW Millimeters Dim. Inches 0.10 C Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 A3 0.20 REF b 0.15 0.20 0.25 0.006 0.008 0.010 2.40 2.50 2.60 0.094 0.098 0.102 D2 1.90 2.00 2.10 0.075 0.079 0.083 E 1.25 1.35 1.45 0.049 0.053 0.057 E2 0.30 0.40 0.50 0.012 0.016 0.020 0.40 BSC K 0.20 L 0.15 # per tape and reel A1 0.008 REF D e 0.08 C A 8X Pin 1 Locator 0.016 BSC 0.35 0.006 0.010 0.10 e 0.008 0.25 A3 SIDE VIEW K 0.014 1 M CAB 4 b 2 3 C0.1 GND PAD 12 11 10 5 9 8 E2 6 7 D2 3000 pieces L BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 12-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/02/06 CM1430 Mechanical Details (cont’d) CM1430-08DF/DE Mechanical Specifications Mechanical Package Diagrams Dimensions for the CM1430-08DF/DE supplied in a 16-lead, 0.4mm pitch TDFN package are presented below. For complete information on the TDFN-16, see the California Micro Devices TDFN Package Information document. D 16 15 14 13 12 11 10 9 E Pin 1 Marking PACKAGE DIMENSIONS Package TDFN JEDEC No. MO-229C✝ Leads 16 Dim. 1 2 3 4 5 6 7 8 TOP VIEW Millimeters Inches 0.10 C Min Nom Max Min Nom Max A 0.70 0.75 0.80 0.028 0.030 0.031 A1 0.00 0.02 0.05 0.000 0.001 0.002 A3 0.200 REF b 0.15 0.20 0.25 0.006 0.008 0.010 3.20 3.30 3.40 0.126 0.130 0.134 D2 2.70 2.80 2.90 0.106 0.110 0.114 E 1.25 1.35 1.45 0.049 0.053 0.057 E2 0.30 0.40 0.50 0.012 0.016 0.020 0.40 BSC K 0.20 L 0.15 # per tape and reel 0.35 0.006 0.010 0.014 A3 SIDE VIEW A 8X 0.10 e Pin 1 Locator 1 2 3 K M CAB 4 5 b 7 8 16 15 14 13 12 11 10 9 C0.2 0.016 BSC 0.008 0.25 A1 0.008 REF D e 0.08 C 6 E2 GND PAD D2 3000 pieces L BOTTOM VIEW Controlling dimension: millimeters ✝ This package is compliant with JEDEC standard MO-229C with the exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as called out in the table above. Dimensions for 16-Lead, 0.4mm pitch TDFN package © 2006 California Micro Devices Corp. All rights reserved. 03/02/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9