PRELIMINARY CSPEMI606/608 LCD EMI Filter Array with ESD Protection Features Product Description • • CAMD's CSPEMI606 and CSPEMI608 are EMI filter arrays with ESD protection, which integrate six and eight Pi- filters (C-R-C), respectively. The CSPEMI60x has component values of 15pF-100Ω-15pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • Six and eight channels of EMI filtering +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Better than 30dB of attenuation at 1GHz to 3GHz 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CSPEMI606) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CSPEMI608) Lead-free version available Applications • • • • • • LCD data lines in clamshell wireless handsets EMI filtering & ESD protection for high-speed I/O data ports Wireless handsets / cell phones Notebook computers PDAs / Handheld PCs EMI filtering for high-speed data lines This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CSPEMI60x is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CSPEMI606 and CSPEMI608 are available in space-saving, low-profile chip-scale packages with optional lead-free finishing. Electrical Schematic 100Ω FILTERn* FILTERn* 15pF 15pF GND (Pins B1-Bn) 1 of n EMI Filtering + ESD Channels (n=6 for CSPEMI606, 8 for CSPEMI608) * See Package/Pinout Diagram for expanded pin information. © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 PRELIMINARY CSPEMI606/608 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW TOP VIEW (Bumps Up View) (Bumps Down View) Orientation Marking (see note 2) 1 2 3 4 5 6 A 606 B FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 C1 C2 C3 C4 C5 C6 GND GND B1 Orientation Marking C GND B2 B3 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A2 A3 A4 A5 A6 A1 CSPEMI606 CSP Package Orientation Marking (see note 2) 1 2 3 4 5 6 7 8 A EMI608 B FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 C1 C2 C3 C4 C5 C6 C7 C8 GND GND B1 Orientation Marking C GND B2 GND B3 B4 FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 FILTER7 FILTER8 A1 A2 A3 A4 A5 A6 A7 A8 A1 Notes: CSPEMI608 CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS CSPEMI606 CSPEMI608 NAME DESCRIPTION CSPEMI606 CSPEMI608 NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Ordering Part Bumps Package Number1 Part Marking Number1 Part Marking 15 CSP CSPEMI606 606 CSPEMI606G 606 20 CSP CSPEMI608 EMI608 CSPEMI608G EMI608 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 PRELIMINARY CSPEMI606/608 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER MIN TYP MAX UNITS 80 100 120 Ω At 2.5V DC, 1MHz, 30mV AC 12 15 18 pF Diode Standoff Voltage IDIODE=10µA 5.5 ILEAK Diode Leakage Current (reverse bias) VDIODE=+3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=15pF R Resistance C Capacitance VDIODE VESD VCL fC CONDITIONS 5.6 -0.4 V 6.8 -0.8 100 nA 9.0 -1.5 V V ±30 kV ±15 kV +12 -7 V V 120 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 PRELIMINARY CSPEMI606/608 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1) © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 PRELIMINARY CSPEMI606/608 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2) © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 PRELIMINARY CSPEMI606/608 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B3) © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 PRELIMINARY CSPEMI606/608 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss VS. Frequency (A7-C7 to GND B4, CSPEMI608 Only) Figure 8. Insertion Loss VS. Frequency (A8-C8 to GND B4, CSPEMI608 Only) © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 PRELIMINARY CSPEMI606/608 Performance Information (cont’d) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2003 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 PRELIMINARY CSPEMI606/608 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 10. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 11. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 12. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 9 PRELIMINARY CSPEMI606/608 Mechanical Details CSPEMI606/608 devices are packaged in a custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. Mechanical Package Diagrams CSPEMI606 Mechanical Specifications BOTTOM VIEW The package dimensions for the CSPEMI606 are presented below. A1 C1 SIDE VIEW B2 B4 B3 B1 C Custom CSP Bumps 15 Dim Millimeters B A 1 Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel Min Nom A2 Package C2 PACKAGE DIMENSIONS Max 2 3 4 5 6 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI606 Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2003 California Micro Devices Corp. All rights reserved. 10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 PRELIMINARY CSPEMI606/608 Mechanical Details (cont’d) CSPEMI608 Mechanical Specifications Mechanical Package Diagrams The package dimensions for the CSPEMI608 are presented below. BOTTOM VIEW A1 C1 SIDE VIEW B2 B4 B3 B1 C PACKAGE DIMENSIONS Bumps 20 Dim Millimeters A Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel Min A 1 Inches Nom Max A2 Custom CSP C2 B Package 2 3 4 5 6 7 8 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI608 Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 11 PRELIMINARY CSPEMI606/608 Mechanical Details (cont’d) CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CSPEMI606 2.96 X 1.33 X 0.6 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm CSPEMI608 4.00 X 1.46 X 0.6 4.11 X 1.57 X 0.76 8mm 178mm (7") 3500 4mm 4mm TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 13. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 12 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03